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    Resist composition and method of forming pattern therewith
    1.
    发明授权
    Resist composition and method of forming pattern therewith 有权
    抗蚀剂组合物和形成图案的方法

    公开(公告)号：US09017917B2

    公开(公告)日：2015-04-28

    申请号：US12535240

    申请日：2009-08-04

    申请人： Kaoru Iwato ,  Kazuto Kunita

    发明人： Kaoru Iwato ,  Kazuto Kunita

    IPC分类号： G03F7/039 ,  G03F7/004 ,  G03F7/075 ,  G03F7/20 ,  G03F7/30

    CPC分类号： G03F7/0046 ,  G03F7/0045 ,  G03F7/0397 ,  G03F7/0757 ,  G03F7/0758 ,  G03F7/2041 ,  G03F7/30

    摘要： A resist composition comprises two or more polymers containing a first polymer and a second polymer and a compound that when exposed to actinic rays or radiation, generates an acid, wherein when the resist composition is formed into a dry resist film, the mixing ratios of at least the first and second polymers in the resist film exhibit a gradient distribution such that the mixing ratios continuously change in entirety or partially in the direction of the depth from the surface of the resist film on the air side toward a support, and wherein the mixing ratio of the first polymer at a superior portion of the resist film is higher than that of the second polymer, while the mixing ratio of the second polymer at an inferior portion of the resist film is higher than that of the first polymer.

    摘要翻译： 抗蚀剂组合物包括含有第一聚合物和第二聚合物的两种或更多种聚合物和当暴露于光化射线或辐射时产生酸的化合物，其中当抗蚀剂组合物形成干燥抗蚀剂膜时， 抗蚀剂膜中的第一和第二聚合物的至少表现出梯度分布，使得混合比在空气侧的抗蚀剂膜的表面朝向载体的深度方向全部或部分地连续变化，并且其中混合 抗蚀剂膜的上部的第一聚合物的比例高于第二聚合物，而抗蚀剂膜的下部的第二聚合物的混合比高于第一聚合物的比例。

    Pattern forming method, chemical amplification resist composition and resist film
    2.
    发明授权
    Pattern forming method, chemical amplification resist composition and resist film 有权
    图案形成方法，化学放大抗蚀剂组合物和抗蚀剂膜

    公开(公告)号：US08722319B2

    公开(公告)日：2014-05-13

    申请号：US13245326

    申请日：2011-09-26

    申请人： Kaoru Iwato ,  Keita Kato

    发明人： Kaoru Iwato ,  Keita Kato

    IPC分类号： G03F7/26

    CPC分类号： G03F7/0382 ,  G03F7/0048 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40

    摘要： A pattern forming method includes: (i) forming a film from a chemical amplification resist composition that contains (A) a resin, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and (C) a tertiary alcohol; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.

    摘要翻译： 图案形成方法包括：（i）从化学放大抗蚀剂组合物形成膜，其包含（A）树脂，（B）在通过光化射线或辐射照射时能够产生酸的化合物和（C） 醇; （ii）曝光胶片; 和（iii）通过使用含有有机溶剂的显影剂进行显影。

    Positive resist composition and pattern formation method using the positive resist composition
    6.
    发明授权
    Positive resist composition and pattern formation method using the positive resist composition 有权
    使用正性抗蚀剂组合物的正性抗蚀剂组成和图案形成方法

    公开(公告)号：US07632623B2

    公开(公告)日：2009-12-15

    申请号：US11717083

    申请日：2007-03-13

    申请人： Kaoru Iwato ,  Kunihiko Kodama ,  Yuko Yoshida ,  Kei Yamamoto

    发明人： Kaoru Iwato ,  Kunihiko Kodama ,  Yuko Yoshida ,  Kei Yamamoto

    IPC分类号： G03F7/004 ,  G03F7/30

    CPC分类号： G03F7/0397 ,  G03F7/0045 ,  Y10S430/106 ,  Y10S430/111

    摘要： A positive resist composition comprising: a resin which increases solubility in an alkali developing solution by an action of an acid and comprises a repeating unit containing a lactone structure and a cyano group, a repeating unit containing a first group selected from groups represented by the formulae (pI) to (pV) as defined herein and a repeating unit containing a second group selected from groups represented by the formulae (pI) to (pV) as defined herein which is different from the first group; a compound which generates an acid upon irradiation of an actinic ray or a radiation; and a solvent.

    摘要翻译： 一种正性抗蚀剂组合物，其包含：通过酸的作用增加在碱性显影液中的溶解度的树脂，其包含含有内酯结构和氰基的重复单元，含有选自下式 （pI）至（pV）和含有选自如本文定义的与第一组不同的由式（pI）至（pV）表示的基团的第二基团的重复单元; 在光化射线或辐射照射时产生酸的化合物; 和溶剂。

    POSITIVE PHOTOSENSITIVE COMPOSITION AND A PATTERN-FORMING METHOD USING THE SAME
    7.
    发明申请
    POSITIVE PHOTOSENSITIVE COMPOSITION AND A PATTERN-FORMING METHOD USING THE SAME 有权
    正性感光性组合物和使用其的图案形成方法

    公开(公告)号：US20090081581A1

    公开(公告)日：2009-03-26

    申请号：US12055359

    申请日：2008-03-26

    申请人： Kunihiko Kodama ,  Kaoru Iwato ,  Hideaki Tsubaki ,  Norihiko Taguchi

    发明人： Kunihiko Kodama ,  Kaoru Iwato ,  Hideaki Tsubaki ,  Norihiko Taguchi

    IPC分类号： G03F7/20 ,  G03F7/004 ,  C08F220/26

    CPC分类号： G03F7/0397 ,  C08F220/26 ,  C08F220/28 ,  Y10S430/111

    摘要： A positive photosensitive composition comprises: (A) a compound that generates an acid upon irradiation with actinic ray or radiation; and (B) a resin that increases its solubility in an alkali developer by action of an acid, wherein the resin (B) has a repeating unit that has an acid-decomposable group and is represented by formula (I): wherein Xa1 represents a hydrogen atom, an alkyl group, a cyano group, or a halogen atom; Ry1 and Ry2 each independently represents an alkyl group or a cycloalkyl group; Rx represents an alkyl group having 2 or more carbon atoms, or a cycloalkyl group; and Z represents an alkylene group.

    摘要翻译： 正型光敏组合物包含：（A）在用光化射线或辐射照射时产生酸的化合物; 和（B）通过酸的作用增加其在碱性显影剂中的溶解度的树脂，其中树脂（B）具有具有酸分解性基团并由式（I）表示的重复单元：其中Xa1表示 氢原子，烷基，氰基或卤素原子; Ry1和Ry2各自独立地表示烷基或环烷基; Rx表示具有2个以上碳原子的烷基或环烷基; Z表示亚烷基。