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1.发明授权Systems and methods of advanced site-based nanotopography for wafer surface metrology 有权用于晶片表面计量的先进的基于位点的纳米形貌的系统和方法公开(公告)号：US09177370B2
公开(公告)日：2015-11-03
申请号：US13779947
申请日：2013-02-28
CPC分类号： G06T7/0004 , G06T5/20 , G06T2207/20021 , G06T2207/30148
摘要： Systems and methods for providing micro defect inspection capabilities for optical systems are disclosed. Each given wafer image is filtered, treated and normalized prior to performing surface feature detection and quantification. A partitioning scheme is utilized to partition the wafer image into a plurality of measurement sites and metric values are calculated for each of the plurality of measurement sites. Furthermore, transformation steps may also be utilized to extract additional process relevant metric values for analysis purposes.
摘要翻译： 公开了用于为光学系统提供微缺陷检测能力的系统和方法。 在进行表面特征检测和定量之前，对每个给定的晶片图像进行过滤，处理和归一化。 利用分割方案将晶片图像分割成多个测量位置，并且为多个测量位置中的每一个计算度量值。 此外，为了分析目的，转换步骤也可以用于提取附加的过程相关度量值。
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公开(公告)号：US20190271654A1
公开(公告)日：2019-09-05
申请号：US15406732
申请日：2017-01-15
摘要： Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.
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公开(公告)号：US10379061B1
公开(公告)日：2019-08-13
申请号：US15406732
申请日：2017-01-15
CPC分类号： G01N21/9501 , G01B11/24 , G01B2210/56 , G06F17/00 , G06K9/6267 , G06T7/0004 , G06T7/60 , G06T2207/20021 , G06T2207/30148 , H01L22/12
摘要： Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.
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4.发明授权Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool 有权使用晶圆尺寸几何工具的晶圆高阶形状表征和晶片分类的系统，方法和度量公开(公告)号：US09546862B2
公开(公告)日：2017-01-17
申请号：US13656143
申请日：2012-10-19
CPC分类号： G01B11/24 , G01B2210/56 , G01N21/9501 , G06F17/00 , H01L22/12
摘要： Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.
摘要翻译： 公开了用于改善晶片高阶形状（HOS）表征和晶片分类的结果的系统和方法。 根据本公开的系统和方法基于局部形状。 将晶片图划分成多个测量点，以提高晶片形状表示的完整性。 可以针对晶片表征和/或分类目的计算各种基于站点的HOS度量值，并且还可以用作下游应用的控制输入。 此外，还提供了极坐标分割方案。 可以利用这种极性栅格划分方案将晶片表面划分成具有均匀位置区域的测量位置，同时提供良好的晶片边缘区域覆盖。
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5.发明申请Systems and Methods of Advanced Site-Based Nanotopography for Wafer Surface Metrology 有权用于晶圆表面计量的先进的基于位点的纳米形貌的系统和方法公开(公告)号：US20130236085A1
公开(公告)日：2013-09-12
申请号：US13779947
申请日：2013-02-28
IPC分类号： G06T7/00
CPC分类号： G06T7/0004 , G06T5/20 , G06T2207/20021 , G06T2207/30148
摘要： Systems and methods for providing micro defect inspection capabilities for optical systems are disclosed. Each given wafer image is filtered, treated and normalized prior to performing surface feature detection and quantification. A partitioning scheme is utilized to partition the wafer image into a plurality of measurement sites and metric values are calculated for each of the plurality of measurement sites. Furthermore, transformation steps may also be utilized to extract additional process relevant metric values for analysis purposes.
摘要翻译： 公开了用于为光学系统提供微缺陷检测能力的系统和方法。 在进行表面特征检测和定量之前，对每个给定的晶片图像进行过滤，处理和归一化。 利用分割方案将晶片图像分割成多个测量位置，并且为多个测量位置中的每一个计算度量值。 此外，为了分析目的，转换步骤也可以用于提取附加的过程相关度量值。
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公开(公告)号：US09702829B1
公开(公告)日：2017-07-11
申请号：US14246895
申请日：2014-04-07
发明人： Haiguang Chen , Jaydeep Sinha , Sergey Kamensky , Enrique Chavez , Shouhong Tang , Mark Plemmons
IPC分类号： G01B9/02 , G01N21/95 , G01N21/956 , G01B11/30
CPC分类号： G01N21/9501 , G01B11/30 , G01B11/303 , G01B11/306 , G01B2210/56 , G01N21/956
摘要： Interferometer systems and methods for providing improved defect detection and quantification are disclosed. The systems and methods in accordance with the present disclosure may detect surface defects on patterned or bare wafer surfaces and subsequently quantify them. In certain embodiments in accordance with the present disclosure, amplitude maps of the wafer surfaces are obtained and are utilized in addition/alternative to phase maps for wafer surface feature detection. Furthermore, local one-dimensional and/or two-dimensional unwrapping techniques are also disclosed and are utilized in certain embodiments in accordance with the present disclosure to provide height and depth information of the detected defects, further improving the detection capabilities of the measurement systems.
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公开(公告)号：US10352691B1
公开(公告)日：2019-07-16
申请号：US14325758
申请日：2014-07-08
发明人： Haiguang Chen , Jaydeep Sinha , Shouhong Tang , Sergey Kamensky
摘要： Systems and methods for processing phase maps acquired using interferometer wafer geometry tools are disclosed. More specifically, instead of performing phase unwrapping first and then analyze the unwrapped data in a height domain, systems and methods in accordance with the present disclosure operate in a curvature domain without having to perform any phase unwrapping.
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8.发明申请Systems, Methods and Metrics for Wafer High Order Shape Characterization and Wafer Classification Using Wafer Dimensional Geometry Tool 有权使用晶圆尺寸几何工具的晶圆高阶形状表征和晶圆分类的系统，方法和度量公开(公告)号：US20140114597A1
公开(公告)日：2014-04-24
申请号：US13656143
申请日：2012-10-19
CPC分类号： G01B11/24 , G01B2210/56 , G01N21/9501 , G06F17/00 , H01L22/12
摘要： Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.
摘要翻译： 公开了用于改善晶片高阶形状（HOS）表征和晶片分类的结果的系统和方法。 根据本公开的系统和方法基于局部形状。 将晶片图划分成多个测量点，以提高晶片形状表示的完整性。 可以针对晶片表征和/或分类目的计算各种基于站点的HOS度量值，并且还可以用作下游应用的控制输入。 此外，还提供了极坐标分割方案。 可以利用这种极性栅格划分方案将晶片表面划分成具有均匀位置区域的测量位置，同时提供良好的晶片边缘区域覆盖。
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