公开(公告)号：US20110149470A1

公开(公告)日：2011-06-23

申请号：US12974743

申请日：2010-12-21

申请人： Kang Heon Hur ,  Hyun Tae Kim ,  Doo Young Kim ,  Eun Sang Na ,  Joon Hwan Kwag ,  Mi Young Kim ,  Byung Gyun Kim ,  Byung Jun Jeon

发明人： Kang Heon Hur ,  Hyun Tae Kim ,  Doo Young Kim ,  Eun Sang Na ,  Joon Hwan Kwag ,  Mi Young Kim ,  Byung Gyun Kim ,  Byung Jun Jeon

IPC分类号： H01G4/12 ,  H01G7/00

CPC分类号： H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  Y10T29/435

摘要： Provided are a multilayer ceramic capacitor and a manufacturing method thereof, which can stably secure capacitance and prevent cracking caused by the diffusion of an electrode material. The multilayer ceramic capacitor includes a capacitor body where an inner electrode including a first electrode material and a dielectric layer are alternately laminated, and an outer electrode disposed on an outer surface of the capacitor body and electrically connected to the inner electrode, the outer electrode including a second electrode material. A diffusion layer having a length exceeding 1 μm in which the first and second electrode materials are mixed is provided at a region where the inner electrode and the outer electrode are connected to each other.

摘要翻译： 提供一种多层陶瓷电容器及其制造方法，其可以稳定地确保电容并且防止由电极材料扩散引起的开裂。 多层陶瓷电容器包括电容器主体，其中包括第一电极材料和电介质层的内部电极交替层叠，以及外部电极，设置在电容器主体的外表面上并电连接到内部电极，外部电极包括 第二电极材料。 在内电极和外电极彼此连接的区域上设置有长度超过1μm的第一和第二电极材料混合的扩散层。

公开(公告)号：US20110149471A1

公开(公告)日：2011-06-23

申请号：US12976500

申请日：2010-12-22

申请人： Kang Heon HUR ,  Byung Gyun Kim ,  Sang Hoon Kwon ,  Doo Young Kim ,  Hyun Tae Kim ,  Mi Young Kim ,  Eun Sang Na ,  Jae Joon Lee

发明人： Kang Heon HUR ,  Byung Gyun Kim ,  Sang Hoon Kwon ,  Doo Young Kim ,  Hyun Tae Kim ,  Mi Young Kim ,  Eun Sang Na ,  Jae Joon Lee

IPC分类号： H01G4/12 ,  H01G7/00

CPC分类号： H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G13/00 ,  Y10T29/43

摘要： There is provided a multilayer ceramic capacitor including: a capacitor main body formed by alternately stacking an internal electrode including an internal electrode-forming material and a dielectric layer; and an external electrode formed on the external surface of the capacitor to be electrically connected to the internal electrode and having an external electrode-forming material, wherein the internal electrode includes a non-diffusion layer including the external electrode-forming material of 2 vol % to 20 vol % and a diffusion layer made of the external electrode-forming material on at least one of the both ends of the non-diffusion layer.The multilayer ceramic capacitor capable of preventing cracking due to the diffusion of electrode materials while stably securing capacitance and the method of fabricating the same can be provided.

摘要翻译： 提供了一种多层陶瓷电容器，包括：电容器主体，其通过交替堆叠包括内部电极形成材料和电介质层的内部电极而形成; 以及形成在所述电容器的外表面上以与内部电极电连接并具有外部电极形成材料的外部电极，其中所述内部电极包括包含2体积％的所述外部电极形成材料的非扩散层， 至20体积％以及由非扩散层的两端中的至少一方形成的外部电极形成材料的扩散层。 可以提供能够防止电极材料的扩散同时稳定地保持电容的开裂的多层陶瓷电容器及其制造方法。

公开(公告)号：US20110141658A1

公开(公告)日：2011-06-16

申请号：US12852254

申请日：2010-08-06

申请人： Eun Sang NA ,  Doo Young Kim ,  Byung Gyun Kim ,  Hyun Tae Kim ,  Kyoung Jin Jun ,  Mi Young Kim ,  Hye Young Choi

发明人： Eun Sang NA ,  Doo Young Kim ,  Byung Gyun Kim ,  Hyun Tae Kim ,  Kyoung Jin Jun ,  Mi Young Kim ,  Hye Young Choi

IPC分类号： H01G4/06

CPC分类号： H01G4/2325 ,  H01G4/12 ,  H01G4/30

摘要： Disclosed is a multilayer ceramic capacitor. The multilayer ceramic capacitor includes a sintered ceramic body, a plurality of first internal electrodes and a plurality of second internal electrodes formed inside the sintered ceramic body, the first and second internal electrodes having ends alternately and respectively exposed to side surfaces of the sintered ceramic body, and first and second external electrodes formed on the side surfaces of the ceramic body and electrically connected to the first and second internal electrodes, the first and second external electrodes each including a plurality of pores with an average pore size of 2 μm to 5 μm and having a porosity of 2% to 10%.

