公开(公告)号：US06404640B1

公开(公告)日：2002-06-11

申请号：US09235498

申请日：1999-01-22

申请人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wie ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

发明人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wie ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

公开(公告)号：US06621707B2

公开(公告)日：2003-09-16

申请号：US09968041

申请日：2001-10-02

申请人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

发明人： Junichi Ishimine ,  Masahiro Suzuki ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

公开(公告)号：US5763950A

公开(公告)日：1998-06-09

申请号：US598331

申请日：1996-02-08

申请人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

发明人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L29/06 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068

摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。