公开(公告)号：US11749706B2

公开(公告)日：2023-09-05

申请号：US17439440

申请日：2020-03-16

Applicant: KONINKLIJKE PHILIPS N.V. ,  WAYNE STATE UNIVERSITY

Inventor： Marc Anthony Chappo ,  Stephanie Lee Brock

IPC: H01L27/146 ,  G01N23/046 ,  G01T1/24 ,  G01T1/20

CPC classification number: H01L27/14676 ,  G01N23/046 ,  G01T1/24 ,  G01T1/2018

Abstract: A detection layer (416) for a radiation detector (400) includes a porous silicon membrane (418). The porous silicon membrane includes silicon (419) with a first side (430) and a second opposing side (432), a plurality of pores (420) extending entirely through the silicon from the first side to the second opposing side, each including shared walls (426), at least one protrusion of silicon (424) protruding out and extending from the first side a distance (504, 604, 704). The porous silicon membrane further includes a plurality of radiation sensitive quantum dots (422) in the pores and a quantum dot layer disposed on the first side and having a surface (434) and a thickness (506, 606, 706), wherein the thickness is greater than the distance.

公开(公告)号：US09316751B2

公开(公告)日：2016-04-19

申请号：US14390798

申请日：2013-04-15

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Marc Anthony Chappo ,  Randall Peter Luhta

IPC: G01T1/29 ,  H01L27/146 ,  G01N23/04

CPC classification number: G01T1/2928 ,  G01N23/046 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/1469

Abstract: An imaging apparatus (400) includes a detector array (412) with at least one detector tile (418). The detector tile includes a photosensor array (422) with a two dimensional array of individual photosensitive detector pixels (424) located within a non-photosensitive area (426). The imaging apparatus also includes readout electronics (432) coupled to the photosensor array and including individual readout channel wells (602, 604) corresponding to the individual detector pixels. The imaging apparatus also includes an anti-aliasing filter (800) for a detector pixel that is located in at least one of a region of the photosensor array corresponding to the detector pixel or a region of the readout electronics corresponding to the detector pixel.

Abstract translation: 成像设备（400）包括具有至少一个检测器瓦（418）的检测器阵列（412）。 检测器瓦片包括具有位于非感光区域（426）内的各个光敏检测器像素（424）的二维阵列的光电传感器阵列（422）。 成像装置还包括耦合到光传感器阵列并包括对应于各个检测器像素的各个读出通道阱（602,604）的读出电路（432）。 成像装置还包括用于检测器像素的抗混叠滤波器（800），其位于与检测器像素相对应的光电传感器阵列的区域或对应于检测器像素的读出电子器件的区域中的至少一个中。

公开(公告)号：US11096650B2

公开(公告)日：2021-08-24

申请号：US15746814

申请日：2016-08-01

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Daniel David Judkins ,  Marc Anthony Chappo

IPC: A61B6/00 ,  A61B6/04 ,  A61B6/10 ,  A61B6/03 ,  A61B5/055

Abstract: A subject support includes a fixed portion and a moveable portion coupled to the fixed portion and configured to move along at least one axis relative to the fixed portion, and the coupling includes one or more points of friction that move during movement of the moveable portion and which wear due to at least movement by the moveable portion. The moveable portion receives and supports at least one of an object or a subject during an imaging procedure with an imaging device. One or more inertial measurement units (IMUs) are affixed to or embedded in the moveable portion that directly measure acceleration of translation of the moveable portion along one or more axes.

公开(公告)号：US20170186807A1

公开(公告)日：2017-06-29

申请号：US15316533

申请日：2015-05-19

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Marc Anthony Chappo ,  Rafael GOSHEN

IPC: H01L27/146 ,  G01T1/20

CPC classification number: H01L27/14663 ,  G01T1/2018 ,  H01L27/146 ,  H01L27/14658 ,  H01L27/14661 ,  H01L27/14687 ,  H01L27/1469

Abstract: An imaging system detector array (112) includes a detector tile (116). The detector tile includes a photosensor array (202), including a plurality of photosensor pixels (204). The detector tile further includes a scintillator array (212) optically coupled to the photosensor array. The detector tile further includes an electronics layer or ASIC on a substrate (214) that is electrically coupled to the photosensor array. The electronics layer includes a plurality of individual and divisible processing regions (302). Each processing region including a predetermined number of channels corresponding to a sub-set of the plurality of photosensor pixels. The processing regions are in electrical communication with each other. Each processing region includes its own electrical reference and bias circuitry (802, 804).

