公开(公告)号：US20170263682A1

公开(公告)日：2017-09-14

申请号：US15227493

申请日：2016-08-03

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Masanori KOMURA ,  Takeshi TAKAGI

IPC分类号： H01L27/24 ,  H01L45/00 ,  H01L23/528

CPC分类号： H01L27/249 ,  H01L23/528 ,  H01L27/2418 ,  H01L45/04 ,  H01L45/08 ,  H01L45/12 ,  H01L45/1226 ,  H01L45/1233 ,  H01L45/146

摘要： A semiconductor memory device according to an embodiment comprises: a semiconductor substrate which extends in first and second directions; first wiring lines which are arranged in a third direction, and which extend in the first direction; second wiring lines which are arranged in the first direction and extend in the third direction; and memory cells disposed at intersections of the first wiring lines and the second wiring lines, one of the memory cells including a first film and a second film whose permittivity is different from that of the first film which are stacked in the second direction between one of the first wiring lines and one of the second wiring lines, and the second films of two of the memory cells adjacent in the third direction being separated between the two memory cells.

公开(公告)号：US20170256588A1

公开(公告)日：2017-09-07

申请号：US15074338

申请日：2016-03-18

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Natsuki FUKUDA ,  Mutsumi OKAJIMA ,  Atsushi OGA ,  Toshiharu TANAKA ,  Takeshi YAMAGUCHI ,  Takeshi TAKAGI ,  Masanori KOMURA

IPC分类号： H01L27/24 ,  H01L21/3213 ,  H01L21/311 ,  H01L21/768

CPC分类号： H01L27/2481 ,  H01L21/311 ,  H01L21/3213 ,  H01L21/76805 ,  H01L21/76816 ,  H01L21/8221 ,  H01L23/5226 ,  H01L23/5329 ,  H01L27/0688 ,  H01L27/101 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582 ,  H01L27/2454 ,  H01L27/249 ,  H01L29/7926

摘要： A semiconductor device according to an embodiment includes: a stacked body including a plurality of first conductive films stacked via an inter-layer insulating film; a first conductive body facing the stacked body to extend in a stacking direction; and a plurality of first insulating films in the same layers as the first conductive films and disposed between the first conductive body and the first conductive films, the first conductive body including a projecting part that projects along tops of one of the first insulating films and one of the first conductive films, and a lower surface of the projecting part contacting an upper surface of the one of the first conductive films.