公开(公告)号：US08563415B2

公开(公告)日：2013-10-22

申请号：US13061879

申请日：2010-06-24

申请人： Wenwu Wang ,  Shijie Chen ,  Xiaolei Wang ,  Kai Han ,  Dapeng Chen

发明人： Wenwu Wang ,  Shijie Chen ,  Xiaolei Wang ,  Kai Han ,  Dapeng Chen

IPC分类号： H01L21/3205 ,  H01L21/8238

CPC分类号： H01L21/823857 ,  H01L21/28176 ,  H01L29/4916 ,  H01L29/4966 ,  H01L29/4975 ,  H01L29/513 ,  H01L29/517

摘要： The present invention relates to a method of manufacturing a semiconductor device. After depositing the metal gate electrode material, a layer of oxygen molecule catalyzing layer having a catalyzing function to the oxygen molecules is deposited, and afterwards, a low-temperature PMA annealing process is used to decompose the oxygen molecules in the annealing atmosphere into more active oxygen atoms. These oxygen atoms are diffused into the high-k gate dielectric film through the metal gate to supplement the oxygen vacancies in the high-k film, in order to alleviate oxygen vacancies in the high-k film and improve the quality of the high-k film. According to the present invention, the oxygen vacancies and defects of high-k gate dielectric film will be alleviated, and further, growth of SiOx interface layer having a low dielectric constant caused by the traditional PDA high temperature process may be prevented. Thereby, the EOT of the entire gate dielectric layer may be effectively controlled, and the MOS device may be continuously scaled. Meanwhile, the present invention further provides a semiconductor device obtained according to the above-mentioned method.

摘要翻译： 本发明涉及半导体器件的制造方法。 沉积金属栅电极材料后，沉积具有对氧分子具有催化功能的氧分子催化层，然后使用低温PMA退火工艺将退火气氛中的氧分子分解为更有活性的 氧原子。 这些氧原子通过金属栅极扩散到高k栅极电介质膜中，以补充高k膜中的氧空位，以便减轻高k膜中的氧空位并提高高k的质量 电影。 根据本发明，可以减轻高k栅极电介质膜的氧空位和缺陷，并且可以防止由传统的PDA高温过程引起的具有低介电常数的SiO x界面层的生长。 由此，可以有效地控制整个栅介质层的EOT，并且可以连续地缩放MOS器件。 同时，本发明还提供了根据上述方法获得的半导体器件。

公开(公告)号：US08633098B2

公开(公告)日：2014-01-21

申请号：US13061774

申请日：2010-09-28

申请人： Kai Han ,  Wenwu Wang ,  Xiaolei Wang ,  Shijie Chen ,  Dapeng Chen

发明人： Kai Han ,  Wenwu Wang ,  Xiaolei Wang ,  Shijie Chen ,  Dapeng Chen

IPC分类号： H01L21/28

CPC分类号： H01L29/4908 ,  H01L21/28176 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517

摘要： The present invention relates to the field of semiconductor manufacturing. The present invention provides a method of manufacturing a semiconductor device, which comprises: providing a semiconductor substrate; forming an interface layer, a gate dielectric layer and a gate electrode on the substrate; forming a metal oxygen absorption layer on the gate electrode; performing a thermal annealing process on the semiconductor device so that the metal oxygen absorption layer absorbs oxygen in the interface layer and the thickness of the interface layer is reduced. By means of the present invention, the thickness of the interface layer can be reduced on one hand, and on the other hand the metal in the metal oxygen absorption layer is made to diffuse into the gate electrode and/or the gate dielectric layer through the annealing process, which further achieves the effects of adjusting the effective work function and controlling the threshold voltage.