摘要翻译： 公开了一种多层陶瓷电容器。 多层陶瓷电容器包括烧结陶瓷体，多个第一内部电极和形成在烧结陶瓷体内部的多个第二内部电极，第一和第二内部电极具有交替地并且分别暴露于烧结陶瓷体的侧表面的端部 以及形成在陶瓷体的侧面上并电连接到第一和第二内部电极的第一和第二外部电极，第一和第二外部电极各自包括平均孔径为2μm至5μm的多个孔 孔隙率为2％〜10％。

公开(公告)号：US08634180B2

公开(公告)日：2014-01-21

申请号：US13302375

申请日：2011-11-22

申请人： Hyun Tae Kim ,  Jin Ju Park ,  Se Hyun Kim ,  Doo Young Kim ,  Kyung Nam Hwang

发明人： Hyun Tae Kim ,  Jin Ju Park ,  Se Hyun Kim ,  Doo Young Kim ,  Kyung Nam Hwang

IPC分类号： H01G4/008

CPC分类号： H01G4/008 ,  H01G4/2325 ,  H01G4/30

摘要： There is provided a multi-layered ceramic capacitor having a dual layer-electrode structure formed by applying a dual layer of electrode paste to the multi-layered ceramic capacitor. The multi-layered ceramic capacitor having a dual layer-electrode structure includes a capacitor body having a preset length and width and having a plurality dielectric layers stacked therein, an internal electrode unit formed on the plurality of dielectric layers and having a preset capacitance, and an external electrode unit including first external electrodes respectively formed on both sides of the capacitor body to be electrically connected to internal electrodes, and second external electrodes formed on the first external electrodes.

摘要翻译： 提供一种多层陶瓷电容器，其具有通过将双层电极浆料施加到多层陶瓷电容器而形成的双层电极结构。 具有双层电极结构的多层陶瓷电容器包括具有预设长度和宽度的电容器体，并且其中堆叠有多个电介质层，形成在多个电介质层上并具有预设电容的内部电极单元，以及 外部电极单元包括分别形成在电容器主体的两侧以与内部电极电连接的第一外部电极，以及形成在第一外部电极上的第二外部电极。

公开(公告)号：US10219666B2

公开(公告)日：2019-03-05

申请号：US15396834

申请日：2017-01-03

申请人： Hyun Tae Kim

发明人： Hyun Tae Kim

IPC分类号： A47L9/20 ,  A47L9/12 ,  B01D46/04 ,  A47L5/28 ,  A47L9/14 ,  A47L5/36 ,  B01D46/00

摘要： A dust remover for a vacuum cleaner is provided inside a filter and is rotated by a motor. The dust remover includes: a rigid rotary member perpendicularly coupled to an output shaft of the motor to be rotated according to a rotation of the output shaft; a rotating buffer member assembled with an end portion of the rigid rotary member to be rotatable around a rotary shaft that is in parallel with the output shaft; a striking member having an end portion fixed to the rotating buffer member and another end portion contacting the filter; and an elastic member having an end portion coupled to the rotating buffer member and another end portion coupled to the rigid rotary member so as to apply an elastic recovery force to the rotating buffer member to rotate in a direction in which the rigid rotary member rotates.

公开(公告)号：US20120043116A1

公开(公告)日：2012-02-23

申请号：US13211596

申请日：2011-08-17

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H01L23/49833 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/19107

摘要： Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB.

摘要翻译： 这里公开了由诸如硅，玻璃或陶瓷的脆性材料制成的印刷电路板组件，并且设置有将其与外部连接构件电连接的连接器，以及用于模制印刷电路板组件的方法，其中印刷电路板 通过向其上施加聚合物树脂来模塑组装以赋予印刷电路板组件的硬度，并且将其连接到外部连接构件的电极端子暴露于外部。 这里公开的是内插器的互连结构，通过焊接点电连接到主印刷电路板（PCB）的互连结构插入在插入件和焊点之间，以防止或减少焊点上的应力集中，引起 通过插入器和主PCB之间的系数热膨胀差异。

公开(公告)号：US20110113755A1

公开(公告)日：2011-05-19

申请号：US13003783

申请日：2008-07-18

申请人： Hyun Tae Kim

发明人： Hyun Tae Kim

IPC分类号： F01N3/035 ,  F01N3/01

CPC分类号： F01N3/022 ,  B01D46/0005 ,  B01D46/0027 ,  B01D46/0032 ,  B01D46/42 ,  B01D2275/30 ,  F01N3/0212 ,  F01N3/035 ,  F01N3/0821 ,  F01N3/2066 ,  F01N2240/20 ,  F01N2330/22 ,  Y02A50/2325

