公开(公告)号：US20130119431A1

公开(公告)日：2013-05-16

申请号：US13676187

申请日：2012-11-14

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Tomoyuki NAKAGAWA ,  Naoki SONE

IPC分类号： H01L33/52 ,  H01L33/00

CPC分类号： H01L33/52 ,  H01L33/005 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.

摘要翻译： 提供一种发光模块，其中安装了LED装置，并且通过金线向LED装置供电。 发光模块包括密封金线的第一树脂（密封材料）和围绕第一树脂的外周的至少一部分的第二树脂（阻挡壁）。 第一树脂与第二树脂相比具有较低的粘度和较低的弹性模量，并且机械和化学地保护金线。 第二树脂抑制第一树脂向周边流出，结果可以保持第一树脂对金线的密封状态。

公开(公告)号：US20240019102A1

公开(公告)日：2024-01-18

申请号：US18039842

申请日：2021-11-26

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tomoyuki ICHIKAWA ,  Atsushi OZAWA ,  Tomoyuki NAKAGAWA ,  Toru ITO ,  Tetsuya SUZUKI

IPC分类号： F21S45/47 ,  F21V31/00

CPC分类号： F21S45/47 ,  F21V31/005 ,  F21Y2115/10

摘要： A socket housing having an engaging portion that is engaged with a predetermined member; a substrate having a base plate formed by a resin material and a wiring pattern formed in at least a surface on one side, in a thickness direction, of the base plate; a light-emitting element that is connected to the wiring pattern; an annular frame that is formed on the substrate and covers the light-emitting element; a sealing resin that is packed inside the frame and seals the light-emitting element; and an electronic component joined to a land that is formed on an outer circumferential side of the frame. The frame is formed as a resin material having fluidity applied to the substrate is hardened. A clearance between the frame and the land or a clearance between the frame and the electronic component, whichever is smaller, is set to be 0.1 mm or larger.

公开(公告)号：US20180073714A1

公开(公告)日：2018-03-15

申请号：US15561646

申请日：2016-03-16

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Atsushi OZAWA ,  Tomoyuki NAKAGAWA ,  Tsutomu MACHIDA

IPC分类号： F21V29/503 ,  F21V23/06 ,  F21S8/10

CPC分类号： F21V29/503 ,  F21S41/143 ,  F21S41/192 ,  F21S41/194 ,  F21S43/00 ,  F21S43/14 ,  F21S43/19 ,  F21S43/195 ,  F21S43/37 ,  F21S45/48 ,  F21S45/50 ,  F21V15/00 ,  F21V17/005 ,  F21V19/003 ,  F21V23/06 ,  F21V29/74

摘要： A light source unit includes a light emitting element which functions as a light source, a wiring pattern on which the light emitting element is mounted, an electrode pad connected to the wiring pattern, a substrate on which the wiring pattern is formed and the electrode pad is mounted, a power supply body which supplies external power to the electrode pad, and a socket housing which has an engaging portion engaged with a predetermined member and holds the substrate, the light emitting element and the power supply body. The power supply body has a terminal holding portion formed of an insulating resin material and a connection terminal supported by the terminal holding portion and connected to an external power supply. The connection terminal and the electrode pad are connected to each other by a conduction connecting part.

公开(公告)号：US20160290587A1

公开(公告)日：2016-10-06

申请号：US15084647

申请日：2016-03-30

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tomoyuki NAKAGAWA ,  Atsushi OZAWA ,  Ryota NAITO

IPC分类号： F21S8/10 ,  F21V5/04 ,  F21V23/00 ,  F21V19/00

CPC分类号： F21S43/26 ,  F21S41/141 ,  F21S41/192 ,  F21S41/194 ,  F21S41/255 ,  F21S41/295 ,  F21S43/14 ,  F21S43/195 ,  F21S43/27 ,  F21S45/10 ,  F21S45/47 ,  F21V5/04 ,  F21Y2115/10

摘要： A light source unit of one embodiment includes a socket housing, a light emitting module, a substrate, a sealing part, and a lens part. The sealing part seals the light emitting element and the conductive part to the substrate. A lens part is formed on the sealing part. Alastic modulus of the lens part is higher than that of the sealing part.

摘要翻译： 一个实施例的光源单元包括插座壳体，发光模块，基板，密封部分和透镜部分。 密封部分将发光元件和导电部分密封到基底。 在密封部上形成透镜部。 透镜部分的弹性模量高于密封部分的弹性模量。

公开(公告)号：US20130099261A1

公开(公告)日：2013-04-25

申请号：US13715498

申请日：2012-12-14

申请人： Koito Manufacturing Co., Ltd.

发明人： Akihiro MATSUMOTO ,  Tetsuya SUZUKI ,  Tomoyuki NAKAGAWA

IPC分类号： H01L33/62 ,  H01L27/15

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light emitting module, a semiconductor light emitting element is mounted on a mounting board. A plated layer is provided on the surface of the mounting board so as to be electrically connected to the semiconductor light emitting element mounted on the mounting board. The plated layer has a power feeding portion and an element connection portion. The power feeding portion extends, of the surfaces of the mounting board, from the upper surface on which the semiconductor light emitting element is to be mounted to a stepped surface located below the upper surface, so that power can be fed, on the stepped surface, to the semiconductor light emitting element. The element connection portions are provided on the upper surface such that a plurality of the semiconductor light emitting elements mounted on the upper surface are connected together in series.

摘要翻译： 在发光模块中，半导体发光元件安装在安装板上。 电镀层设置在安装板的表面上，以便与安装在安装板上的半导体发光元件电连接。 镀层具有供电部和元件连接部。 供电部将安装板的表面从其上安装有半导体发光元件的上表面延伸到位于上表面下方的台阶表面，从而能够在台阶表面上供电 ，到半导体发光元件。 元件连接部设置在上表面上，使得安装在上表面上的多个半导体发光元件串联连接在一起。