公开(公告)号：US09809735B2

公开(公告)日：2017-11-07

申请号：US15101270

申请日：2014-11-13

Applicant: Kaneka Corporation

Inventor： Shusuke Yoshihara ,  Syoji Ubukata ,  Kazuaki Matsumoto

IPC: C08G64/00 ,  C09K5/14 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08G63/185 ,  C08G63/193 ,  C08G63/78 ,  C08J5/18 ,  C08K7/18 ,  C08G63/02

CPC classification number: C09K5/14 ,  C08G63/185 ,  C08G63/193 ,  C08G63/78 ,  C08J5/18 ,  C08J2367/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08L67/02

Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

公开(公告)号：US20160304762A1

公开(公告)日：2016-10-20

申请号：US15101270

申请日：2014-11-13

Applicant: KANEKA CORPORATION

Inventor： Shusuke Yoshihara ,  Syoji Ubukata ,  Kazuaki Matsumoto

IPC: C09K5/14 ,  C08G63/78 ,  C08J5/18 ,  C08K3/38 ,  C08K7/18 ,  C08G63/193 ,  C08K3/22

CPC classification number: C09K5/14 ,  C08G63/185 ,  C08G63/193 ,  C08G63/78 ,  C08J5/18 ,  C08J2367/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K7/18 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08L67/02

Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

Abstract translation: 本发明涉及：（i）具有优异导热性且能够加工成薄壁且柔性的模制品的树脂组合物，该树脂组合物含有：（a）由40至60摩尔％的 具有联苯基的单元（A）和5〜40摩尔％的线性单元（B），以及5〜40摩尔％的线性单元（C），其中树脂本身的导热率不小于0.4 W /（m·K）; 和（b）导热率不小于1W /（m·K）的无机填料，（ii）含有该树脂组合物的散热或传热树脂材料，和（iii）含有 树脂组合物。