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    MULTILAYER CERAMIC CAPACITOR AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF FABRICATING THE SAME 审中-公开
    多层陶瓷电容器及其制造方法

    公开(公告)号：US20110149471A1

    公开(公告)日：2011-06-23

    申请号：US12976500

    申请日：2010-12-22

    申请人： Kang Heon HUR ,  Byung Gyun Kim ,  Sang Hoon Kwon ,  Doo Young Kim ,  Hyun Tae Kim ,  Mi Young Kim ,  Eun Sang Na ,  Jae Joon Lee

    发明人： Kang Heon HUR ,  Byung Gyun Kim ,  Sang Hoon Kwon ,  Doo Young Kim ,  Hyun Tae Kim ,  Mi Young Kim ,  Eun Sang Na ,  Jae Joon Lee

    IPC分类号： H01G4/12 ,  H01G7/00

    CPC分类号： H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G13/00 ,  Y10T29/43

    摘要： There is provided a multilayer ceramic capacitor including: a capacitor main body formed by alternately stacking an internal electrode including an internal electrode-forming material and a dielectric layer; and an external electrode formed on the external surface of the capacitor to be electrically connected to the internal electrode and having an external electrode-forming material, wherein the internal electrode includes a non-diffusion layer including the external electrode-forming material of 2 vol % to 20 vol % and a diffusion layer made of the external electrode-forming material on at least one of the both ends of the non-diffusion layer.The multilayer ceramic capacitor capable of preventing cracking due to the diffusion of electrode materials while stably securing capacitance and the method of fabricating the same can be provided.

    摘要翻译： 提供了一种多层陶瓷电容器，包括：电容器主体，其通过交替堆叠包括内部电极形成材料和电介质层的内部电极而形成; 以及形成在所述电容器的外表面上以与内部电极电连接并具有外部电极形成材料的外部电极，其中所述内部电极包括包含2体积％的所述外部电极形成材料的非扩散层， 至20体积％以及由非扩散层的两端中的至少一方形成的外部电极形成材料的扩散层。 可以提供能够防止电极材料的扩散同时稳定地保持电容的开裂的多层陶瓷电容器及其制造方法。

    Micro drill and method of fabricating the same
    2.
    发明授权
    Micro drill and method of fabricating the same 有权
    微型钻头及其制造方法

    公开(公告)号：US08834077B2

    公开(公告)日：2014-09-16

    申请号：US13003293

    申请日：2009-06-23

    申请人： Tae Sik Yoon ,  Soon Jin Cho ,  Seung Hyun Cho ,  Jae Joon Lee

    发明人： Tae Sik Yoon ,  Soon Jin Cho ,  Seung Hyun Cho ,  Jae Joon Lee

    IPC分类号： B23B51/02 ,  B23P15/32 ,  C22C38/08 ,  B22F7/06 ,  B22F5/00

    CPC分类号： B22F7/062 ,  B22F2005/001 ,  B22F2998/00 ,  B23B51/02 ,  B23B2251/426 ,  B23P15/32 ,  C22C38/08 ,  Y10T408/03 ,  Y10T408/78 ,  Y10T408/907 ,  Y10T408/9097 ,  B22F2207/20 ,  B22F5/06 ,  B22F5/10

    摘要： A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.

    摘要翻译： 一种微钻的制造方法，其特征在于，包括用于加工孔的钻头部和固定于马达的柄部，所述钻头部和所述柄部由不同的材料构成。 该方法包括以下步骤：在其一端形成具有凹部的钻头成形粉末压块，并且形成具有突出部的柄部形成用粉末压块，所述突起旨在嵌入到钻头成形用凹部 粉末压块，形成钻头成形粉末压块和柄部分成型粉末压块的组件，突起嵌入凹槽中，同时烧结钻头成形粉末压块和柄部分成型的组件 粉末紧凑。

    Multilayer ceramic electronic component and method for manufacturing the same
    3.
    发明授权
    Multilayer ceramic electronic component and method for manufacturing the same 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US08587920B2

    公开(公告)日：2013-11-19

    申请号：US13480129

    申请日：2012-05-24

    申请人： Jae Joon Lee ,  Jae Yeol Choi ,  Hyoung Wook Lim ,  Sung Chul Bae

    发明人： Jae Joon Lee ,  Jae Yeol Choi ,  Hyoung Wook Lim ,  Sung Chul Bae

    IPC分类号： H01G4/30

    CPC分类号： H01G4/005 ,  H01G4/12 ,  H01G4/30

    摘要： Disclosed herein are a multilayer ceramic electronic component and a method for manufacturing the same. The multilayer ceramic electronic component includes a multilayer body in which dielectric layers and internal electrode layers are alternately stacked and external electrodes, wherein a portion in the internal electrode layers positioned in a marginal portion in which vertically neighboring internal electrode layers in the multilayer body is not overlapped with each other has a thickness thicker than that of a portion of the internal electrode layer positioned in an overlapped portion in which the vertically neighboring internal electrode layers are overlapped with each other, such that an accumulated stepped height difference in the marginal portion is reduced.

