公开(公告)号：US20100140782A1

公开(公告)日：2010-06-10

申请号：US12633433

申请日：2009-12-08

申请人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-sub Kwak ,  Youn-Ho Choi

发明人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-sub Kwak ,  Youn-Ho Choi

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H05K1/188 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0554

摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.

摘要翻译： 提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。 多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。 连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。 导电凸块通过形成在接触孔中的导体层电连接。

公开(公告)号：US08630096B2

公开(公告)日：2014-01-14

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su Kim ,  Kyu-Sub Kwak ,  Young-Min Lee ,  Shi-Yun Cho ,  Jae-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/00 ,  H05K3/32

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。

公开(公告)号：US20130042904A1

公开(公告)日：2013-02-21

申请号：US13569852

申请日：2012-08-08

申请人： June-Hyeon AHN ,  Kyu-Sub Kwak ,  Ji-Hoon Jung ,  Shin-Hee Cho

发明人： June-Hyeon AHN ,  Kyu-Sub Kwak ,  Ji-Hoon Jung ,  Shin-Hee Cho

IPC分类号： H01L31/048

CPC分类号： H01L31/0516 ,  H01L31/048 ,  Y02E10/50

摘要： A solar cell module includes a window unit integrally formed with a transparent substrate unit, a plurality of solar cells, and an electrode unit electrically connected to the solar cells. The solar cells and the electrode unit are provided in the transparent substrate unit.

摘要翻译： 太阳能电池模块包括与透明基板单元整体形成的窗单元，多个太阳能电池和电连接到太阳能电池的电极单元。 太阳能电池和电极单元设置在透明基板单元中。

公开(公告)号：US20080192449A1

公开(公告)日：2008-08-14

申请号：US12028864

申请日：2008-02-11

申请人： Dong-Churl Kim ,  Shi-Yun Cho ,  Hong-Kweun Kim ,  Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

发明人： Dong-Churl Kim ,  Shi-Yun Cho ,  Hong-Kweun Kim ,  Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

IPC分类号： H05K7/00

CPC分类号： H05K9/0022 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/10318 ,  H05K2203/1316 ,  H01L2224/0401

摘要： An electric circuit package includes: a printed circuit substrate having an insulating layer and conductive pattern layers formed on an upper surface of the insulating layer; at least one of electronic parts disposed on an upper surface of the printed circuit substrate; at least one of conductive pins electrically connected to an conductive pattern layer providing grounding among the conductive pattern layers; and a molding member formed on the insulating layer in such a manner that the conductive pins and the electric parts are buried in the molding member, wherein each conductive pin has an upper surface exposed to an upper part of the molding member.

摘要翻译： 电路封装包括：印刷电路基板，其具有绝缘层和形成在所述绝缘层的上表面上的导电图案层; 设置在印刷电路基板的上表面上的电子部件中的至少一个; 至少一个导电引脚与导电图案层电连接，在导电图案层之间提供接地; 以及模制构件，其形成在所述绝缘层上，使得所述导电销和所述电气部件被埋在所述模制构件中，其中每个导电销具有暴露于所述模制构件的上部的上表面。

公开(公告)号：US06917640B2

公开(公告)日：2005-07-12

申请号：US10447017

申请日：2003-05-28

申请人： Kyu-Sub Kwak

发明人： Kyu-Sub Kwak

IPC分类号： H01S3/08 ,  H01S5/00 ,  H01S5/028 ,  H01S5/183 ,  H01S5/343

CPC分类号： H01S5/18311 ,  H01S5/18344 ,  H01S2301/176 ,  H01S2301/18

摘要： A vertical cavity surface emitting laser (VCSEL) is provided with an aperture for guiding a flow of electric currents. The aperture is defined by an oxide so that the aperture is formed to be substantially circular in shape. A method for fabricating the laser is also disclosed. The structure of the (VCSEL) makes it possible to control the oxidation rates of an oxidable layer in which an aperture is formed for guiding the flow of electric currents of a VCSEL, by forming a mesa trench of the VCSEL in a segmented structure which has a predetermined number of segments. Accordingly, it is possible to form an aperture approximately in a circular shape, so that the light emitting angle and shape of the VCSEL are easily controlled.

摘要翻译： 垂直腔表面发射激光器（VCSEL）设置有用于引导电流的孔。 孔由氧化物限定，使得孔形成为大致圆形的形状。 还公开了一种制造激光器的方法。 （VCSEL）的结构使得可以通过以分段结构形成VCSEL的台面沟槽来控制其中形成孔径的氧化层的氧化速率以引导VCSEL的电流， 预定数量的段。 因此，可以形成大致圆形的开口，从而容易地控制VCSEL的发光角度和形状。

公开(公告)号：US20120235880A1

公开(公告)日：2012-09-20

申请号：US13420152

申请日：2012-03-14

申请人： Joon-Il KIM ,  Shin-Hee CHO ,  Young-Min LEE ,  Jae-Hyuck LEE ,  Kyu-Sub KWAK ,  Sung-Ku YEO

发明人： Joon-Il KIM ,  Shin-Hee CHO ,  Young-Min LEE ,  Jae-Hyuck LEE ,  Kyu-Sub KWAK ,  Sung-Ku YEO

IPC分类号： H01Q1/24

CPC分类号： H01Q1/38 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01Q1/523 ,  H01Q5/40 ,  H01Q9/0414 ,  H01Q21/06 ,  H01Q21/293 ,  H01Q23/00

摘要： An ultrahigh-frequency package module is provided, including a first substrate having a plurality of power lines and a plurality of signal lines, and one or more second substrates provided on one surface of the first substrate and each being provided with at least one antenna. The second substrates are independently arranged one by one in a grid pattern along one surface of the first substrate.

