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公开(公告)号：US5876618A
公开(公告)日：1999-03-02
申请号：US974190
申请日：1997-11-19
CPC分类号： C04B35/265 , H01F1/344
摘要： A Ni--Zn type ferrite has the composition represented by the general formula: Ni.sub.X Zn.sub.1-X Fe.sub.2-Y-Z Mn.sub.Y Zr.sub.Z O.sub.4 (0.55.ltoreq.X.ltoreq.0.80, 0.001.ltoreq.Y.ltoreq.0.20, 0.001.ltoreq.Z.ltoreq.0.04). The Ni--Zn type ferrite is formed with the step described below. A raw powder is first mixed for 64 hours and then fired at 850.degree. C. in an oxygen atmosphere for two hours. Next, the fired powder is crushed and then the crushed powder is again mixed. Then, a binder is added to the resulting powder, which is then press-formed under a pressure of 2.5 ton/cm.sup.2, and the press-formed powder is sintered at 1350.degree. C. for 5 hours in an oxygen atmosphere.
摘要翻译： Ni-Zn型铁氧体具有以下通式所示的组成：NiXZn1-XFe2-Y-ZMnYZrZO4（0.55≤X≤0.80,0.001,0.Y≤0.:0.,,,,,,,,,,,,,,,,,,,, = 0.04）。 通过下述步骤形成Ni-Zn型铁氧体。 首先将原料粉末混合64小时，然后在氧气氛中在850℃下烧制2小时。 接着，将烧成的粉末粉碎，然后粉碎的粉末再次混合。 然后，向所得粉末中加入粘合剂，然后在2.5吨/ cm2的压力下压制成型，将压制成形的粉末在氧气氛中在1350℃下烧结5小时。
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2.发明授权公开(公告)号：US06504444B1
公开(公告)日：2003-01-07
申请号：US09187868
申请日：1998-11-06
申请人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
发明人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
IPC分类号： H01P136
CPC分类号： H05K1/184 , H01L23/66 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K1/092 , H05K1/165 , H05K1/185 , H05K2201/086 , H05K2201/10416 , H05K2201/10643 , H01L2924/00
摘要： Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.
摘要翻译： 在烧结之前，在陶瓷基板中形成孔，将磁性部件和电介质部件嵌合在孔中，并且在等于或低于磁性部件的烧结温度的温度下烧结基板。 可以通过使用硬质铁氧体作为磁性部件的材料并且在烧结之后对它们进行磁化来获得非常紧凑的高频集成电路，特别是可以在几十GHz的频带中使用的微波集成电路 。
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3.发明授权
公开(公告)号：US6127907A
公开(公告)日：2000-10-03
申请号：US187873
申请日：1998-11-06
申请人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
发明人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
CPC分类号： H01P7/10
摘要： Dielectric parts 12 which become resonators are fitted in holes formed in a dielectric substrate 11 and magnetic parts 13 for setting resonance frequencies of the dielectric parts 12 are also fitted in holes formed in the dielectric substrate 11. With such construction in which the dielectric parts are fitted in the holes of the dielectric substrate, the physical preciseness of a high frequency filter is improved. Further, by fitting not only the dielectric parts 12 but also the magnetic parts 13 in the holes of the dielectric substrate 11, it is possible to form the high frequency filter operating in a frequency band of several tens GHz as a micro wave integrated circuit to thereby improve the uniformality and mass-producibility of the high frequency filter.
摘要翻译： 成为谐振器的电介质部件12装配在形成在电介质基板11中的孔中，并且用于设置电介质部分12的谐振频率的磁性部分13也安装在形成在电介质基板11中的孔中。通过这样的结构， 安装在电介质基板的孔中，提高了高频滤波器的物理精度。 此外，通过不仅将电介质部件12以及电介质基板11的孔中的磁性部件13嵌合，所以可以形成在几十GHz的频带内工作的高频滤波器作为微波集成电路 从而提高高频滤波器的均匀性和大规模生产率。
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公开(公告)号：US20060011702A1
公开(公告)日：2006-01-19
申请号：US10516708
申请日：2003-07-01
申请人： Takuo Funaya , Osamu Myohga , Yoshitsugu Okada , Hiroshi Kubota , Junya Sakurai
发明人： Takuo Funaya , Osamu Myohga , Yoshitsugu Okada , Hiroshi Kubota , Junya Sakurai
IPC分类号： B23K35/14
CPC分类号： B23K35/262 , H05K3/3463
摘要： The solder contains Sn—Zn alloy(s) having a single composition ratio or a plurality of composition ratios, and Sn—Bi—Ag alloy(s) having a single composition ratio or a plurality of composition ratios. The solder includes zinc at 7 to 10 weight % both inclusive, bismuth at 0.001 to 6 weight % both inclusive, silver at 0.001 to 0.1 weight % both inclusive, and the remainder of tin when the alloys are melted in mixture.
摘要翻译： 焊料含有具有单一组成比或多种组成比的Sn-Zn合金，以及具有单一组成比或多种组成比的Sn-Bi-Ag合金。 焊料包括含量为7〜10重量％的锌，0.001〜6重量％的铋，0.001-0.1重量％的银，以及当合金熔融时其余的锡。
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公开(公告)号：US06348843B1
公开(公告)日：2002-02-19
申请号：US09317057
申请日：1999-05-24
申请人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
发明人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
IPC分类号： H01P1387
CPC分类号： H01P1/387
摘要： A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.
