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公开(公告)号：US20230411567A1
公开(公告)日：2023-12-21
申请号：US18356314
申请日：2023-07-21
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd
Inventor： JINGQIONG ZHANG , XIAOLING HUANG
IPC: H01L33/50 , H01L25/075
CPC classification number: H01L33/504 , H01L25/0753
Abstract: A light emitting device is provided. The device includes a red light emitting unit, a blue light emitting unit, a green light emitting unit, and a white light emitting unit. The red light emitting unit includes a first blue light emitting chip and a red fluorescent material, and a dominant wavelength of a light emitted by the red light emitting unit is in a range of 610 nanometers (nm) to 635 nm. By designing the light emitting device into a structure including the red light emitting unit, the blue light emitting unit, the green light emitting unit and the white light emitting unit, and designing the structure of the red light emitting unit, the light emitting device can realize the adjustment of ambient light and color temperature by the four light emitting units, thereby reducing cost.
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公开(公告)号：US11804572B2
公开(公告)日：2023-10-31
申请号：US17139358
申请日：2020-12-31
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd.
Inventor： Tsung-Hong Lu
CPC classification number: H01L33/145 , H01L33/385 , H01L33/62
Abstract: A solid-state light-emitting device includes: a substrate; an epitaxial layer structure on the substrate and including a first-type area and a second-type area; a first current blocking layer disposed on the epitaxial layer structure and located in the first-type area; a current spreading layer covering the first current blocking layer so that the first current blocking layer is located between the current spreading layer and the epitaxial layer structure; a first adhesive reinforcing layer disposed on a side of the current spreading layer away from the first current blocking layer and including a plurality of first through holes; a first electrode disposed on a side of the first adhesion reinforcing layer away from the current spreading layer and filled into the plurality of first through holes to electrically contact with the current spreading layer. Therefore, the light-emitting efficiency of the solid-state light-emitting device is improved.
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公开(公告)号：US10980091B1
公开(公告)日：2021-04-13
申请号：US16878133
申请日：2020-05-19
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd.
Inventor： Xiaolei Zhu , Xiaoming Zhao , Francis Daw Heng Wong
Abstract: A light source device includes: a power supply circuit, having a first voltage terminal and a second voltage terminal; a light source circuit, having a common terminal and multiple branch terminals, the common terminal being electrically connected to the first voltage terminal, the light source circuit including multiple light sources for emitting lights of different colors, first terminals of the light sources being electrically connected to the common terminal, and second terminals of the light sources being electrically connected to the branch terminals respectively; and a light adjusting circuit, including multiple electrical paths and being electrically connected to the second voltage terminal and the branch terminals via the electrical paths so that the light sources are connected in parallel between the first and second voltage terminals. A resistance of at least one of the electrical paths is adjustable to set branch currents respectively flowing through the light sources.
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公开(公告)号：US20210092809A1
公开(公告)日：2021-03-25
申请号：US16878133
申请日：2020-05-19
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd.
Inventor： XIAOLEI ZHU , XIAOMING ZHAO , FRANCIS DAW HENG WONG
Abstract: A light source device includes: a power supply circuit, having a first voltage terminal and a second voltage terminal; a light source circuit, having a common terminal and multiple branch terminals, the common terminal being electrically connected to the first voltage terminal, the light source circuit including multiple light sources for emitting lights of different colors, first terminals of the light sources being electrically connected to the common terminal, and second terminals of the light sources being electrically connected to the branch terminals respectively; and a light adjusting circuit, including multiple electrical paths and being electrically connected to the second voltage terminal and the branch terminals via the electrical paths so that the light sources are connected in parallel between the first and second voltage terminals. A resistance of at least one of the electrical paths is adjustable to set branch currents respectively flowing through the light sources.
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公开(公告)号：US20210054972A1
公开(公告)日：2021-02-25
申请号：US17091938
申请日：2020-11-06
Applicant: EPISTAR CORPORATION , KAISTAR LIGHTING (XIAMEN) CO., LTD.
