公开(公告)号：US20150130043A1

公开(公告)日：2015-05-14

申请号：US14401367

申请日：2013-05-16

Applicant: KYOCERA Corporation

Inventor： Mahiro Tsujino ,  Toshihiko Kitamura

IPC: H01L23/055 ,  H01L23/50 ,  H01L23/34

CPC classification number: H01L23/055 ,  H01L23/13 ,  H01L23/34 ,  H01L23/36 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor element housing package includes a rectangular ceramic package having a recess section on an upper surface thereof or a penetration section from the upper surface to a lower surface thereof, and a heat radiation plate attached to the lower surface of the ceramic package, extending from one side toward the other side of the lower surface up to a region in which the heat radiation plate overlays the recess section or the penetration section, which plate has a width on a side of the other side which is narrower than that on a side of one side. The package includes a plurality of first lead pins disposed on the lower surface of the ceramic package along the other side, and a pair of second lead pins disposed on the lower surface of the ceramic package on both sides of a narrow portion of the heat radiation plate.

Abstract translation: 一种半导体元件容纳封装，包括：在其上表面具有凹部的矩形陶瓷封装或从上表面到下表面的贯通部，以及安装在陶瓷封装的下表面的散热板， 一侧朝向下表面的另一侧，直到散热板覆盖凹部或穿透部的区域，该区域在另一侧的宽度比第二侧的宽度窄 一边。 该封装包括沿着另一侧设置在陶瓷封装的下表面上的多个第一引线引脚和设置在陶瓷封装的下表面上的一对第二引脚，其在散热部分的窄部分的两侧 盘子。

公开(公告)号：US11889618B2

公开(公告)日：2024-01-30

申请号：US17605162

申请日：2020-04-27

Applicant: KYOCERA Corporation

Inventor： Toshihiko Kitamura

IPC: H05K7/10 ,  H05K1/02

CPC classification number: H05K1/024 ,  H05K1/0243 ,  H05K1/0246 ,  H05K2201/1034 ,  H05K2201/10886

Abstract: A dielectric substrate has a first surface including a first terminal joint and a second terminal joint arranged along a first side surface. A first lead terminal is bonded to the first terminal joint with a bond. A second lead terminal is bonded to the second terminal joint with a bond. The first lead terminal includes a first base bonded to the first terminal joint and a first lead extending from the first base. The second lead terminal includes a second base bonded to the second terminal joint and a second lead extending from the second base. The first lead terminal includes the first base having a larger thickness than the first lead.

公开(公告)号：US10512155B2

公开(公告)日：2019-12-17

申请号：US15768059

申请日：2017-01-26

Applicant: KYOCERA Corporation

Inventor： Toshihiko Kitamura

IPC: H05K1/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/12 ,  H01L31/02 ,  H01S5/022 ,  H05K1/03 ,  H05K3/12

Abstract: A wiring board that includes a first dielectric layer having a rectangular plate form, a ground conductor wiring, a pair of signal conductor wirings, a ground conductor layer, and a second dielectric layer having a rectangular plate form. The ground conductor wiring is positioned on a first face of the first dielectric layer. The pair of signal conductor wirings carrying out signal transmission is positioned on the first face of the first dielectric layer. The ground conductor layer is positioned on a second face of the first dielectric layer. A first end portion of the signal conductor wiring extends to a first side of the first face. The region of the ground conductor layer where the first end portion of the signal conductor wiring is positioned in plan view is cut away inwardly from a first side of the second face opposing the first side of the first face.

公开(公告)号：US09443777B2

公开(公告)日：2016-09-13

申请号：US14401367

申请日：2013-05-16

Applicant: KYOCERA Corporation

Inventor： Mahiro Tsujino ,  Toshihiko Kitamura

IPC: H01L23/48 ,  H01L23/055 ,  H01L23/13 ,  H01L23/36 ,  H01L23/34 ,  H01L23/50

CPC classification number: H01L23/055 ,  H01L23/13 ,  H01L23/34 ,  H01L23/36 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor element housing package includes a rectangular ceramic package having a recess section on an upper surface thereof or a penetration section from the upper surface to a lower surface thereof, and a heat radiation plate attached to the lower surface of the ceramic package, extending from one side toward the other side of the lower surface up to a region in which the heat radiation plate overlays the recess section or the penetration section, which plate has a width on a side of the other side which is narrower than that on a side of one side. The package includes a plurality of first lead pins disposed on the lower surface of the ceramic package along the other side, and a pair of second lead pins disposed on the lower surface of the ceramic package on both sides of a narrow portion of the heat radiation plate.

Abstract translation: 一种半导体元件容纳封装，包括：在其上表面具有凹部的矩形陶瓷封装或从上表面到下表面的贯通部，以及安装在陶瓷封装的下表面的散热板， 一侧朝向下表面的另一侧，直到散热板覆盖凹部或穿透部的区域，该区域在另一侧的宽度比第二侧的宽度窄 一边。 该封装包括沿着另一侧设置在陶瓷封装的下表面上的多个第一引线引脚和设置在陶瓷封装的下表面上的一对第二引脚，其在散热部分的窄部分的两侧 盘子。

公开(公告)号：US12068420B2

公开(公告)日：2024-08-20

申请号：US17436111

申请日：2020-03-09

Applicant: KYOCERA Corporation

Inventor： Toshihiko Kitamura

IPC: H01L31/02 ,  H01L31/0203 ,  H01S5/02315

CPC classification number: H01L31/02005 ,  H01L31/0203 ,  H01S5/02315

Abstract: A dielectric substrate has a first surface including a first terminal connector and a second terminal connector located along a first side surface. A recess is between the first terminal connector and the second terminal connector. The recess has a first inner surface continuous with the first terminal connector, a second inner surface continuous with the second terminal connector, and a bottom surface between the first inner surface and the second inner surface. The first terminal connector has first wettability with a bond on its surface, and a first region has second wettability with the bond on its surface lower than the first wettability.