METHOD FOR THE MANUFACTURE OF PRESSURE SENSITIVE ADHESIVES
    3.
    发明申请
    METHOD FOR THE MANUFACTURE OF PRESSURE SENSITIVE ADHESIVES 有权
    压力敏感性粘合剂的制造方法

    公开(公告)号:US20090018274A1

    公开(公告)日:2009-01-15

    申请号:US11576931

    申请日:2006-09-21

    IPC分类号: C08F8/06

    摘要: A method for the manufacture of an adhesive id described, comprising: (A) Providing an initial reaction product of a solution polymerization reaction, the initial reaction product comprising polymer, unreacted polymerizable reactant, non-poly-merizable material, and solvent; and (B) Purifying the initial reaction product by adding an oxidizing agent and a reducing agent to the initial reaction product and allowing the unreacted polymerizable reactant in the initial reaction product to further react, thereby providing a second reaction product comprising additional polymer and a lower level of unreacted polymerizable reactant than was present in the initial reaction product. Optionally, the method of the invention may further comprise: Precipitating the polymer from the second reaction product to provide a precipitated polymer, and separating the precipitated polymer from the remainder of the second reaction product, the precipitated polymer comprising a lower level of non-polymerizable material or unreacted polymerizable reactant or both non-polymerizable material and unreacted polymerizable reactant than was present in the second reaction product.

    摘要翻译: 一种制造所述粘合剂的方法,包括:(A)提供溶液聚合反应的初始反应产物,包含聚合物的初始反应产物,未反应的可聚合反应物,非可聚合物质和溶剂; 和(B)通过向初始反应产物中加入氧化剂和还原剂并使初始反应产物中的未反应的可聚合反应物进一步反应来纯化初始反应产物,由此提供第二反应产物,其包含另外的聚合物和较低的 未反应的可聚合反应物的水平比初始反应产物中存在的水平高。 任选地,本发明的方法还可以包括:从第二反应产物中沉淀聚合物以提供沉淀的聚合物,并将沉淀的聚合物与第二反应产物的其余部分分离,沉淀的聚合物包含较低水平的不可聚合 材料或未反应的可聚合反应物或两种不可聚合材料和未反应的可聚合反应物。

    Semiconductor wafer processing tapes
    8.
    发明授权
    Semiconductor wafer processing tapes 有权
    半导体晶圆加工带

    公开(公告)号:US06478918B2

    公开(公告)日:2002-11-12

    申请号:US09765230

    申请日:2001-01-18

    IPC分类号: H01L21784

    摘要: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

    摘要翻译: 半导体晶片处理带包括永久性背衬和非压敏粘合剂层。 磁带可用于晶片研磨和/或晶圆切片应用。 非压敏粘合剂包括第一单烯属不饱和单体,至少一种第二单烯属不饱和单体和至少一种可共聚非离子交联剂中的至少一种的共聚物; 其中所述第二单烯属不饱和单体是均聚物玻璃化转变温度高于所述第一单烯属不饱和单体的均聚物玻璃化转变温度的增强单体。 还提供了一种处理半导体晶片的方法。

    Microroughened developer sheet for forming high density images
    10.
    发明授权
    Microroughened developer sheet for forming high density images 失效
    用于形成高密度图像的微透镜显影片

    公开(公告)号:US4956309A

    公开(公告)日:1990-09-11

    申请号:US280420

    申请日:1988-12-06

    IPC分类号: G03F7/004 B41M5/155 G03F7/00

    CPC分类号: G03F7/002 B41M5/155

    摘要: A receiver sheet for producing high density images, preferably in a photosensitive imaging system is disclosed. The receiver sheet is characterized by containing a particulate developer material which does not substantially compress upon the application of pressure. The resistance to pressure is accomplished by using a receiver sheet which has a discontinuous thickness or by incorporating a stilt material into the developer material. Also disclosed is an imaging system which has a discontinuous thickness donor sheet to prevent the developer material from substantially compressing upon the application of pressure.