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18 条记录 (耗时 0.025 秒)

    Method for forming porous film
    1.
    发明授权
    Method for forming porous film 有权
    多孔膜形成方法

    公开(公告)号：US07205030B2

    公开(公告)日：2007-04-17

    申请号：US10812420

    申请日：2004-03-30

    申请人： Kaori Misawa ,  Isao Matsumoto ,  Naofumi Ohashi ,  Koichi Abe ,  Haruaki Sakurai

    发明人： Kaori Misawa ,  Isao Matsumoto ,  Naofumi Ohashi ,  Koichi Abe ,  Haruaki Sakurai

    IPC分类号： C05D3/02

    CPC分类号： H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/3122 ,  H01L21/31695

    摘要： After applying a film-forming composition containing a polysiloxane, a pore-forming agent, an onium salt, and a solvent onto a semiconductor substrate, the solvent is evaporated from the film-forming composition in a first heat treatment. Then, a second heat treatment is carried out in an inert-gas atmosphere to promote the polymerization of the polysiloxane and thus form a polysiloxane resin film. Thereafter, a third heat treatment is carried out in an oxidizing-gas ambient to form pores in the polysiloxane resin film.

    摘要翻译： 在半导体基板上涂布含有聚硅氧烷，成孔剂，鎓盐和溶剂的成膜组合物之后，在第一次热处理中从成膜组合物中蒸发掉溶剂。 然后，在惰性气体气氛中进行第二次热处理，促进聚硅氧烷的聚合，从而形成聚硅氧烷树脂膜。 此后，在氧化气体环境中进行第三次热处理，以在聚硅氧烷树脂膜中形成孔。

    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
    7.
    发明授权
    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts 失效
    用于形成二氧化硅基涂膜的组合物，二氧化硅基涂膜及其制备方法和电子部件

    公开(公告)号：US07682701B2

    公开(公告)日：2010-03-23

    申请号：US11040119

    申请日：2005-01-24

    申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    IPC分类号： B32B9/04

    CPC分类号： C09D183/02 ,  C09D183/04 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

    摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

    摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
    8.
    发明授权
    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts 失效
    用于形成二氧化硅基涂膜的组合物，二氧化硅基涂膜及其制备方法和电子部件

    公开(公告)号：US07358300B2

    公开(公告)日：2008-04-15

    申请号：US10926321

    申请日：2004-08-26

    申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    IPC分类号： C08K5/17

    CPC分类号： H01L23/5329 ,  C09D183/02 ,  C09D183/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

    摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

    摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。