    摘要翻译： 本文公开了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括交替层叠有电介质层和内部电极层的多层体，外部电极，其中内部电极层中位于多层体中的垂直相邻的内部电极层的边缘部分的部分不是 彼此重叠的厚度比位于重叠部分的内部电极层的一部分厚度更厚，其中垂直相邻的内部电极层彼此重叠，使得边缘部分中累积的台阶高度差减小 。

    DEPTH MAP CODING AND DECODING APPARATUS AND METHOD
    4.
    发明申请
    DEPTH MAP CODING AND DECODING APPARATUS AND METHOD 有权
    深度地图编码和解码设备和方法

    公开(公告)号：US20120183066A1

    公开(公告)日：2012-07-19

    申请号：US13350250

    申请日：2012-01-13

    申请人： Kwan Jung OH ,  Jae Joon Lee ,  Du Sik Park ,  Ho Cheon Wey

    发明人： Kwan Jung OH ,  Jae Joon Lee ,  Du Sik Park ,  Ho Cheon Wey

    IPC分类号： H04N7/26 ,  H04N7/32

    CPC分类号： H04N19/132 ,  H04N13/10 ,  H04N19/107 ,  H04N19/139 ,  H04N19/14 ,  H04N19/176 ,  H04N19/597

    摘要： An apparatus and method for coding and decoding a depth image are provided. The depth image coding apparatus predicts directivity of a current macro block using coded adjacent macro blocks. An intra-prediction mode that intra-codes the current macro block using the predicted directivity is included in intra-candidate coding modes. Priorities of intra-candidate coding modes and inter-candidate coding modes are arranged according to characteristics of a color image and coded. As a result, coding efficiency for a depth image may be increased.

    摘要翻译： 提供了一种用于对深度图像进行编码和解码的装置和方法。 深度图像编码装置使用编码的相邻宏块来预测当前宏块的方向性。 使用预测方向性对当前宏块进行编码的帧内预测模式包括在候选内编码模式中。 候选编码模式和候选间编码模式的优先级根据彩色图像的特性进行编排。 结果，可以增加深度图像的编码效率。

    Image processing apparatus and method
    6.
    发明申请
    Image processing apparatus and method 有权
    图像处理装置及方法

    公开(公告)号：US20120039528A1

    公开(公告)日：2012-02-16

    申请号：US13064921

    申请日：2011-04-26

    申请人： Seok Lee ,  Jae Joon Lee ,  Ho Cheon Wey ,  Seung Sin Lee

    发明人： Seok Lee ,  Jae Joon Lee ,  Ho Cheon Wey ,  Seung Sin Lee

    IPC分类号： G06K9/00

    CPC分类号： H04N19/00769 ,  G06T9/00 ,  H04N13/00 ,  H04N13/106 ,  H04N13/161 ,  H04N19/597

    摘要： Provided is an image processing apparatus. In the case of a multi-view image, the image processing apparatus may warp a color image and/or a depth image of a reference view to correspond to a target view. An occlusion region may be extracted by comparing the warped color image and/or depth image of the reference view with a color image and/or a depth image of the target view. The image processing apparatus may encode the extracted occlusion region information without loss, and decrease an amount of data in the multi-view image.

    摘要翻译： 提供了一种图像处理装置。 在多视图图像的情况下，图像处理装置可以使参考视图的彩色图像和/或深度图像变形以对应于目标视图。 可以通过将参考视图的翘曲的彩色图像和/或深度图像与目标视图的彩色图像和/或深度图像进行比较来提取遮挡区域。 图像处理装置可以对丢弃的提取的遮挡区域信息进行编码，并减少多视点图像中的数据量。

    Printed circuit board and method of manufacturing the same
    7.
    发明申请
    Printed circuit board and method of manufacturing the same 失效
    印刷电路板及其制造方法

    公开(公告)号：US20110061905A1

    公开(公告)日：2011-03-17

    申请号：US12654446

    申请日：2009-12-18

    申请人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    发明人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    IPC分类号： H05K1/03 ,  H05K3/36

    CPC分类号： H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

    摘要： There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

    摘要翻译： 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

    Printed circuit board and method of manufacturing the same
    9.
    发明授权
    Printed circuit board and method of manufacturing the same 失效
    印刷电路板及其制造方法

    公开(公告)号：US08541096B2

    公开(公告)日：2013-09-24

    申请号：US12654446

    申请日：2009-12-18

    申请人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    发明人： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

    IPC分类号： H05K1/03 ,  H05K7/02

    CPC分类号： H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

    摘要： There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

    摘要翻译： 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。