公开(公告)号：US20210047481A1

公开(公告)日：2021-02-18

申请号：US17079388

申请日：2020-10-23

Applicant: KANEKA CORPORATION

Inventor： Soichi Uchida ,  Kazunori Saegusa ,  Mitsutaka Sato

IPC: C08J3/22 ,  C08J9/00 ,  C08J9/228 ,  C08L69/00 ,  C08L101/00 ,  B29C45/00 ,  B29C45/14

Abstract: A masterbatch (C) containing thermally expandable microcapsules (A) and a carrier resin composition (B) is provided. The carrier resin composition (B) contains a carrier resin (B1) and a plasticizer (B2), the carrier resin (B1) being an acrylic resin having a weight average molecular weight of 8,000 or more and 350,000 or less, and the plasticizer (B2) being an acrylic plasticizer having a weight average molecular weight of 1,000 or more and 20,000 or less. The carrier resin composition (B) is substantially compatible with a polycarbonate resin and has a shear viscosity of 1.0 Pa·s or more and 1.5×106 Pa·s or less at 80° C. The occurrence of whitening is suppressed and a good appearance can be obtained in an injection molded foam made with the masterbatch. A polycarbonate resin composition, an injection molded foam, and a method for producing an injection molded foam are provided.

公开(公告)号：US20190031851A1

公开(公告)日：2019-01-31

申请号：US16148185

申请日：2018-10-01

Applicant: KANEKA CORPORATION

Inventor： Soichi Uchida

IPC: C08J9/00 ,  C08L69/00 ,  C08J9/228 ,  C08J9/12 ,  C08J9/08 ,  B29C44/42

Abstract: A foam injection molded article includes a resin composition, wherein the resin composition includes: (A) a polycarbonate resin, (B) a thermoplastic polyester resin, (C) a polyester-polyether copolymer, and (D) a foaming agent. The article has an arithmetic average roughness (Ra) that is greater than 0.1 μm and less than 9 μm, a maximum height (Ry) that is greater than 1 μm and less than 90 μm; and a 10-point average roughness (Rz) that is greater than 1 μm and less than 70 μm.

公开(公告)号：US20160152823A1

公开(公告)日：2016-06-02

申请号：US14900446

申请日：2014-07-01

Applicant: KANEKA CORPORATION

Inventor： Asato Nonomura ,  Soichi Uchida ,  Yasushi Noda

IPC: C08L67/02 ,  B29C45/14 ,  C09K5/14

CPC classification number: C08L67/02 ,  B29C45/0001 ,  B29C45/0005 ,  B29C45/0013 ,  B29C45/14 ,  B29C45/14811 ,  B29K2067/003 ,  B29L2031/18 ,  C08K3/013 ,  C08K3/016 ,  C08K3/34 ,  C08K3/38 ,  C08K7/14 ,  C08L67/025 ,  C09K5/14 ,  H01L23/3737

Abstract: A highly thermally conductive thermoplastic resin composition of the present invention contains: (A) a thermoplastic polyester resin having a weight average molecular weight of 50,000 to 200,000; (B) a polyalkylene terephthalate block copolymer composed of a polyether segment and a polyethylene terephthalate segment which includes an ethylene terephthalate unit as a main component; and (C) a highly thermally conductive inorganic compound, the highly thermally conductive thermoplastic resin composition containing, with respect to 100 parts by weight of (A) the thermoplastic polyester resin, 20 parts by weight to 200 parts by weight of (B) the polyalkylene terephthalate block copolymer and 20 parts by weight to 250 parts by weight of (C) the highly thermally conductive inorganic compound.

Abstract translation: 本发明的高导热性热塑性树脂组合物含有：（A）重均分子量为50,000〜200,000的热塑性聚酯树脂; （B）由聚对苯二甲酸乙二醇酯单元作为主要成分的聚醚部分和聚对苯二甲酸乙二醇酯部分构成的聚对苯二甲酸亚烷基二醇酯嵌段共聚物; 和（C）高导热性无机化合物，高导热性热塑性树脂组合物相对于100重量份的（A）热塑性聚酯树脂，含有20重量份〜200重量份的（B） 聚对苯二甲酸亚烷基酯嵌段共聚物和20重量份至250重量份的（C）高导热性无机化合物。

公开(公告)号：US10222051B2

公开(公告)日：2019-03-05

申请号：US15446457

申请日：2017-03-01

Applicant: Kaneka Corporation

Inventor： Toshiaki Ezaki ,  Soichi Uchida ,  Kazuaki Matsumoto

IPC: C08K3/04 ,  C08K7/00 ,  C09K5/14 ,  C08L67/00 ,  C08L67/02 ,  F21S45/47 ,  F21V29/76 ,  F21V29/87 ,  H01L33/64 ,  F21Y115/10 ,  H01L23/367 ,  H01L23/373

Abstract: An LED heat sink for vehicles includes an injection molded product of a thermally conductive resin composition. The thermally conductive resin composition includes 50 to 90 weight % of a thermoplastic polyester resin having a number average molecular weight of 12,000 to 70,000, and 10 to 50 weight % of a flaked graphite having a fixed carbon content of at least 98 mass %, and an aspect ratio of at least 21, and the thermally conductive resin composition has a specific gravity of 1.4 to 1.7, and an in-plane thermal conductivity of at least 1 W/(m·K).

