公开(公告)号：US06472065B1

公开(公告)日：2002-10-29

申请号：US09615389

申请日：2000-07-13

申请人： Karunasena A. Alahapperuma ,  Steven S. Kantner

发明人： Karunasena A. Alahapperuma ,  Steven S. Kantner

IPC分类号： B32B712

CPC分类号： H01L21/6836 ,  C08L33/00 ,  C08L75/04 ,  C08L75/16 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J133/06 ,  C09J2203/326 ,  C09J2205/302 ,  H01L2221/68327 ,  Y10S428/901 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891 ,  Y10T428/2896

摘要： A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from about 85 wt. % to about 97.5 wt. % of a (meth)acrylate ester and from about 2.5 wt. % to about 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from about 25 parts to about 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation. The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition.

摘要翻译： 包含（甲基）丙烯酸酯共聚物的辐射可防止粘合剂组合物，其包含约85wt。 ％至约97.5wt。 ％的（甲基）丙烯酸酯和约2.5wt。 ％至约15wt。 ％的可共聚的羧酸酯单体和与（甲基）丙烯酸酯共聚物组合的多官能氨基甲酸酯丙烯酸酯低聚物，每100份共聚物提供约25份至约40份的低聚物。 粘合剂组合物在暴露于紫外线辐射期间逐渐脱粘。本发明还提供了一种用于在半导体芯片制造期间支撑硅晶片的透明粘合剂涂布片。 涂覆的片材包括涂覆有辐射可防止粘合剂组合物的透明膜基材。

公开(公告)号：US06235387B1

公开(公告)日：2001-05-22

申请号：US09050476

申请日：1998-03-30

申请人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

发明人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

IPC分类号： H01L2168

CPC分类号： H01L21/6836 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2891

摘要： A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

摘要翻译： 半导体晶片处理带包括永久性背衬和非压敏粘合剂层。 磁带可用于晶片研磨和/或晶圆切片应用。 非压敏粘合剂包括第一单烯属不饱和单体，至少一种第二单烯属不饱和单体和至少一种可共聚非离子交联剂中的至少一种的共聚物; 其中所述第二单烯属不饱和单体是均聚物玻璃化转变温度高于所述第一单烯属不饱和单体的均聚物玻璃化转变温度的增强单体。 还提供了一种处理半导体晶片的方法。

公开(公告)号：US6027778A

公开(公告)日：2000-02-22

申请号：US306770

申请日：1994-09-15

申请人： Karunasena A. Alahapperuma ,  Anthony B. Ferguson ,  David P. Smith ,  David L. Tussey ,  Saurin J. Shah ,  Dean E. Sitz ,  Randy S. Bay ,  Daniel C. Egan ,  Wolfgang G. Schoeppel

发明人： Karunasena A. Alahapperuma ,  Anthony B. Ferguson ,  David P. Smith ,  David L. Tussey ,  Saurin J. Shah ,  Dean E. Sitz ,  Randy S. Bay ,  Daniel C. Egan ,  Wolfgang G. Schoeppel

IPC分类号： G11B23/087 ,  B65H20/00 ,  G03B1/04 ,  G11B15/32

CPC分类号： G11B23/08778 ,  Y10S242/90 ,  Y10S242/906 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/1397

摘要： The present invention provides a novel one-piece capstan for a tape cartridge which provides good static dissipative properties and wear resistance. The capstan material of the present invention has a charge decay time of no more than 5 seconds as measured according to Mil B-81705C standard. The capstan material also has a flexural modulus of at least 200,000 psi (1379 MPa). The capstan comprises a hard, dimensionally stable polymer and a static dissipating polymer. The capstan also has an improved structure and geometry which enables the part to be easily molded, reduces drive force requirements with a reduction of material from the prior art design, but with no significant loss of performance properties.

摘要翻译： 本发明提供了一种用于带盒的新颖的单件绞盘，其提供良好的静电耗散性能和耐磨性。 根据MilB-81705C标准测量，本发明的绞盘材料的电荷衰减时间不超过5秒。 绞盘材料的弯曲模量也至少为200,000psi（1379MPa）。 绞盘包括硬的尺寸稳定的聚合物和静电消散聚合物。 绞盘还具有改进的结构和几何形状，使部件易于模制，减少了来自现有技术设计的材料减少的驱动力要求，但没有显着的性能损失。

公开(公告)号：US06759121B2

公开(公告)日：2004-07-06

申请号：US10015006

申请日：2001-12-11

申请人： Karunasena A. Alahapperuma ,  Peter A. Stark

发明人： Karunasena A. Alahapperuma ,  Peter A. Stark

IPC分类号： B32B712

CPC分类号： H01L21/6835 ,  C08L33/00 ,  C08L75/04 ,  C08L75/16 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J133/06 ,  C09J133/08 ,  C09J175/16 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10S428/901 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2839 ,  Y10T428/2891 ,  Y10T428/2896

摘要： A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from 85 wt. % to 97.5 wt. % of a (meth)acrylate ester and from 2.5 wt. % to 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from 25 parts to 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation. Properties of adhesive compositions may be maintained at elevated temperatures, from about 115° C. to about 155° C., when they include a thermally stable free radical initiator to overcome premature adhesive detackification. The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition.

摘要翻译： 一种辐射可防止粘合剂组合物，其包含（甲基）丙烯酸酯共聚物，其包含85重量％ ％至97.5wt。 ％的（甲基）丙烯酸酯和2.5重量％ ％至15wt。 ％的可共聚羧酸酯单体和与（甲基）丙烯酸酯共聚物组合的多官能氨基甲酸酯丙烯酸酯低聚物，每100份共聚物提供25份至40份低聚物。 粘合剂组合物在暴露于紫外线辐射期间逐渐脱粘。 当粘合剂组合物包括热稳定的自由基引发剂以克服过早的粘合剂脱粘时，粘合剂组合物的性能可以保持在约115℃至约155℃的高温下。本发明还提供了一种透明的粘合剂涂布片材， 在制造半导体芯片时支持硅晶片。 涂覆的片材包括涂覆有辐射可防止粘合剂组合物的透明膜基材。

公开(公告)号：US06478918B2

公开(公告)日：2002-11-12

申请号：US09765230

申请日：2001-01-18

申请人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

发明人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

IPC分类号： H01L21784

CPC分类号： H01L21/6836 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2891

摘要： A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

摘要翻译： 半导体晶片处理带包括永久性背衬和非压敏粘合剂层。 磁带可用于晶片研磨和/或晶圆切片应用。 非压敏粘合剂包括第一单烯属不饱和单体，至少一种第二单烯属不饱和单体和至少一种可共聚非离子交联剂中的至少一种的共聚物; 其中所述第二单烯属不饱和单体是均聚物玻璃化转变温度高于所述第一单烯属不饱和单体的均聚物玻璃化转变温度的增强单体。 还提供了一种处理半导体晶片的方法。