摘要翻译： 本发明涉及半导体制造领域。 本发明提供一种制造半导体器件的方法，其包括：提供半导体衬底; 在基板上形成界面层，栅极电介质层和栅电极; 在栅电极上形成金属氧吸收层; 对半导体器件进行热退火处理，使得金属氧吸收层吸收界面层中的氧，并且界面层的厚度减小。 通过本发明，一方面可以减小界面层的厚度，另一方面，通过金属氧化物吸收层中的金属氧化物吸收层中的金属扩散到栅电极和/或栅电介质层 退火工艺，进一步实现了调节有效功函数和控制阈值电压的效果。

公开(公告)号：US20120021596A1

公开(公告)日：2012-01-26

申请号：US13061774

申请日：2010-09-28

申请人： Kai Han ,  Wenwu Wang ,  Xiaolei Wang ,  Shijie Chen ,  Dapeng Chen

发明人： Kai Han ,  Wenwu Wang ,  Xiaolei Wang ,  Shijie Chen ,  Dapeng Chen

IPC分类号： H01L21/28

CPC分类号： H01L29/4908 ,  H01L21/28176 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517

摘要： The present invention relates to the field of semiconductor manufacturing. The present invention provides a method of manufacturing a semiconductor device, which comprises: providing a semiconductor substrate; forming an interface layer, a gate dielectric layer and a gate electrode on the substrate; forming a metal oxygen absorption layer on the gate electrode; performing a thermal annealing process on the semiconductor device so that the metal oxygen absorption layer absorbs oxygen in the interface layer and the thickness of the interface layer is reduced. By means of the present invention, the thickness of the interface layer can be reduced on one hand, and on the other hand the metal in the metal oxygen absorption layer is made to diffuse into the gate electrode and/or the gate dielectric layer through the annealing process, which further achieves the effects of adjusting the effective work function and controlling the threshold voltage.

摘要翻译： 本发明涉及半导体制造领域。 本发明提供一种制造半导体器件的方法，其包括：提供半导体衬底; 在基板上形成界面层，栅极电介质层和栅电极; 在栅电极上形成金属氧吸收层; 对半导体器件进行热退火处理，使得金属氧吸收层吸收界面层中的氧，并且界面层的厚度减小。 通过本发明，一方面可以减小界面层的厚度，另一方面，通过金属氧化物吸收层中的金属氧化物吸收层中的金属扩散到栅电极和/或栅电介质层 退火工艺，进一步实现了调节有效功函数和控制阈值电压的效果。

公开(公告)号：US20110260255A1

公开(公告)日：2011-10-27

申请号：US13061879

申请日：2010-06-24

申请人： Wenwu Wang ,  Shijie Chen ,  Xiaolei Wang ,  Kai Han ,  Dapeng Chen

发明人： Wenwu Wang ,  Shijie Chen ,  Xiaolei Wang ,  Kai Han ,  Dapeng Chen

IPC分类号： H01L27/088 ,  H01L21/336

CPC分类号： H01L21/823857 ,  H01L21/28176 ,  H01L29/4916 ,  H01L29/4966 ,  H01L29/4975 ,  H01L29/513 ,  H01L29/517

摘要： The present invention relates to a method of manufacturing a semiconductor device. After depositing the metal gate electrode material, a layer of oxygen molecule catalyzing layer having a catalyzing function to the oxygen molecules is deposited, and afterwards, a low-temperature PMA annealing process is used to decompose the oxygen molecules in the annealing atmosphere into more active oxygen atoms. These oxygen atoms are diffused into the high-k gate dielectric film through the metal gate to supplement the oxygen vacancies in the high-k film, in order to alleviate oxygen vacancies in the high-k film and improve the quality of the high-k film. According to the present invention, the oxygen vacancies and defects of high-k gate dielectric film will be alleviated, and further, growth of SiOx interface layer having a low dielectric constant caused by the traditional PDA high temperature process may be prevented. Thereby, the EOT of the entire gate dielectric layer may be effectively controlled, and the MOS device may be continuously scaled. Meanwhile, the present invention further provides a semiconductor device obtained according to the above-mentioned method.