公开(公告)号：US20150276939A1

公开(公告)日：2015-10-01

申请号：US14422708

申请日：2013-11-22

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Marc Anthony Chappo ,  Randall Peter Luhta

IPC: G01T1/208 ,  G01T1/161

CPC classification number: G01T1/208 ,  G01T1/161 ,  G01T1/2018

Abstract: A detector array (112) includes at least one detector pixel (306) with a cavity (400) that defines a three dimensional volume. A surface of the cavity includes at least two photosensitive regions and a non-photosensitive region there between, defining at least two sub-pixels (306i, 3062) which detect light photons traversing within the three dimensional cavity and produce respective signals indicative thereof. The detector array further includes a scintillator (302), including a first sub-portion that is located in the cavity and which emits the light photons in response to absorbing x-ray photons. Light photons emitted by the first sub-portion are detected by both of the at least two sub-pixels

Abstract translation: 检测器阵列（112）包括具有限定三维体积的空腔（400）的至少一个检测器像素（306）。 空腔的表面包括至少两个感光区域和其间的非感光区域，限定了至少两个子像素（306i，3062），其检测在三维空腔内穿过的光子，并产生指示其的相应信号。 检测器阵列还包括闪烁体（302），其包括位于空腔中的第一子部分，并且响应于吸收x射线光子而发射光子。 由第一子部分发射的光子被至少两个子像素两者检测

公开(公告)号：US11041966B2

公开(公告)日：2021-06-22

申请号：US16339057

申请日：2017-10-18

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Marc Anthony Chappo

IPC: G01T1/20 ,  G01T1/208 ,  G01T1/161 ,  A61B6/00 ,  G01T1/24

Abstract: A scintillator layer (206) includes a plurality of scintillator pixels (337), walls of non-scintillation material (336) surrounding each of the plurality of scintillator pixels, and at least one electrically conductive interconnect (224) for a pixel, wherein the at least one electrically conductive interconnect extends within a wall of the pixel along an entire depth of the wall. A multi-energy detector array (114) includes a detector tile (116) with an upper scintillator layer (202), an upper photosensor (204) optically coupled to the upper scintillator layer, a lower scintillator layer (206) electrically coupled to the upper photosensor, and a lower photodetector (208) optically and electrically coupled to the lower scintillator layer. The lower scintillator layer includes at least one scintillator pixel (337) surrounded by at least one wall of non-scintillation material (336), and the wall includes at least one electrically conductive interconnect (224) that extends from a top edge of the wall to a bottom edge of the wall.

公开(公告)号：US10261195B2

公开(公告)日：2019-04-16

申请号：US15746440

申请日：2016-07-28

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Marc Anthony Chappo

IPC: G01T1/17 ,  H03M1/14 ,  H04N5/32 ,  H03M1/60 ,  H03M1/46

Abstract: A detector array (112) of an imaging system (100) includes a radiation sensitive detector (202/204/206) configured to detect radiation and generates a signal indicative thereof and electronics (208) in electrical communication with the radiation sensitive detector. The electronics include a current-to-frequency converter (300) configured to convert the signal into a pulse train having a frequency indicative of a charge collected during an integration period. The electronics further include a residual charge collection circuit (322) electrically coupled to current-to-frequency converter. The residual charge collection circuit is configured to store charge collected by the integrator for an end portion of the integration period that does not results in a pulse of the pulse train, utilizing much of the electronics already in the current-to-frequency converter electronics.

