公开(公告)号：US10733744B2

公开(公告)日：2020-08-04

申请号：US15927011

申请日：2018-03-20

Applicant: KLA-Tencor Corporation

Inventor： Thanh Huy Ha ,  Scott A. Young ,  Mohan Mahadevan

IPC: G06K9/00 ,  G06T7/30 ,  G06K9/62 ,  H01J37/26 ,  G06F30/00

Abstract: Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.

公开(公告)号：US20180330511A1

公开(公告)日：2018-11-15

申请号：US15927011

申请日：2018-03-20

Applicant: KLA-Tencor Corporation

Inventor： Thanh Huy Ha ,  Scott A. Young ,  Mohan Mahadevan

IPC: G06T7/30 ,  G06K9/62 ,  G06F17/50 ,  H01J37/26

Abstract: Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.

公开(公告)号：US10861671B2

公开(公告)日：2020-12-08

申请号：US16253106

申请日：2019-01-21

Applicant: KLA-Tencor Corporation

Inventor： Doug K. Masnaghetti ,  Richard R. Simmons ,  Scott A. Young ,  Mark A. McCord ,  Rainer Knippelmeyer

IPC: H01J37/153 ,  H01J37/21 ,  H01J37/28 ,  G02B21/20

Abstract: A scanning electron microscopy system is disclosed. The system includes a multi-beam scanning electron microscopy (SEM) sub-system. The SEM sub-system includes a multi-beam electron source configured to form a plurality of electron beams, a sample stage configured to secure a sample, an electron-optical assembly to direct the electron beams onto a portion of the sample, and a detector assembly configured to simultaneously acquire multiple images of the surface of the sample. The system includes a controller configured to receive the images from the detector assembly, identify a best focus image of images by analyzing one or more image quality parameters of the images, and direct the multi-lens array to adjust a focus of one or more electron beams based on a focus of an electron beam corresponding with the identified best focus image.

公开(公告)号：US10186396B2

公开(公告)日：2019-01-22

申请号：US15272194

申请日：2016-09-21

Applicant: KLA-Tencor Corporation

Inventor： Doug K. Masnaghetti ,  Richard R. Simmons ,  Scott A. Young ,  Mark A. McCord ,  Rainer Knippelmeyer

IPC: H01J37/153 ,  H01J37/28 ,  H01J37/21

Abstract: A scanning electron microscopy system is disclosed. The system includes a multi-beam scanning electron microscopy (SEM) sub-system. The SEM sub-system includes a multi-beam electron source configured to form a plurality of electron beams, a sample stage configured to secure a sample, an electron-optical assembly to direct the electron beams onto a portion of the sample, and a detector assembly configured to simultaneously acquire multiple images of the surface of the sample. The system includes a controller configured to receive the images from the detector assembly, identify a best focus image of images by analyzing one or more image quality parameters of the images, and direct the multi-lens array to adjust a focus of one or more electron beams based on a focus of an electron beam corresponding with the identified best focus image.

公开(公告)号：US20150226676A1

公开(公告)日：2015-08-13

申请号：US14618586

申请日：2015-02-10

Applicant: KLA-Tencor Corporation

Inventor： Lena Nicolaides ,  Mohan Mahadevan ,  Alex Salnik ,  Scott A. Young

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9505 ,  G01N21/1717 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2201/06113

Abstract: Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.

Abstract translation: 公开了用于检测半导体样品中的缺陷或检​​查缺陷的方法和装置。 该系统具有用于将BF照明光束引导到样品上并且响应于BF照明光束检测从样品反射的输出光束的亮场（BF）模块。 该系统具有调制的光反射（MOR）模块，用于将泵和探针光束引导到样品，并响应于泵浦光束和探针光束检测来自探针光点的MOR输出光束。 该系统包括用于分析来自多个BF点的BF输出光束的处理器，以检测样品表面或表面附近的缺陷，并分析来自多个探针点的MOR输出光束以检测低于表面的缺陷 的样品。

公开(公告)号：US10533954B2

公开(公告)日：2020-01-14

申请号：US15692863

申请日：2017-08-31

Applicant: KLA-Tencor Corporation

Inventor： Lena Nicolaides ,  Mohan Mahadevan ,  Alex Salnik ,  Scott A. Young

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/17 ,  G01N21/88

Abstract: Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.

公开(公告)号：US10325753B2

公开(公告)日：2019-06-18

申请号：US15272194

申请日：2016-09-21

Applicant: KLA-Tencor Corporation

Inventor： Doug K. Masnaghetti ,  Richard R. Simmons ,  Scott A. Young ,  Mark A. McCord ,  Rainer Knippelmeyer

IPC: H01J37/153 ,  H01J37/21 ,  H01J37/28

Abstract: A scanning electron microscopy system is disclosed. The system includes a multi-beam scanning electron microscopy (SEM) sub-system. The SEM sub-system includes a multi-beam electron source configured to form a plurality of electron beams, a sample stage configured to secure a sample, an electron-optical assembly to direct the electron beams onto a portion of the sample, and a detector assembly configured to simultaneously acquire multiple images of the surface of the sample. The system includes a controller configured to receive the images from the detector assembly, identify a best focus image of images by analyzing one or more image quality parameters of the images, and direct the multi-lens array to adjust a focus of one or more electron beams based on a focus of an electron beam corresponding with the identified best focus image.

公开(公告)号：US20190172675A1

公开(公告)日：2019-06-06

申请号：US16253106

申请日：2019-01-21

Applicant: KLA-Tencor Corporation

Inventor： Doug K. Masnaghetti ,  Richard R. Simmons ,  Scott A. Young ,  Mark A. McCord ,  Rainer Knippelmeyer

IPC: H01J37/153 ,  H01J37/28 ,  H01J37/21

Abstract: A scanning electron microscopy system is disclosed. The system includes a multi-beam scanning electron microscopy (SEM) sub-system. The SEM sub-system includes a multi-beam electron source configured to form a plurality of electron beams, a sample stage configured to secure a sample, an electron-optical assembly to direct the electron beams onto a portion of the sample, and a detector assembly configured to simultaneously acquire multiple images of the surface of the sample. The system includes a controller configured to receive the images from the detector assembly, identify a best focus image of images by analyzing one or more image quality parameters of the images, and direct the multi-lens array to adjust a focus of one or more electron beams based on a focus of an electron beam corresponding with the identified best focus image.

公开(公告)号：US09772297B2

公开(公告)日：2017-09-26

申请号：US14618586

申请日：2015-02-10

Applicant: KLA-Tencor Corporation

Inventor： Lena Nicolaides ,  Mohan Mahadevan ,  Alex Salnik ,  Scott A. Young

IPC: G01N21/00 ,  G01B11/30 ,  G01N21/95 ,  G01N21/17 ,  G01N21/88

CPC classification number: G01N21/9505 ,  G01N21/1717 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2201/06113

Abstract: Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.

公开(公告)号：US20180003648A1

公开(公告)日：2018-01-04

申请号：US15692863

申请日：2017-08-31

Applicant: KLA-Tencor Corporation

Inventor： Lena Nicolaides ,  Mohan Mahadevan ,  Alex Salnik ,  Scott A. Young

IPC: G01N21/95 ,  G01N21/17 ,  G01N21/88

Abstract: Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.