摘要翻译： 本发明涉及半导体器件的制造方法。 沉积金属栅电极材料后，沉积具有对氧分子具有催化功能的氧分子催化层，然后使用低温PMA退火工艺将退火气氛中的氧分子分解为更有活性的 氧原子。 这些氧原子通过金属栅极扩散到高k栅极电介质膜中，以补充高k膜中的氧空位，以便减轻高k膜中的氧空位并提高高k的质量 电影。 根据本发明，可以减轻高k栅极电介质膜的氧空位和缺陷，并且可以防止由传统的PDA高温过程引起的具有低介电常数的SiO x界面层的生长。 由此，可以有效地控制整个栅介质层的EOT，并且可以连续地缩放MOS器件。 同时，本发明还提供了根据上述方法获得的半导体器件。

公开(公告)号：US08507991B2

公开(公告)日：2013-08-13

申请号：US13517893

申请日：2012-06-14

申请人： Wenwu Wang ,  Kai Han ,  Shijie Chen ,  Xiaolei Wang ,  Dapeng Chen

发明人： Wenwu Wang ,  Kai Han ,  Shijie Chen ,  Xiaolei Wang ,  Dapeng Chen

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L27/108 ,  H01L31/119 ,  H01L31/062

CPC分类号： H01L21/823857 ,  H01L29/66545 ,  Y10S438/926

摘要： A semiconductor device is provided. A multi-component high-k interface layer containing elements of the substrate is formed from an ultra-thin high-k dielectric material in a single-layer structure of atoms by rapid annealing in the manufacturing of a CMOS transistor by the replacement gate process, and a high-k gate dielectric layer with a higher dielectric constant and a metal gate layer are formed thereon. The EOT of the device is effectively decreased, and the diffusion of atoms in the high-k gate dielectric layer from an upper level thereof is effectively prevented by the optimized high-k interface layer at high-temperature treatment.

摘要翻译： 提供半导体器件。 通过在通过替换栅极工艺制造CMOS晶体管中的快速退火，通过单原子结构的超薄高k电介质材料形成包含衬底元件的多组分高k界面层， 并且在其上形成具有较高介电常数的高k栅极电介质层和金属栅极层。 有效地减少器件的EOT，并且通过在高温处理下的优化的高k界面层有效地防止了高k栅介质层中的原子从其上层的扩散。

公开(公告)号：US20120261761A1

公开(公告)日：2012-10-18

申请号：US13517893

申请日：2012-06-14

申请人： Wenwu Wang ,  Kai Han ,  Shijie Chen ,  Xiaolei Wang ,  Dapeng Chen

发明人： Wenwu Wang ,  Kai Han ,  Shijie Chen ,  Xiaolei Wang ,  Dapeng Chen

IPC分类号： H01L27/088

CPC分类号： H01L21/823857 ,  H01L29/66545 ,  Y10S438/926

摘要： A semiconductor device is provided. A multi-component high-k interface layer containing elements of the substrate is formed from an ultra-thin high-k dielectric material in a single-layer structure of atoms by rapid annealing in the manufacturing of a CMOS transistor by the replacement gate process, and a high-k gate dielectric layer with a higher dielectric constant and a metal gate layer are formed thereon. The EOT of the device is effectively decreased, and the diffusion of atoms in the high-k gate dielectric layer from an upper level thereof is effectively prevented by the optimized high-k interface layer at high-temperature treatment.