摘要： A filter device for filtering automobile exhaust gas includes a case, front and rear support flanges mounted inside the case, and the filter member mounted between the front and rear support flanges. The front and rear support flanges are fixed vertically to the front and rear end portions of the filter member, respectively. The filter member includes a laminated or rolled-up metallic foam filter and a metallic mat or a jacket wrapping around the metallic foam filter. The porous pipe mounted inside the filter member is formed with a plurality of holes. The porous pipe is structured such that the width thereof decreases gradually towards the rear end portion or increase gradually towards the rear end portion, or the holes in the rear end portion are smaller, or a conical member is inserted in the inside space, or a pyramidal member is inserted in the inside space.

摘要翻译： 用于过滤汽车废气的过滤装置包括壳体，安装在壳体内的前后支撑凸缘和安装在前后支撑凸缘之间的过滤构件。 前后支撑凸缘分别垂直于过滤构件的前端部和后端部固定。 过滤构件包括层压或卷起的金属泡沫过滤器和围绕金属泡沫过滤器缠绕的金属垫或护套。 安装在过滤构件内的多孔管形成有多个孔。 多孔管的结构使得其宽度朝向后端部逐渐减小或朝向后端部逐渐增大，或者后端部的孔较小，或者锥形部件插入内侧空间，或 金字塔形构件插入内部空间。

公开(公告)号：US09197026B2

公开(公告)日：2015-11-24

申请号：US13211652

申请日：2011-08-17

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong

IPC分类号： H01R43/00 ,  H05K13/00 ,  H01R43/24

CPC分类号： H01R43/24 ,  Y10T29/49147

摘要： Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.

摘要翻译： 公开了一种印刷电路板组件PBA，其上安装有用于与外部连接元件电连接的连接器。 这种组件可以用PBA的模制方法形成，其包括将聚合物树脂施加到PBA以模制PBA以便提供刚度。 根据本公开的上述PBA成型方法是包括PCB和连接在PCB上以将其与外部连接元件电连接的连接器的PBA的成型方法。 该方法包括将连接器与连接器盖组合，将树脂施加到与连接器盖结合的PBA上，以执行PBA的成型，以及将连接器盖与模制的PBA分离，以露出用于外部连接元件的电极端子。

公开(公告)号：US08350162B2

公开(公告)日：2013-01-08

申请号：US12659556

申请日：2010-03-12

申请人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

发明人： Hyun Tae Kim ,  Tae Sang Park ,  Young Jun Moon ,  Soon Min Hong ,  Hyo Young Shin

IPC分类号： H05K1/11

CPC分类号： H05K3/363 ,  H05K3/3457 ,  H05K3/3494 ,  H05K2201/09709 ,  H05K2201/10666 ,  H05K2203/0195 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/49213

摘要： Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.

摘要翻译： 公开了一种使用焊料凸块布置电路板的电路板的连接结构。 电路板连接结构包括制备在两个电路板中的一个上的焊料凸块和形成在另一个电路板上的穿孔部分以接收焊料凸块。 将两个电路板朝向彼此并将焊料凸块插入穿孔部分中，期望布置电路板。

公开(公告)号：US07365825B2

公开(公告)日：2008-04-29

申请号：US11105367

申请日：2005-04-14

申请人： Hyun Tae Kim

发明人： Hyun Tae Kim

IPC分类号： G02F1/13

CPC分类号： H01L27/124 ,  G02F1/136259 ,  G02F2001/136263 ,  H01L27/1214

摘要： An LCD device including: a gate line on a substrate along a first direction; a data line in a second direction perpendicular to the gate line to define a unit pixel region, wherein the data line has recesses on a first side of the data line; a repair pattern having ends crossing the data line at the recesses of the data line; a thin film transistor adjacent to a crossing of the gate line and the data line, the thin film transistor including a semiconductor layer, a gate electrode, a drain electrode and a source electrode; a passivation layer over an entire surface of the substrate including the thin film transistor; and a pixel electrode connected to the drain electrode through the passivation layer.

摘要翻译： 一种LCD装置，包括：沿着第一方向的衬底上的栅极线; 在垂直于所述栅极线的第二方向上的数据线，以限定单位像素区域，其中所述数据线在所述数据线的第一侧上具有凹槽; 具有在数据线的凹部处与数据线交叉的端部的修复图案; 与栅极线和数据线的交叉点相邻的薄膜晶体管，所述薄膜晶体管包括半导体层，栅电极，漏电极和源电极; 在包括薄膜晶体管的衬底的整个表面上的钝化层; 以及通过钝化层连接到漏电极的像素电极。