公开(公告)号：US11898016B2

公开(公告)日：2024-02-13

申请号：US17079388

申请日：2020-10-23

Applicant: KANEKA CORPORATION

Inventor： Soichi Uchida ,  Kazunori Saegusa ,  Mitsutaka Sato

IPC: C08J3/22 ,  B29C45/00 ,  B29C45/14 ,  C08J9/00 ,  C08J9/228 ,  C08L69/00 ,  C08L101/00

CPC classification number: C08J3/22 ,  B29C45/0001 ,  B29C45/14795 ,  C08J9/0061 ,  C08J9/228 ,  C08L69/00 ,  C08L101/00 ,  C08J2203/22 ,  C08J2333/08 ,  C08J2333/10 ,  C08J2369/00 ,  C08L2203/14 ,  C08L2205/03 ,  C08L2207/53

Abstract: A masterbatch (C) containing thermally expandable microcapsules (A) and a carrier resin composition (B) is provided. The carrier resin composition (B) contains a carrier resin (B1) and a plasticizer (B2), the carrier resin (B1) being an acrylic resin having a weight average molecular weight of 8,000 or more and 350,000 or less, and the plasticizer (B2) being an acrylic plasticizer having a weight average molecular weight of 1,000 or more and 20,000 or less. The carrier resin composition (B) is substantially compatible with a polycarbonate resin and has a shear viscosity of 1.0 Pa·s or more and 1.5×106 Pa·s or less at 80° C. The occurrence of whitening is suppressed and a good appearance can be obtained in an injection molded foam made with the masterbatch. A polycarbonate resin composition, an injection molded foam, and a method for producing an injection molded foam are provided.

公开(公告)号：US10030138B2

公开(公告)日：2018-07-24

申请号：US14900446

申请日：2014-07-01

Applicant: Kaneka Corporation

Inventor： Asato Nonomura ,  Soichi Uchida ,  Yasushi Noda

IPC: C08L67/02 ,  B29C45/00 ,  B29C45/14 ,  C08K3/34 ,  C08K3/38 ,  C09K5/14 ,  B29K67/00 ,  B29L31/18

Abstract: A highly thermally conductive thermoplastic resin composition of the present invention contains: (A) a thermoplastic polyester resin having a weight average molecular weight of 50,000 to 200,000; (B) a polyalkylene terephthalate block copolymer composed of a polyether segment and a polyethylene terephthalate segment which includes an ethylene terephthalate unit as a main component; and (C) a highly thermally conductive inorganic compound, the highly thermally conductive thermoplastic resin composition containing, with respect to 100 parts by weight of (A) the thermoplastic polyester resin, 20 parts by weight to 200 parts by weight of (B) the polyalkylene terephthalate block copolymer and 20 parts by weight to 250 parts by weight of (C) the highly thermally conductive inorganic compound.

公开(公告)号：US20170167716A1

公开(公告)日：2017-06-15

申请号：US15446457

申请日：2017-03-01

Applicant: Kaneka Corporation

Inventor： Toshiaki Ezaki ,  Soichi Uchida ,  Kazuaki Matsumoto

IPC: F21V29/87 ,  F21S8/10 ,  F21V29/76 ,  C08L67/02

CPC classification number: F21V29/87 ,  C08K3/04 ,  C08K7/00 ,  C08K2201/016 ,  C08L67/02 ,  C08L67/025 ,  C08L2203/20 ,  C09K5/14 ,  F21S45/47 ,  F21V29/763 ,  F21Y2115/10 ,  H01L23/367 ,  H01L23/3737 ,  H01L33/641 ,  C08L67/00

Abstract: An LED heat sink for vehicles includes an injection molded product of a thermally conductive resin composition. The thermally conductive resin composition includes 50 to 90 weight % of a thermoplastic polyester resin having a number average molecular weight of 12,000 to 70,000, and 10 to 50 weight % of a flaked graphite having a fixed carbon content of at least 98 mass %, and an aspect ratio of at least 21, and the thermally conductive resin composition has a specific gravity of 1.4 to 1.7, and an in-plane thermal conductivity of at least 1 W/(m·K).