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公开(公告)号：US09735623B2
公开(公告)日：2017-08-15
申请号：US13473062
申请日：2012-05-16
申请人： Kang-Ho Byun , Kyung-Woo Lee , Young-Min Lee , Se-Ho Park , Yu-Su Kim , Sung-Ku Yeo
发明人： Kang-Ho Byun , Kyung-Woo Lee , Young-Min Lee , Se-Ho Park , Yu-Su Kim , Sung-Ku Yeo
CPC分类号： H02J50/12 , B60L11/182 , H02J5/005 , H02J7/025 , H02J17/00 , H02J50/40 , H02J50/60 , H02J50/80 , H04B5/0037
摘要： A method and power transmitter for efficiently controlling power transmission to one or more power receivers in a wireless multi-power transmission system are provided. The method includes performing, when a predetermined measurement cycle arrives, a load measurement; comparing a current load measurement value with a previous load measurement value; determining whether the current load measurement value is increased over the previous load measurement value by at least as much as a first predetermined threshold; gradually increasing, when the load measurement value is increased over the previous load measurement value by at least as much as the first threshold, a transmission power value until a request for a subscription to a wireless multi-power transmission network from a power reception target within a predetermined time limit; and stopping, when the request for the subscription is not received before the time limit is exceeded, power transmission to the power reception target.
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公开(公告)号：US09762079B2
公开(公告)日：2017-09-12
申请号：US13474338
申请日：2012-05-17
申请人： Kang-Ho Byun , Kyung-Woo Lee , Young-Min Lee , Se-Ho Park , Yu-Su Kim , Sung-Ku Yeo
发明人： Kang-Ho Byun , Kyung-Woo Lee , Young-Min Lee , Se-Ho Park , Yu-Su Kim , Sung-Ku Yeo
CPC分类号： H02J7/025 , H02J7/0004 , H02J7/0027 , H02J50/12 , H02J50/40 , H02J50/80
摘要： An apparatus and method are provided for transmitting and receiving power for wireless power transmission. A power transmitting apparatus includes a power supplier for generating power; a resonator for transmitting the power generated by the power supplier to a plurality of power receiving apparatuses; and a controller for determining whether a power transmission to a new power receiving apparatus is possible using a power receiving apparatus management table, when the new power receiving apparatus is detected while the power transmissions of the plurality of power receiving apparatuses are being performed, and controlling the resonator to transmit power to the new power receiving apparatus, when the power transmission to the new receiving apparatus is possible. The power transmitting apparatus stably supplies power to a plurality of power receiving apparatuses by determining power transmission states of the plurality of power receiving apparatuses.
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公开(公告)号：US08630096B2
公开(公告)日：2014-01-14
申请号：US13050378
申请日：2011-03-17
申请人： Yu-Su Kim , Kyu-Sub Kwak , Young-Min Lee , Shi-Yun Cho , Jae-Hyuck Lee , Se-Ho Park , Youn-Ho Choi , Seung-Woo Han , Ji-Hyun Jung
发明人： Yu-Su Kim , Kyu-Sub Kwak , Young-Min Lee , Shi-Yun Cho , Jae-Hyuck Lee , Se-Ho Park , Youn-Ho Choi , Seung-Woo Han , Ji-Hyun Jung
CPC分类号： H05K3/323 , H05K1/189 , H05K2201/10159
摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.
摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。
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公开(公告)号：US20110155426A1
公开(公告)日：2011-06-30
申请号：US12974763
申请日：2010-12-21
申请人： Kyung-Wan PARK , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Chol , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
发明人： Kyung-Wan PARK , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Chol , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
摘要： An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
摘要翻译： 公开了一种嵌入式电路板，其包括形成有多个空腔的第一覆铜层压板，并且包括嵌入空腔中的具有不同厚度的多个芯片，设置在该空腔中的第二覆铜层压板，以使第一覆铜层压板达到 与芯片; 以及设置在第一和第二覆铜层压板的上表面上的树脂涂覆铜箔。
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公开(公告)号：US20110157858A1
公开(公告)日：2011-06-30
申请号：US12974673
申请日：2010-12-21
申请人： Ji-Hyun Jung , Byung-Jik Kim , Shi-Yun Cho , Ho-Seong Seo , Kyung-Wan Park , Yeun-Ho Choi , Yu-Su Kim , Seok-Myong Kang
发明人： Ji-Hyun Jung , Byung-Jik Kim , Shi-Yun Cho , Ho-Seong Seo , Kyung-Wan Park , Yeun-Ho Choi , Yu-Su Kim , Seok-Myong Kang
IPC分类号： H05K1/14
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2924/00014 , H01L2924/01322 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a System-In-Package (SIP) having embedded circuit boards in which boards are electrically connected and a plurality of chips are embedded in a board in a stacked manner. The SIP includes a first board on a surface of which a first circuit is formed, a second board which is provided on a top surface of the first board in a stacked manner and includes a plurality of chips embedded therein in a stacked manner, and a third board which is provided on a top surface of the second board in a stacked manner and on a surface of which a second circuit is formed.
摘要翻译： 提供了一种具有嵌入式电路板的系统级封装（SIP），其中板电连接，并且多个芯片以堆叠的方式嵌入在板中。 SIP包括在其表面上形成第一电路的第一板，以堆叠方式设置在第一板的顶表面上并且包括以堆叠方式嵌入其中的多个芯片的第二板，以及 第三板，其以层叠的方式设置在第二板的顶表面上，并且在其表面上形成第二电路。
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公开(公告)号：US08552302B2
公开(公告)日：2013-10-08
申请号：US12974763
申请日：2010-12-21
申请人： Kyung-Wan Park , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Choi , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
发明人： Kyung-Wan Park , Shi-Yun Cho , Byung-Jik Kim , Ho-Seong Seo , Youn-Ho Choi , Yu-Su Kim , Seok-Myong Kang , Ji-Hyun Jung
IPC分类号： H05K1/03
摘要： An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
摘要翻译： 公开了一种嵌入式电路板，其包括形成有多个空腔的第一覆铜层压板，并且包括嵌入空腔中的具有不同厚度的多个芯片，设置在该空腔中的第二覆铜层压板，以使第一覆铜层压板达到 与芯片; 以及设置在第一和第二覆铜层压板的上表面上的树脂涂覆铜箔。
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