摘要翻译： 提供半导体器件。 通过在通过替换栅极工艺制造CMOS晶体管中的快速退火，通过单原子结构的超薄高k电介质材料形成包含衬底元件的多组分高k界面层， 并且在其上形成具有较高介电常数的高k栅极电介质层和金属栅极层。 有效地减少器件的EOT，并且通过在高温处理下的优化的高k界面层有效地防止了高k栅介质层中的原子从其上层的扩散。

公开(公告)号：US08222099B2

公开(公告)日：2012-07-17

申请号：US13063564

申请日：2010-06-24

申请人： Wenwu Wang ,  Kai Han ,  Shijie Chen ,  Xiaolei Wang ,  Dapeng Chen

发明人： Wenwu Wang ,  Kai Han ,  Shijie Chen ,  Xiaolei Wang ,  Dapeng Chen

IPC分类号： H01L27/088

CPC分类号： H01L21/823857 ,  H01L29/66545 ,  Y10S438/926

摘要： A semiconductor device and a method of manufacturing the same are provided. A multi-component high-k interface layer containing elements of the substrate is formed from a ultra-thin high-k dielectric material in a single-layer structure of atoms by rapid annealing in the manufacturing of a CMOS transistor by the replacement gate process, and a high-k gate dielectric layer with a higher dielectric constant and a metal gate layer are formed thereon. The EOT of the device is effectively decreased, and the diffusion of atoms in the high-k gate dielectric layer from an upper level thereof is effectively prevented by the optimized high-k interface layer at high-temperature treatment. Thus, the present invention may also avoid the growth of the interface layers and the degradation of carrier mobility. Furthermore, the present invention may further alleviate the problem of high interface state and interface roughness caused by direct contact of the high-k gate dielectric layer with high dielectric constant and the substrate, and thus the overall performance of the device is effectively enhanced.

摘要翻译： 提供半导体器件及其制造方法。 通过在通过替换栅极工艺制造CMOS晶体管中的快速退火，通过单层原子结构的超薄高k介电材料形成包含衬底元件的多组分高k界面层， 并且在其上形成具有较高介电常数的高k栅极电介质层和金属栅极层。 有效地减少器件的EOT，并且通过在高温处理下的优化的高k界面层有效地防止了高k栅介质层中的原子从其上层的扩散。 因此，本发明还可以避免界面层的生长和载流子迁移率的劣化。 此外，本发明还可以进一步减轻高介电常数和高介电常数直接接触引起的高界面态和界面粗糙度问题，从而有效提高器件的整体性能。

公开(公告)号：US20110254063A1

公开(公告)日：2011-10-20

申请号：US13063693

申请日：2010-09-27

申请人： Shijie Chen ,  Wenwu Wang ,  Xiaolei Wang ,  Kai Han

发明人： Shijie Chen ,  Wenwu Wang ,  Xiaolei Wang ,  Kai Han

IPC分类号： H01L29/78 ,  H01L21/321 ,  B82Y99/00 ,  B82Y40/00

CPC分类号： H01L21/28088 ,  H01L29/42372 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517

摘要： The present invention provides a MOS device, which comprises: a substrate; an interface layer thin film formed on the substrate; a high k gate dielectric layer formed on the interface layer thin film; and a metal gate formed on the high k gate dielectric layer. The metal gate comprises, upwardly in order, a metal gate work function layer, an oxygen absorption element barrier layer, a metal gate oxygen absorbing layer, a metal gate barrier layer and a polysilicon layer. A metal gate oxygen absorbing layer is introduced into the metal gate for the purpose of preventing the outside oxygen from coming into the interface layer and absorbing the oxygen in the interface layer during a annealing process, such that the interface layer is reduced to be thinner and the EOT of MOS devices are effectively reduced; meanwhile, by adding an oxygen absorption element barrier layer, the “oxygen absorption element” is prevented from diffusing into the high k gate dielectric layer and giving rise to unfavorable impact thereon; in this way, the high k/metal gate system can be more easily integrated, and the performance of the device can be further improved accordingly.

