Abstract:
An optical coupling device includes a mounting member, a light receiving element, a first resin layer, a light emitting element, and a second resin layer. The mounting member includes an insulating layer having a recess in an upper surface thereof, input terminals, and output terminals insulated from the input terminals. The light receiving element is provided on a bottom surface of the recess. The first resin layer is provided in the recess and covers the light receiving element. The light emitting element is adhered to an upper surface of the first resin layer such that a lower surface of the light emitting element has a light emitting surface facing the light receiving surface, and is connected to the input terminals. The second resin layer covers the light emitting element, an upper surface of the insulating layer, the first resin layer, and the input terminals.
Abstract:
A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.
Abstract:
A photorelay includes an insulation board, input and output terminals, a die pad portion, a light receiving element, a light emitting element, a MOSFET, and a first sealing resin layer. The insulation board has first and second surfaces. The input terminal includes a first conductive region. The output terminal includes a first conductive region. The light receiving element is bonded on the die pad portion. The light emitting element is bonded on an exposed surface of the light receiving element, and connected to the first conductive region of the input terminal. The MOSFET is connected to the first conductive region of the output terminal. A connecting electrode is included as a part of the input or output terminal. Attachment conductive regions included respectively in the input and output terminals are provided on a side surface of the insulation board as the attachment surface of the photorelay to a wiring substrate.