公开(公告)号：US20210410248A1

公开(公告)日：2021-12-30

申请号：US17471289

申请日：2021-09-10

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tomoyuki ICHIKAWA ,  Tetsuya SUZUKI ,  Atsushi OZAWA ,  Toru ITO

IPC分类号： H05B45/345 ,  F21S41/141 ,  H01L33/62

摘要： A semiconductor light source and a constant current circuit are arranged in series between an input terminal and a ground terminal. When an input voltage at the input terminal exceeds a predetermined threshold voltage, a load dump circuit cuts off or reduces a current that flows through the constant current circuit.

公开(公告)号：US20210071851A1

公开(公告)日：2021-03-11

申请号：US16771900

申请日：2018-12-12

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tetsuya SUZUKI

IPC分类号： F21V19/00 ,  F21S41/19 ,  F21V23/06 ,  H01R12/72 ,  H01R12/70

摘要： A light source unit includes a card type light source including a card substrate on which a light source is mounted, and a power supply connector configured to supply power to the light source. A card edge connector is formed on a part of the card substrate. The power supply connector is configured to be fitted to the card type light source via the card edge connector. The card type light source is provided with an alignment groove for confirming an alignment state with respect to the power supply connector.

公开(公告)号：US20240019102A1

公开(公告)日：2024-01-18

申请号：US18039842

申请日：2021-11-26

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tomoyuki ICHIKAWA ,  Atsushi OZAWA ,  Tomoyuki NAKAGAWA ,  Toru ITO ,  Tetsuya SUZUKI

IPC分类号： F21S45/47 ,  F21V31/00

CPC分类号： F21S45/47 ,  F21V31/005 ,  F21Y2115/10

摘要： A socket housing having an engaging portion that is engaged with a predetermined member; a substrate having a base plate formed by a resin material and a wiring pattern formed in at least a surface on one side, in a thickness direction, of the base plate; a light-emitting element that is connected to the wiring pattern; an annular frame that is formed on the substrate and covers the light-emitting element; a sealing resin that is packed inside the frame and seals the light-emitting element; and an electronic component joined to a land that is formed on an outer circumferential side of the frame. The frame is formed as a resin material having fluidity applied to the substrate is hardened. A clearance between the frame and the land or a clearance between the frame and the electronic component, whichever is smaller, is set to be 0.1 mm or larger.

公开(公告)号：US20160025321A1

公开(公告)日：2016-01-28

申请号：US14817488

申请日：2015-08-04

申请人： Koito Manufacturing Co., Ltd.

发明人： Takashi INOUE ,  Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Naoki SONE ,  Takanori NAMBA ,  Hidetada TANAKA

IPC分类号： F21V29/76 ,  F21V19/00 ,  F21S8/10

CPC分类号： F21V29/763 ,  F21S41/147 ,  F21S41/192 ,  F21S45/43 ,  F21S45/47 ,  F21S45/49 ,  F21V19/0025

摘要： In an automotive headlamp, a light-emitting module is configured such that a light-emitting element and a control circuit unit for controlling the lighting of the light-emitting element are structured integrally with each other. A control circuit unit in a position anterior to the light-emitting element in a lamp unit is located below a shade section so that the control circuit unit can be clear of the path of light used to form a low beam light distribution pattern of the light emitted by the light-emitting element. In this setting, the light-emitting element is so located that a main optical axis Ax2 is perpendicular respect to an optical axis Ax1 of the lamp unit and that a light-emitting portion of the light-emitting element protrudes higher than the control circuit unit in the direction of the main optical axis Ax2.

摘要翻译： 在汽车前照灯中，发光模块被配置为使得用于控制发光元件的点亮的发光元件和控制电路单元彼此一体地构造。 在灯单元中位于发光元件前方的位置处的控制电路单元位于阴影部分的下方，使得控制电路单元可以清除用于形成光的近光配光图案的光的路径 由发光元件发射。 在这种情况下，发光元件的位置使得主光轴Ax2相对于灯单元的光轴Ax1垂直，并且发光元件的发光部分比控制电路单元突出 在主光轴Ax2的方向上。

公开(公告)号：US20240295313A1

公开(公告)日：2024-09-05

申请号：US18573235

申请日：2022-06-10

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tomoyuki ICHIKAWA ,  Tetsuya SUZUKI ,  Akio SHOJI ,  Yoshimasa MURATA ,  Ryota FUWA

IPC分类号： F21V23/06 ,  F21S41/143 ,  F21S41/19 ,  F21S45/47

CPC分类号： F21V23/06 ,  F21S41/143 ,  F21S45/47 ,  F21S41/19

摘要： A lamp unit including a light emitting element, a lighting circuit, a substrate, and a heat dissipation member. The substrate includes a substrate main body, an external connector insertion portion, and a light emitting element installation portion, the heat dissipation member being provided in the substrate main body. The lighting circuit is mounted on the substrate main body, the lighting circuit being electrically connected with the light emitting element. The light emitting element is mounted on the substrate main body via the light emitting element installation portion, in a state of being in contact with the heat dissipation member.

公开(公告)号：US20130099261A1

公开(公告)日：2013-04-25

申请号：US13715498

申请日：2012-12-14

申请人： Koito Manufacturing Co., Ltd.

发明人： Akihiro MATSUMOTO ,  Tetsuya SUZUKI ,  Tomoyuki NAKAGAWA

IPC分类号： H01L33/62 ,  H01L27/15

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light emitting module, a semiconductor light emitting element is mounted on a mounting board. A plated layer is provided on the surface of the mounting board so as to be electrically connected to the semiconductor light emitting element mounted on the mounting board. The plated layer has a power feeding portion and an element connection portion. The power feeding portion extends, of the surfaces of the mounting board, from the upper surface on which the semiconductor light emitting element is to be mounted to a stepped surface located below the upper surface, so that power can be fed, on the stepped surface, to the semiconductor light emitting element. The element connection portions are provided on the upper surface such that a plurality of the semiconductor light emitting elements mounted on the upper surface are connected together in series.

摘要翻译： 在发光模块中，半导体发光元件安装在安装板上。 电镀层设置在安装板的表面上，以便与安装在安装板上的半导体发光元件电连接。 镀层具有供电部和元件连接部。 供电部将安装板的表面从其上安装有半导体发光元件的上表面延伸到位于上表面下方的台阶表面，从而能够在台阶表面上供电 ，到半导体发光元件。 元件连接部设置在上表面上，使得安装在上表面上的多个半导体发光元件串联连接在一起。

公开(公告)号：US20130119431A1

公开(公告)日：2013-05-16

申请号：US13676187

申请日：2012-11-14

申请人： KOITO MANUFACTURING CO., LTD.

发明人： Tetsuya SUZUKI ,  Akihiro MATSUMOTO ,  Tomoyuki NAKAGAWA ,  Naoki SONE

IPC分类号： H01L33/52 ,  H01L33/00

CPC分类号： H01L33/52 ,  H01L33/005 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.

摘要翻译： 提供一种发光模块，其中安装了LED装置，并且通过金线向LED装置供电。 发光模块包括密封金线的第一树脂（密封材料）和围绕第一树脂的外周的至少一部分的第二树脂（阻挡壁）。 第一树脂与第二树脂相比具有较低的粘度和较低的弹性模量，并且机械和化学地保护金线。 第二树脂抑制第一树脂向周边流出，结果可以保持第一树脂对金线的密封状态。