摘要翻译： 提供了一种超高频封装模块，包括具有多个电源线和多个信号线的第一基板以及设置在第一基板的一个表面上并且每个设置有至少一个天线的一个或多个第二基板。 第二基板沿着第一基板的一个表面以格子图案独立地排列。

公开(公告)号：US20090040704A1

公开(公告)日：2009-02-12

申请号：US12188319

申请日：2008-08-08

申请人： Ho-Seong Seo ,  Young-Min Lee ,  Kyu-Sub Kwak

发明人： Ho-Seong Seo ,  Young-Min Lee ,  Kyu-Sub Kwak

IPC分类号： H05K1/00 ,  C23F1/00 ,  H05K5/00

CPC分类号： H05K3/4092 ,  H05K1/11 ,  H05K3/326 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2203/308 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155

摘要： A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.

摘要翻译： 印刷电路板包括芯层，形成在芯层上并具有形成在绝缘层的一部分上的空腔的绝缘层和形成在绝缘层上的电路图案，其中电路图案包括一个或多个外部端子 位于空腔上方。

公开(公告)号：US20070035323A1

公开(公告)日：2007-02-15

申请号：US11432064

申请日：2006-05-11

申请人： June-Hyeon Ahn ,  Young-Min Lee ,  Ho-Seong Seo ,  Kyu-Sub Kwak

发明人： June-Hyeon Ahn ,  Young-Min Lee ,  Ho-Seong Seo ,  Kyu-Sub Kwak

IPC分类号： G01R31/26

CPC分类号： H05K3/3442 ,  H05K1/145 ,  H05K2201/10454 ,  H05K2201/10492 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit module and its fabricating method are provided. The electronic circuit module includes a first board and a second board having printed circuit patterns formed on the respective surfaces, and an electronic device disposed between the first board and the second board and having electrodes connected to the first board and the second board through a soldering process.

摘要翻译： 提供电子电路模块及其制造方法。 电子电路模块包括：第一板和第二板，其具有形成在各个表面上的印刷电路图案;以及电子装置，其设置在第一板和第二板之间，并具有通过焊接连接到第一板和第二板的电极 处理。

公开(公告)号：US07160038B2

公开(公告)日：2007-01-09

申请号：US10922440

申请日：2004-08-19

申请人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

发明人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

IPC分类号： G02B6/36 ,  H01S5/00

CPC分类号： H01S5/0683 ,  G02B6/4206 ,  H01S5/02284 ,  H01S5/0264 ,  H01S5/183 ,  H01S5/423

摘要： A vertical cavity surface emitting laser (VCSEL) module includes a substrate provided with an etched region formed on a lower surface thereof, a plurality of layers, for photoproduction, laminated on an upper surface of the substrate, and a VCSEL for emitting the light upwards and downwards, wherein the VCSEL module monitors the output of the VCSEL by detecting the light emitted downwards from the VCSEL.

摘要翻译： 垂直腔表面发射激光器（VCSEL）模块包括：衬底，其设置有形成在其下表面上的蚀刻区域，多个层，用于光生产，层压在衬底的上表面上;以及VCSEL，用于向上发射光 并且向下，其中VCSEL模块通过检测从VCSEL向下发射的光来监视VCSEL的输出。

公开(公告)号：US20060091543A1

公开(公告)日：2006-05-04

申请号：US11100151

申请日：2005-04-06

申请人： Young-Min Lee ,  Kyu-Sub Kwak

发明人： Young-Min Lee ,  Kyu-Sub Kwak

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/10977 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a land grid array module comprising: a substrate; a plurality of active and passive components mounted on both sides of the substrate; and a molding compound for encapsulating the both sides of the substrate with the active and passive components mounted thereon. The land grid array module mounts the passive and active components on both sides of the substrate, thereby improving the integration of the circuit device. Also, the use of a thin film printed circuit board or a flexible printed circuit board with high rigidity as the substrate reduces the overall thickness of the land grid array module.

摘要翻译： 公开了一种地面栅格阵列模块，包括：基板; 安装在基板两侧的多个有源和无源元件; 以及用于将基板的两侧封装在其上的有源和无源部件的模塑料。 地面阵列模块将无源和有源部件安装在基板的两侧，从而改善电路装置的集成。 此外，使用具有高刚性的薄膜印刷电路板或柔性印刷电路板作为基板来降低焊盘栅格阵列模块的总体厚度。