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公开(公告)号:US11424393B2
公开(公告)日:2022-08-23
申请号:US16905977
申请日:2020-06-19
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd.
Inventor: Jing-Qiong Zhang , Ben-Jie Fan , Hung-Chih Yang , Shuen-Ta Teng
Abstract: A light-emitting module and a light-emitting diode are provided. The light-emitting diode includes an epitaxial light-emitting structure to generate a light beam with a broadband blue spectrum. A spectrum waveform of the broadband blue spectrum has a full width at half maximum (FWHM) larger than or equal to 30 nm. The spectrum waveform has a plurality of peak inflection points, and a difference between two wavelength values to which any two adjacent ones of the peak inflection points respectively correspond is less than or equal to 18 nm.
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公开(公告)号:US11923486B2
公开(公告)日:2024-03-05
申请号:US17868995
申请日:2022-07-20
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor: Jing-Qiong Zhang , Ben-Jie Fan , Hung-Chih Yang , Shuen-Ta Teng
CPC classification number: H01L33/504 , H01L33/06 , H01L33/08
Abstract: A light-emitting module and a light-emitting diode are provided. The light-emitting diode includes an epitaxial light-emitting structure to generate a light beam with a broadband blue spectrum. A spectrum waveform of the broadband blue spectrum has a full width at half maximum (FWHM) larger than or equal to 30 nm. The spectrum waveform has a plurality of peak inflection points, and a difference between two wavelength values to which any two adjacent ones of the peak inflection points respectively correspond is less than or equal to 18 nm.
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公开(公告)号:US11587913B2
公开(公告)日:2023-02-21
申请号:US17169632
申请日:2021-02-08
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor: Jing-Qiong Zhang , Tsung-Chieh Lin
IPC: H01L25/075 , H01L33/48 , H01L33/62
Abstract: A light emitting diode package structure is provided. The light emitting diode package structure includes first and second chips. A value of an intensity of a peak wavelength of a first shoulder wave of the first chip divided by an intensity of a peak wavelength of a first main wave of the first chip is defined as a first intensity ratio. A value of an intensity of a peak wavelength of a second shoulder wave of the second chip divided by an intensity of a peak wavelength of a second main wave of the second chip is defined as a second intensity ratio. The first and second chips satisfy “a difference between the intensities of the peak wavelengths of the first and second main waves being less than or equal to 2.5 nanometers” and “a difference between the first and second intensity ratios being greater than 0.1”.
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公开(公告)号:US11063190B2
公开(公告)日:2021-07-13
申请号:US16985478
申请日:2020-08-05
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor: Jing-Qiong Zhang
Abstract: A light-emitting diode package component is provided. The light-emitting diode package component includes a substrate, a light-emitting chip, a die attach adhesive, a reflective structure, and a molding layer. The light-emitting chip is disposed on the substrate for generating an initial light beam with an initial wavelength. The die attach adhesive is disposed between the light-emitting chip and the substrate so that the light-emitting chip is mounted on the substrate. The reflective structure defining an accommodating space is disposed on the substrate and surrounds the light-emitting chip. The molding layer is disposed in the accommodating space and covers the light-emitting chip. The die attach adhesive includes a first wavelength conversion material, a portion of the initial light beam entering into the die attach adhesive excites the first wavelength conversion material to produce an excitation light with a first wavelength that is greater than the initial wavelength.
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公开(公告)号:US11777053B2
公开(公告)日:2023-10-03
申请号:US17590098
申请日:2022-02-01
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor: Ben-Jie Fan , Jing-Qiong Zhang , Yi-Qun Li , Hung-Chih Yang , Tsung-Chieh Lin , Ho-Chien Chen , Shuen-Ta Teng , Cheng-Chang Hsieh
CPC classification number: H01L33/06 , H01L33/14 , H01L33/32 , H01L33/502
Abstract: A light-emitting diode is provided. The light-emitting diode includes a P-type semiconductor layer, a N-type semiconductor layer, and a light-emitting stack located therebetween. The light-emitting stack includes a plurality of well layers and a plurality of barrier layers that are alternately stacked, the well layers includes at least one first well layer, at least one second well layer, and third well layers that have different indium concentrations. The first well layer has the largest indium concentration, and the third well layers have the smallest indium concentration. Three of well layers that are closest to the P-type semiconductor layer are the third well layers, and the first well layer is closer to the N-type semiconductor layer than the P-type semiconductor layer.
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公开(公告)号:US11581293B2
公开(公告)日:2023-02-14
申请号:US17169644
申请日:2021-02-08
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor: Jing-Qiong Zhang , Tsung-Chieh Lin
Abstract: A light emitting device is provided. The light emitting device includes a light emitting assembly having a first light emitting diode package structure and a second light emitting diode package structure. The light emitting assembly can generate a mixed light source having a spectral deviation index. The first light emitting diode package structure can generate a first light source having a first spectral deviation index. The second light emitting diode package structure can generate a second light source having a second spectral deviation index. When the first light source and the second light source are within a range from 460 to 500 nm, a sum of the first spectral deviation index and the second spectral deviation index is within a range from −0.3 to 0.3, and a difference between the first spectral deviation index and the second spectral deviation index is at least greater than 0.2.
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公开(公告)号:US11315908B2
公开(公告)日:2022-04-26
申请号:US16442727
申请日:2019-06-17
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor: Jing-Qiong Zhang , Tsung-Chieh Lin
IPC: H01L25/07 , H01L25/075 , H01L33/50 , H01L33/52 , H01L33/62
Abstract: An LED package structure includes a substrate and a light-emitting array. The substrate has a die bond area, and the light-emitting array is disposed in the die bond area. Each first light-emitting unit of the light-emitting array includes a first light-emitting chip and a first wavelength conversion layer of the light-emitting chip, each second light-emitting unit of the light-emitting array includes a second light-emitting chip and a second wavelength conversion layer covering the second light-emitting chip. A first light beam includes a first emission light generated by exciting the first wavelength conversion layer, and the second light beam includes a second emission light generated by exciting the second wavelength conversion layer, and the difference between the first and second emission light peak wavelengths is at least 30 nm.
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公开(公告)号:US11257980B2
公开(公告)日:2022-02-22
申请号:US16629367
申请日:2019-11-12
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor: Ben-Jie Fan , Jing-Qiong Zhang , Yi-Qun Li , Hung-Chih Yang , Tsung-Chieh Lin , Ho-Chien Chen , Shuen-Ta Teng , Cheng-Chang Hsieh
Abstract: A light-emitting diode is provided. The light-emitting diode includes a multiple quantum well structure to generate a light beam with a broadband blue spectrum. The light beam contains a first sub-light beam with a first wavelength and a second sub-light beam with a second wavelength. A difference between the first wavelength and the second wavelength ranges from 1 nm to 50 nm, and the light-emitting diode has a Wall-Plug-Efficiency (WPE) of greater than 0.45 under an operating current density of 120 mA/mm2.
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