摘要:
A gas barrier film includes at least one gas barrier layer and a protective layer over a substrate. The protective layer contains organosilicon and is disposed on the gas barrier layer. At least part of the gas barrier layer has a composition SiOxNy where a condition 0.1≦x/(x+y)≦0.9 is satisfied. The protective layer has received a modification treatment, which is irradiation with ultraviolet light having a wavelength of 300 nm or less. A ratio of a density of the protective layer to a density of the gas barrier layer is 0.2 or more and 0.75 or less.
摘要翻译:阻气膜包括至少一个气体阻隔层和衬底上的保护层。 保护层含有有机硅,并设置在阻气层上。 阻气层的至少一部分具有满足条件为0.1& nlE; x /(x + y)≦̸ 0.9的组成的SiO x N y。 保护层已经进行了对波长为300nm以下的紫外线照射的改性处理。 保护层的密度与阻气层的密度的比为0.2以上且0.75以下。
摘要:
A gas barrier film (10) that comprises a gas barrier layer (14), which is obtained by irradiating a layer that contains a polysilazane with vacuum ultraviolet light, on a base (11) is formed to contain a compound (A) that satisfies all of the conditions (a), (b) and (c) described below in an amount within the range from 1% by mass to 40% by mass (inclusive) relative to the total mass of the gas barrier layer. (a) The compound (A) has an Si—O bond and an organic group that is directly bonded to Si. (b) The compound (A) has an Si—H group or an Si—OH group. (c) The compound (A) has a molecular weight of from 90 to 1,200 (inclusive).
摘要:
The present invention provides a process for producing a transparent heat-resistant gas-barrier film capable of exhibiting a good gas-barrier property and maintaining good properties even after heat-treated at a temperature of 250° C. or higher, in a simple manner at low costs without need of a large size facility and a number of steps. The process for producing a transparent heat-resistant gas-barrier film according to the present invention includes the steps of coating a polysilazane-containing solution onto at least one surface of a transparent polyimide film formed of a polyimide containing a specific repeated unit; and calcining the coated solution at a temperature of 180° C. or higher to laminate a silicon oxide layer obtained by the calcination on the transparent polyimide film.
摘要:
The present invention provides: a gas barrier film comprising a cured resin layer and a gas barrier layer, the gas barrier layer being provided on at least one side of the cured resin layer, the cured resin layer being a layer formed of a cured product of a curable resin composition that includes (A) a thermoplastic resin having a glass transition temperature (Tg) of 140° C. or more, and (B) a curable monomer, the gas barrier film having a water vapor transmission rate of 1 g/m2/day or less at a temperature of 40° C. and a relative humidity of 90%; a method for producing the gas barrier film; a gas barrier film laminate comprising the gas barrier film; an electronic device member comprising the gas barrier film; an electronic device member comprising the gas barrier film laminate; an electronic device comprising the electronic device member. Since the gas barrier film and the gas barrier film laminate of the present invention exhibits excellent heat resistance, excellent solvent resistance, excellent interlayer adhesion, and an excellent gas barrier capability, has a low birefringence, and exhibits excellent optical isotropy, the gas barrier film and the gas barrier film laminate may suitably be used as an electronic device member.
摘要:
A method of manufacturing a gas barrier film inhibits modification-suppressing adsorbed substances from being taken in a coating film to further improve gas barrier performance. In the method, a coating solution containing polysilazane is coated, followed by application of a VUV radiation treatment. In addition, a method of manufacturing a gas barrier film includes coating a coating solution containing polysilazane on a surface of a film to form a coating film, followed by making the resulting film pass through a drying zone, and exposing the surface of the coating film to vacuum UV radiation to conduct a modification treatment. An oxygen concentration in the drying zone, achieved by supplying inert gas into the drying zone, is 10% or less.
摘要:
Disclosed herein is a protective film. The protective film is produced by alternate coating of a polysilazane-based polymer and a flexible polysiloxane-based polymer. The polysilazane-based polymer is cured at low temperature to form silica, thereby achieving high hardness and high light transmittance. The protective film has improved interfacial adhesion between the respective coating films, which prevents permeation of moisture and oxygen. In addition, the protective film can be easily produced by low-temperature wet processes. Also disclosed herein is an encapsulation material comprising the protective film.
摘要:
Disclosed herein is a protective film. The protective film is produced by alternate coating of a polysilazane-based polymer and a flexible polysiloxane-based polymer. The polysilazane-based polymer is cured at low temperature to form silica, thereby achieving high hardness and high light transmittance. The protective film has improved interfacial adhesion between the respective coating films, which prevents permeation of moisture and oxygen. In addition, the protective film can be easily produced by low-temperature wet processes. Also disclosed herein is an encapsulation material comprising the protective film.
摘要:
A water vapor barrier film that has high water vapor barrier performance, and further is excellent in water resistance, heat resistance, transparency, and smoothness; and a method for producing the same; and an electronic equipment using the same are provided. A water vapor barrier film containing at least one water vapor barrier layer, and at least one protective layer, on a base material having gas permeability, wherein the water vapor barrier layer is a layer formed by applying a coating liquid containing polysilazane, drying the applied coating liquid to form a film, and then by irradiating the film with vacuum ultraviolet light, and the protective layer is a layer formed by applying a coating liquid containing polysilozane, drying the applied coating liquid to form a film, and then by irradiating the film with vacuum ultraviolet light.
摘要:
The present invention provides a gas barrier film including a base layer, and a gas barrier layer that is provided on at least one side of the base layer, the base layer including a resin having a glass transition temperature (Tg) of more than 130° C., the gas barrier layer being formed of a material that includes at least an oxygen atom and a silicon atom, a surface layer part of the gas barrier layer having an oxygen atom content rate of 60 to 75%, a nitrogen atom content rate of 0 to 10%, and a silicon atom content rate of 25 to 35%, based on a total content rate of oxygen atoms, nitrogen atoms, and silicon atoms, and the surface layer part of the gas barrier layer having a film density of 2.4 to 4.0 g/cm3. Also provided are a process for producing the same, an electronic device member that includes the gas barrier film, and an electronic device that includes the electronic device member. The gas barrier film of the invention exhibits an excellent gas barrier capability, excellent transparency, excellent bending resistance, and excellent heat resistance.
摘要翻译:本发明提供了一种阻气膜,其包括基底层和设置在基底层的至少一侧的阻气层,所述基底层包括玻璃化转变温度(Tg)大于130°的树脂 气体阻隔层由至少包含氧原子和硅原子的材料形成,阻气层的表面层部分的氧原子含有率为60〜75%,氮原子含有率 为0〜10%,硅原子含有率为25〜35%,基于氧原子,氮原子和硅原子的总含有率,阻气层的表层部分的膜密度为 2.4〜4.0g / cm 3。 还提供了制造该方法的方法,包括阻气膜的电子器件部件和包括该电子器件部件的电子器件。 本发明的阻气膜表现出优异的阻气性,优异的透明性,优异的耐弯曲性和优异的耐热性。