Inventor： Hong-Zhi LIU , Yi-Ting KUO , Tzu-Chi CHENG
Abstract: Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.
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Patent Agency Ranking
公开(公告)号：US20210005792A1
公开(公告)日：2021-01-07
申请号：US16911847
申请日：2020-06-25
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd.
Inventor： KUNBIN LIN , SHAOFENG ZHANG
Abstract: An optoelectronic device and a manufacturing method thereof are provided. The optoelectronic device includes a transparent substrate, an optoelectronic chip, electrodes and a wavelength conversion layer. The transparent substrate is provided with a hollow structure and an installation area, the hollow structure penetrates through two opposite surfaces of the transparent substrate and is located at a periphery of the installation area. The optoelectronic chip is arranged in the installation area. The electrodes are arranged on the transparent substrate and electrically connected to the optoelectronic chip; and the wavelength conversion layer is arranged on the two opposite surfaces of the transparent substrate and filled in the hollow structure, wherein the optoelectronic chip is covered by the wavelength conversion layer. The effect of reducing leakage rate of blue light of an optoelectronic device such as a LED packaging structure can be achieved.
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公开(公告)号：US20190319016A1
公开(公告)日：2019-10-17
申请号：US16442727
申请日：2019-06-17
Applicant: KAISTAR Lighting(Xiamen) Co., Ltd.
Inventor： JING-QIONG ZHANG , TSUNG-CHIEH LIN
IPC: H01L25/075 , H01L33/62 , H01L33/50 , H01L33/52
Abstract: An LED package structure includes a substrate and a light-emitting array. The substrate has a die bond area, and the light-emitting array is disposed in the die bond area. Each first light-emitting unit of the light-emitting array includes a first light-emitting chip and a first wavelength conversion layer of the light-emitting chip, each second light-emitting unit of the light-emitting array includes a second light-emitting chip and a second wavelength conversion layer covering the second light-emitting chip. A first light beam includes a first emission light generated by exciting the first wavelength conversion layer, and the second light beam includes a second emission light generated by exciting the second wavelength conversion layer, and the difference between the first and second emission light peak wavelengths is at least 30 nm.
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公开(公告)号：US20190296198A1
公开(公告)日：2019-09-26
申请号：US16436472
申请日：2019-06-10
Applicant: EPISTAR CORPORATION , Kaistar Lighting (Xiamen) Co., Ltd
Inventor： TZER-PERNG CHEN , TZU-CHI CHENG
Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
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公开(公告)号：US10264636B2
公开(公告)日：2019-04-16
申请号：US16053664
申请日：2018-08-02
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd.
Inventor： Jinfu Wen
Abstract: A light source and a light emitting module thereof are provided. The light source drives and controls the light emitting module containing numerous light emitters by linear constant current drivers and a switch, and all the light emitters can be turned on or turned off simultaneously by utilizing a manner of full-balance series-parallel conversion, which result in the superior light uniformity and even the low flicker requirement can be met.
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公开(公告)号：US20180062048A1
公开(公告)日：2018-03-01
申请号：US15617359
申请日：2017-06-08
Applicant: KAISTAR Lighting (Xiamen) Co., Ltd
Inventor： Guoheng Qin , Steve Meng-Yuan Hong
CPC classification number: H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641
Abstract: A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in pairs, an insulating protective layer (e.g., low-temperature glass glaze layer) disposed on a same side of the ceramic base as the conductive wire layer and exposing the pads, and a metallic reflective layer (e.g., aluminum layer) disposed on a side of the insulating protective layer facing away from the ceramic base and exposing the pads. Moreover, a LED package structure adopting the LED flip-chip package substrate and other LED package structures with similar material layers such as a chip-level packaged LED package structure are provided. By comprehensively utilizing advantages of various materials, the LED flip-chip package substrate with high heat conductivity, high reflectivity, high stability and superior insulation and the LED package structure with high reliability and even high light extraction efficiency are obtained.
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