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    Semiconductor wafer processing tapes
    2.
    发明授权
    Semiconductor wafer processing tapes 有权
    半导体晶圆加工带

    公开(公告)号：US06478918B2

    公开(公告)日：2002-11-12

    申请号：US09765230

    申请日：2001-01-18

    申请人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

    发明人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

    IPC分类号： H01L21784

    CPC分类号： H01L21/6836 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2891

    摘要： A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

    摘要翻译： 半导体晶片处理带包括永久性背衬和非压敏粘合剂层。 磁带可用于晶片研磨和/或晶圆切片应用。 非压敏粘合剂包括第一单烯属不饱和单体，至少一种第二单烯属不饱和单体和至少一种可共聚非离子交联剂中的至少一种的共聚物; 其中所述第二单烯属不饱和单体是均聚物玻璃化转变温度高于所述第一单烯属不饱和单体的均聚物玻璃化转变温度的增强单体。 还提供了一种处理半导体晶片的方法。

    Fluoroelastomers with improved permeation resistance and method for making the same
    4.
    发明授权
    Fluoroelastomers with improved permeation resistance and method for making the same 失效
    具有改善渗透阻力的氟弹性体及其制备方法

    公开(公告)号：US07148300B2

    公开(公告)日：2006-12-12

    申请号：US10659877

    申请日：2003-09-11

    申请人： Tatsuo Fukushi ,  Allan T. Worm ,  Erik D. Hare ,  Greggory S. Bennett ,  William D. Coggio

    发明人： Tatsuo Fukushi ,  Allan T. Worm ,  Erik D. Hare ,  Greggory S. Bennett ,  William D. Coggio

    IPC分类号： C08F116/12

    CPC分类号： C08F214/18 ,  C08F214/16 ,  C08K5/0025 ,  C08L27/12

    摘要： A compound is prepared, suitable for forming fluoroelastomers, having the unique features of a low glass transition temperature and desirable permeation resistance. The compound generally comprises two primary components. The first component is an amorphous copolymer including interpolymerized units derived from one or more perfluorinated ethers. The second component is a curable component including at least one filler having at least 10 parts per 100 parts of the first component. Upon vulcanization the resulting elastomeric compound has desirable physical characteristics as indicated by the durometer, the retraction at lower temperatures (TR-10) and permeation resistance.

    摘要翻译： 制备适合于形成含氟弹性体的化合物，其具有低玻璃化转变温度和所需渗透阻力的独特特征。 化合物通常包含两个主要组分。 第一组分是包含衍生自一种或多种全氟化醚的共聚单元的无定形共聚物。 第二组分是可固化组分，其包含至少一种每100份第一组分至少10份的填料。 硫化后，得到的弹性体化合物具有所需的物理特性，如硬度计所示，在较低温度下回缩（TR-10）和耐渗透性。

    Pressure-sensitive adhesive tape
    6.
    发明授权
    Pressure-sensitive adhesive tape 失效
    压敏胶带

    公开(公告)号：US06254954B1

    公开(公告)日：2001-07-03

    申请号：US09367958

    申请日：1999-08-26

    申请人： Greggory S. Bennett ,  Clayton A. George ,  Guido Hitschmann ,  Alain H. Lamon

    发明人： Greggory S. Bennett ,  Clayton A. George ,  Guido Hitschmann ,  Alain H. Lamon

    IPC分类号： B32B2704

    CPC分类号： C09J167/00 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/22 ,  C09J7/10 ,  C09J7/38 ,  C09J2463/00 ,  C09J2467/00 ,  Y10T428/1476 ,  Y10T428/2809 ,  Y10T428/287

    摘要： The invention relates to a pressure-sensitive adhesive tape with improved room temperature handleability comprising an adhesive layer with at least one exposed surface and optionally a backing, wherein the pressure-sensitive adhesive layer comprises an epoxy/polyester based pressure sensitive adhesive which is crosslinkable upon exposure to actinic or e-beam irradiation and optionally heat, and comprises (i) 30-80% by weight of a polyester component comprising one or more amorphous polyesters compounds, (ii) 20-70% by weight of an epoxy component comprising one or more epoxy resins and/or monomers, (iii) 0-50% by weight of a hydroxyl-functional component containing one or more hydroxyl-containing compounds having a hydroxyl functionality of at least 1, and (iv) an effective amount of a photoinitiator component for crosslinking the pressure-sensitive adhesive, whereby the weight percentages refer to the total mass of components (i)-(iv) and add up to 100 wt. %, and which exhibits a holding power of at least 5 min.

    摘要翻译： 本发明涉及具有改进的室温操作性的压敏粘合带，其包括具有至少一个暴露表面和任选的背衬的粘合剂层，其中该压敏粘合剂层包含可环氧树脂/聚酯基压敏粘合剂 暴露于光化或电子束照射和任选地加热，并且包含（i）30-80重量％的包含一种或多种无定形聚酯化合物的聚酯组分，（ii）20-70重量％的包含一个 或更多的环氧树脂和/或单体，（iii）0-50重量％的含有一个或多个羟基官能度至少为1的含羟基化合物的羟基官能组分，和（iv）有效量的 用于使压敏粘合剂交联的光引发剂组分，其中重量百分数是指组分（i） - （iv）的总质量，并加起来至100重量份。 ％，表现出至少5分钟的保持力。

    Semiconductor wafer processing tapes
    7.
    发明授权
    Semiconductor wafer processing tapes 失效
    半导体晶圆加工带

    公开(公告)号：US06235387B1

    公开(公告)日：2001-05-22

    申请号：US09050476

    申请日：1998-03-30

    申请人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

    发明人： Richard E. Bennett ,  Louis E. Winslow ,  Greggory S. Bennett ,  Karunasena A. Alahapperuma ,  Cheryl L. Moore

    IPC分类号： H01L2168

    CPC分类号： H01L21/6836 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2891

    摘要： A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

    摘要翻译： 半导体晶片处理带包括永久性背衬和非压敏粘合剂层。 磁带可用于晶片研磨和/或晶圆切片应用。 非压敏粘合剂包括第一单烯属不饱和单体，至少一种第二单烯属不饱和单体和至少一种可共聚非离子交联剂中的至少一种的共聚物; 其中所述第二单烯属不饱和单体是均聚物玻璃化转变温度高于所述第一单烯属不饱和单体的均聚物玻璃化转变温度的增强单体。 还提供了一种处理半导体晶片的方法。