摘要翻译： 本发明提供一种MOS器件，其包括：衬底; 形成在基板上的界面层薄膜; 形成在界面层薄膜上的高k栅介质层; 以及形成在高k栅极电介质层上的金属栅极。 金属栅极依次包括金属栅极功能层，氧吸收元件势垒层，金属栅极氧吸收层，金属栅极阻挡层和多晶硅层。 为了防止外部氧气进入界面层并在退火过程中吸收界面层中的氧气，使得界面层减薄到较薄，并且金属栅极氧吸收层被引入金属栅极中 MOS器件的EOT有效减少; 同时通过添加氧吸收元件阻挡层，防止“氧吸收元件”扩散到高k栅介质层中并对其产生不利影响; 以这种方式，可以更容易地集成高k /金属栅极系统，并且可以相应地进一步改善器件的性能。

公开(公告)号：US20110227163A1

公开(公告)日：2011-09-22

申请号：US13061555

申请日：2010-06-23

申请人： Wengwu Wang ,  Shijie Chen ,  Kai Han ,  Xiaolei Wang ,  Dapeng Chen

发明人： Wengwu Wang ,  Shijie Chen ,  Kai Han ,  Xiaolei Wang ,  Dapeng Chen

IPC分类号： H01L27/092

CPC分类号： H01L21/82345 ,  H01L21/28202 ,  H01L21/823462 ,  H01L21/823842 ,  H01L21/823857 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517

摘要： The present invention relates to a semiconductor device. Interface layers of different thickness or different materials are used in the NMOS region and the PMOS region of the semiconductor substrate, which not only effectively reduce EOT of the device, especially EOT of the PMOS device, but also increase the electron mobility of the device, especially the electron mobility of the NMOS device, thereby effectively improving the overall performance of the device.

摘要翻译： 本发明涉及一种半导体器件。 在半导体衬底的NMOS区域和PMOS区域中使用不同厚度或不同材料的界面层，其不仅有效地减少器件的EOT，特别是PMOS器件的EOT，而且还增加器件的电子迁移率， 特别是NMOS器件的电子迁移率，从而有效地提高器件的整体性能。

公开(公告)号：US08624325B2

公开(公告)日：2014-01-07

申请号：US13059092

申请日：2010-06-23

申请人： Wang Wenwu ,  Shijie Chen ,  Xiaolei Wang ,  Kai Han ,  Dapeng Chen

发明人： Wang Wenwu ,  Shijie Chen ,  Xiaolei Wang ,  Kai Han ,  Dapeng Chen

IPC分类号： H01L21/70

CPC分类号： H01L21/823864 ,  H01L21/823842

摘要： The present invention provides a semiconductor device, comprising: a semiconductor substrate having a first region and a second region; a first gate structure belong to a PMOS device on the first region; a second gate structure belong to an nMOS device on the second region; a multiple-layer first sidewall spacer on sidewalls of the first gate structure, wherein a layer of the multiple-layer first sidewall spacer adjacent to the first gat structure is an oxide layer; a multiple-layer second sidewall spacer on sidewalls of the second gate structure, wherein a layer of the multiple layers of second sidewall spacer adjacent to the first gat structure is a nitride layer. Application of the present invention may alleviate the oxygen vacancy in a high-k gate dielectric in a pMOS device, and further avoid the problem of EOT growth of an nMOS device during the high-temperature thermal treatment process, and therefore effectively improve the overall performance of the high-k gate dielectric CMOS device.

摘要翻译： 本发明提供一种半导体器件，包括：具有第一区域和第二区域的半导体衬底; 第一栅极结构属于第一区域上的PMOS器件; 第二栅极结构属于第二区域上的nMOS器件; 在所述第一栅极结构的侧壁上的多层第一侧壁间隔物，其中与所述第一沟槽结构相邻的所述多层第一侧壁间隔物的层是氧化物层; 在所述第二栅极结构的侧壁上的多层第二侧壁间隔物，其中与所述第一间隙结构相邻的多层第二侧壁间隔层是氮化物层。 本发明的应用可以减轻pMOS器件中的高k栅介质中的氧空位，并且进一步避免了在高温热处理过程中nMOS器件的EOT生长的问题，因此有效地提高了整体性能 的高k栅介质CMOS器件。