公开(公告)号：US10217790B2

公开(公告)日：2019-02-26

申请号：US15304545

申请日：2016-01-07

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Marc Anthony Chappo

IPC: H01L23/00 ,  H01L23/367 ,  H01L27/00 ,  H01L27/146 ,  H01L31/00 ,  H01L31/02 ,  H05K1/18 ,  H01L31/18 ,  H05K3/34 ,  A61B6/03 ,  A61B6/00

Abstract: A module assembly device (402) is configured for assembling a module assembly (114) for a detector array (110) of an imaging system (100). The module assembly device includes a base (400) having a long axis (401). The module assembly device further includes a first surface (406) of the base and side walls (408) protruding perpendicular up from the first surface and extending in a direction of the long axis along at least two sides of the base. The first surface and side walls form a recess (404) configured to receive the module substrate on the surface and within the side walls. The module assembly device further includes protrusions (403) protruding from the side walls in a direction of the side walls. The protrusions and side walls interface forming a ledge which serves as a photo-detector array tile support (410) configured to receive the photo-detector array tile (118) over the ASIC and the module substrate.

公开(公告)号：US09538107B2

公开(公告)日：2017-01-03

申请号：US14890598

申请日：2014-05-07

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Marc Anthony Chappo

IPC: H04N5/361 ,  A61B6/00 ,  G01T1/20 ,  H04N5/32 ,  H04N5/3745 ,  A61B6/03 ,  G01T1/24 ,  H04N5/225 ,  H04N5/378

CPC classification number: H04N5/361 ,  A61B6/032 ,  A61B6/035 ,  A61B6/4233 ,  A61B6/4241 ,  G01T1/2018 ,  G01T1/24 ,  H04N5/2253 ,  H04N5/32 ,  H04N5/37455 ,  H04N5/378

Abstract: Asilicon imaging detector tile (216) includes a silicon photosensor layer (302) including a plurality of detector pixels (304), each with a photo-transistor (406), and a silicon electronics layer (314), coupled to the silicon photosensor layer, including a current-to-frequency converter and bias control (404) for each of the plurality of photo-transistor. A method includes sensing, with a photo-transistor of a detector pixel of a silicon photosensor layer of an imaging detector and in an absence of x-ray radiation, a dark current, regulating, with bias control, an amount of the dark current transmitted to a current-to-frequency converter of a silicon electronics layer coupled to the silicon photosensor layer, and converting, with the current-to-frequency converter, the amount of the dark current transmitted to the current-to-frequency converter.

Abstract translation: 硅片成像检测器瓦片（216）包括硅光电传感器层（302），其包括多个检测器像素（304），每个检测器像素具有光电晶体管（406）和硅电子层（314），耦合到硅光电传感器层 ，包括用于多个光电晶体管中的每一个的电流 - 频率转换器和偏置控制（404）。 一种方法包括用成像检测器的硅光电传感器层的检测器像素的光电晶体管和在不存在x射线辐射的情况下感测暗电流，通过偏压控制调节发射的暗电流量 耦合到耦合到硅光电传感器层的硅电子层的电流到频率转换器，并且利用电流 - 频率转换器转换传输到电流 - 频率转换器的暗电流的量。

公开(公告)号：US11656372B2

公开(公告)日：2023-05-23

申请号：US17042258

申请日：2019-03-27

Applicant: KONINKLIJKE PHILIPS N.V. ,  CASE WESTERN RESERVE UNIVERSITY ,  WAYNE STATE UNIVERSITY

Inventor： Marc Anthony Chappo ,  Stephanie Lee Brock ,  Ina Taylor Martin

IPC: G01T1/24 ,  H01L33/06

CPC classification number: G01T1/247 ,  G01T1/244 ,  H01L33/06

Abstract: A radiation detector (100) includes a photovoltaic layer (102) with first and second opposing sides. The photovoltaic layer is configured to absorb first radiation at the first side and produce electrical charge. The detector further includes a porous silicon quantum dot layer (104) disposed at the second side of the photovoltaic layer and configured to receive second radiation and convert the received second radiation into an electrical signal indicative of an energy level of the received second radiation. The detector further includes an acquisition and communication layer (106) disposed adjacent to the porous silicon quantum dot layer and configured to receive the electrical signal and transmit the electrical signal to a device remote from the radiation detector. The detector further includes an energy storage layer (108) disposed adjacent to the acquisition and communication layer and configured to store the electrical charge and supply the stored electrical charge as operating power to the acquisition and communication layer.