摘要翻译： 用于不可逆电路的磁性部件2装配在形成于电介质基板1中的第一孔中，并且至少一个磁性部件3装配在形成在电介质基板1的围绕第一孔的部分的第二孔中。 电介质基板1和非易失性电路用磁性体2的表面印刷电导体，形成微带线4.接地导体5形成在电介质基板1的另一面上。 用于频率调节的构件3可以可逆地执行非可逆电路的频率特性的调节。
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6.发明授权High frequency nonreciprocal circuit element with a protruding embedded magnetized member 失效高频不可逆电路元件，具有突出的嵌入式磁化元件公开(公告)号：US06512424B2
公开(公告)日：2003-01-28
申请号：US09834539
申请日：2001-04-13
申请人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
发明人： Mitsuru Furuya , Osamu Myohga , Yoshitsugu Okada
IPC分类号： H01P1387
CPC分类号： H01P1/387
摘要： A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.
摘要翻译： 用于不可逆电路的磁性部件2装配在形成于电介质基板1中的第一孔中，并且至少一个磁性部件3装配在形成在电介质基板1的围绕第一孔的部分的第二孔中。 电介质基板1和非易失性电路用磁性体2的表面印刷电导体，形成微带线4.接地导体5形成在电介质基板1的另一面上。 用于频率调节的构件3可以可逆地执行非可逆电路的频率特性的调节。
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公开(公告)号：US07829199B2
公开(公告)日：2010-11-09
申请号：US11587008
申请日：2005-04-21
申请人： Takuo Funaya , Osamu Myohga , Koji Matsui
发明人： Takuo Funaya , Osamu Myohga , Koji Matsui
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3463 , Y10T428/12 , Y10T428/12708
摘要： An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.
摘要翻译： 具有7〜10质量％的Zn，0.075〜1质量％的Ag和0.07〜0.5质量％的Al的Sn-Zn合金焊料， 进一步含有选自0.01〜6质量％的Bi和0.007〜0.1质量％的Cu中的1种或2种成分; 并且任选地包含0.007〜0.1质量％，余量为Sn和不可避免的杂质。 焊料与常规的Sn-37质量％Pb共晶焊料具有相同的加工性能，使用条件和连接可靠性，并且不含生物有害的铅。
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公开(公告)号：US4933590A
公开(公告)日：1990-06-12
申请号：US322212
申请日：1989-03-13
CPC分类号： H02N2/0045 , H02N2/106
摘要： This invention provides an ultrasonic motor using a bolt-tightened Langevin type torsional vibrator as a stator. The stator produces a vibrational energy to be converted into a rotational energy for a rotor contacted with the stator. The rotor is provided between a piezoelectric actuator and the torsional vibrator so that the contact state between the rotor and the torsional vibrator is controlled either one of loose contact and tight contact therebetween. According to the present invention, since the piezoelectric actuator is slidingly combined to the rotor, the rotation energy is not applied to the piezoelectric actuator and thus the life time of the actuator becomes long.
摘要翻译： 本发明提供一种使用螺栓紧固的朗格温型扭转振动器作为定子的超声波马达。 定子产生的振动能被转换为与定子接触的转子的旋转能量。 转子设置在压电致动器和扭转振动器之间，使得转子和扭转振动器之间的接触状态被控制为两者之间的松动接触和紧密接触。 根据本发明，由于压电致动器滑动地组合到转子上，因此旋转能量不施加到压电致动器，因此致动器的寿命变长。
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公开(公告)号：US20080026240A1
公开(公告)日：2008-01-31
申请号：US11587008
申请日：2005-04-21
申请人： Takuo Funaya , Osamu Myohga , Koji Matsui
发明人： Takuo Funaya , Osamu Myohga , Koji Matsui
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3463 , Y10T428/12 , Y10T428/12708
摘要： An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.
摘要翻译： 具有7〜10质量％的Zn，0.075〜1质量％的Ag和0.07〜0.5质量％的Al的Sn-Zn合金焊料， 进一步含有选自0.01〜6质量％的Bi和0.007〜0.1质量％的Cu中的1种或2种成分; 并且任选地包含0.007〜0.1质量％，余量为Sn和不可避免的杂质。 焊料与常规的Sn-37质量％Pb共晶焊料具有相同的加工性能，使用条件和连接可靠性，并且不含生物有害的铅。
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公开(公告)号：US6111479A
公开(公告)日：2000-08-29
申请号：US33554
申请日：1998-03-02
申请人： Osamu Myohga , Shiro Yoshida , Mitsuo Saito , Yuzo Shimada , Hirokazu Tohya , Ryo Maniwa
发明人： Osamu Myohga , Shiro Yoshida , Mitsuo Saito , Yuzo Shimada , Hirokazu Tohya , Ryo Maniwa
CPC分类号： H05K1/0233 , H03H7/01 , H05K1/0216 , H05K1/0298
摘要： A laminate printed circuit board loaded with transistors, ICs (Integrated Circuits) or LSIs (Large Scale Integrated Circuits) and a method of producing the same are disclosed. The circuit board includes a signal layer, a ground layer and a power supply layer sequentially laminated with the intermediary of insulation layers. An impedance adding circuit is formed in the power supply layer. A magnetic layer is positioned at least above or at least blow the impedance adding circuit. The circuit board with this configuration reduces power supply noise to a noticeable degree.
摘要翻译： 公开了一种装载有晶体管，集成电路（IC）或LSI（大规模集成电路）的叠层印刷电路板及其制造方法。 电路板包括信号层，接地层和依次层叠有绝缘层中间的电源层。 在电源层中形成阻抗加法电路。 磁性层至少位于或至少使阻抗加法电路吹过。 具有这种配置的电路板可以显着降低电源噪声。
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