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    RESIN LAMINATED PLATE
    1.
    发明申请
    RESIN LAMINATED PLATE 审中-公开
    树脂层压板

    公开(公告)号：US20120128951A1

    公开(公告)日：2012-05-24

    申请号：US13388376

    申请日：2010-09-17

    申请人： Katsunori Takahashi ,  Daisuke Mukohata ,  Mitsuru Naruta ,  Kensuke Tsumura ,  Kazuhiro Sawa ,  Koji Taniguchi ,  Naoyuki Nagatani

    发明人： Katsunori Takahashi ,  Daisuke Mukohata ,  Mitsuru Naruta ,  Kensuke Tsumura ,  Kazuhiro Sawa ,  Koji Taniguchi ,  Naoyuki Nagatani

    IPC分类号： B32B7/02

    CPC分类号： B32B27/12 ,  B32B27/32 ,  B32B27/34 ,  B32B2307/50 ,  B32B2605/00 ,  B82Y30/00 ,  E04C2/246 ,  Y10T428/2495

    摘要： Provided is a resin laminated plate which can achieve weight reduction and further increase in strength and is less likely to degrade in surface appearance. A resin laminated plate 1 including a layer made of a thermoplastic resin or thermosetting resin in a laminated structure includes: a first layer 2 made of a thermoplastic resin or thermosetting resin having a tensile modulus of elasticity of 0.8 to 2.0 GPa; and a second layer 3 disposed on the first layer 2, made of a different resin from the thermoplastic resin or thermosetting resin forming the first layer 2, and having a form selected from the group consisting of a film, a woven fabric, a non-woven fabric, and a mesh, wherein the ratio between the thickness of the first layer and the thickness of the second layer is within the range of 0.5 to 10 and the apparent bending modulus of elasticity of the resin laminated plate determined by the bending test defined in Japanese Industrial Standards (JIS) K7171 is 2.5 GPa to 8.5 GPa, both inclusive.

    摘要翻译： 本发明提供一种树脂层叠板，能够实现轻量化，强度进一步提高，表面外观劣化的可能性降低。 包括由热塑性树脂或热固性树脂制成的层压结构的树脂层压板1包括：由热塑性树脂制成的第一层2或具有0.8至2.0GPa的拉伸弹性模量的热固性树脂; 以及设置在与形成第一层2的热塑性树脂或热固性树脂不同的树脂制成的第一层2上的第二层3，并且具有选自由膜，机织织物， 织物和网，其中第一层的厚度和第二层的厚度之间的比率在0.5至10的范围内，并且由定义的弯曲试验确定的树脂层压板的表观弯曲弹性模量 日本工业标准（JIS）K7171为2.5GPa至8.5GPa，包括端值。

    POLYOLEFIN-BASED RESIN COMPOSITION AND PROCESS FOR PRODUCING SAME
    2.
    发明申请
    POLYOLEFIN-BASED RESIN COMPOSITION AND PROCESS FOR PRODUCING SAME 审中-公开
    基于聚烯烃的树脂组合物及其生产方法

    公开(公告)号：US20130126795A1

    公开(公告)日：2013-05-23

    申请号：US13703768

    申请日：2011-06-16

    申请人： Katsunori Takahashi ,  Daisuke Mukohata ,  Kouji Taniguchi ,  Mitsuru Naruta ,  Shouji Nozato ,  Naoyuki Nagatani ,  Kensuke Tsumura ,  Kazuhiro Sawa

    发明人： Katsunori Takahashi ,  Daisuke Mukohata ,  Kouji Taniguchi ,  Mitsuru Naruta ,  Shouji Nozato ,  Naoyuki Nagatani ,  Kensuke Tsumura ,  Kazuhiro Sawa

    IPC分类号： C08L23/12

    CPC分类号： C08L23/12 ,  C08K3/04 ,  C08L23/02 ,  C08L23/10 ,  C08L53/02 ,  C08L53/025 ,  C08L71/02 ,  C08L71/10

    摘要： Provided is a polyolefin-based resin composition capable of obtaining a molded product having a high modulus of elongation and a low coefficient of linear expansion. The polyolefin-based resin composition includes a polyolefin-based resin, flaked graphite, and either one or both of a compound with a six-membered ring structure and a compound with a five-membered ring structure. The flaked graphite is uniformly dispersed in the polyolefin-based resin. Thus, a molded product formed using the polyolefin-based resin composition has excellent mechanical strength such as a high modulus of elongation, a low coefficient of linear expansion, and high dimensional stability, and can be used for various applications such as a material that is suitable for use as the exterior panels of automobiles or a sheet metal replacement material.

    摘要翻译： 本发明提供一种聚烯烃系树脂组合物，其能够得到伸长率高，线膨胀系数低的成型品。 聚烯烃类树脂组合物包括聚烯烃类树脂，片状石墨，以及具有六元环结构的化合物和具有五元环结构的化合物中的任一种或两者。 片状石墨均匀分散在聚烯烃类树脂中。 因此，使用聚烯烃类树脂组合物形成的成型体，具有优异的机械强度，例如高伸长率，低膨胀系数，高尺寸稳定性，可用于各种用途，例如 适合用作汽车的外部面板或钣金替代材料。

    POLYOLEFIN-BASED RESIN COMPOSITION
    4.
    发明申请
    POLYOLEFIN-BASED RESIN COMPOSITION 审中-公开
    基于聚烯烃的树脂组合物

    公开(公告)号：US20130096247A1

    公开(公告)日：2013-04-18

    申请号：US13703755

    申请日：2011-06-16

    申请人： Katsunori Takahashi ,  Daisuke Mukohata ,  Mitsuru Naruta ,  Kouji Taniguchi ,  Naoyuki Nagatani ,  Shouji Nozato

    发明人： Katsunori Takahashi ,  Daisuke Mukohata ,  Mitsuru Naruta ,  Kouji Taniguchi ,  Naoyuki Nagatani ,  Shouji Nozato

    IPC分类号： C08L23/26 ,  C08L53/00 ,  C08K3/04 ,  C08L47/00

    CPC分类号： C08L23/26 ,  C08K3/04 ,  C08L47/00 ,  C08L51/06 ,  C08L53/00

    摘要： Provided is a polyolefin-based resin composition capable of obtaining a molded product having a high modulus of elongation and a low coefficient of linear expansion. The polyolefin-based resin composition includes a polyolefin-based resin containing either one or both of an acid-modified polyolefin-based resin and a polyolefin-based resin with a hydroxyl group, and flaked graphite. The flaked graphite is uniformly dispersed in the polyolefin-based resin. As a result, a molded product formed by using the polyolefin-based resin composition has excellent mechanical strength such as a high modulus of elongation, a low coefficient of linear expansion, and high dimensional stability, and can be used for various applications such as a material that is suitable for use as the exterior panels of automobiles or a steel sheet replacement material.

    摘要翻译： 本发明提供一种聚烯烃系树脂组合物，其能够得到伸长率高，线膨胀系数低的成型品。 聚烯烃类树脂组合物包括含有酸改性聚烯烃类树脂和具有羟基的聚烯烃类树脂中的一种或两种的聚烯烃类树脂和片状石墨。 片状石墨均匀分散在聚烯烃类树脂中。 结果，使用聚烯烃类树脂组合物形成的成型体具有优异的机械强度，例如高伸长模量，低线膨胀系数和高尺寸稳定性，并且可用于各种应用，例如 适合用作汽车外板或钢板更换材料的材料。

    Thermally disappearing resin particle
    6.
    发明授权
    Thermally disappearing resin particle 有权
    热消失的树脂颗粒

    公开(公告)号：US08138252B2

    公开(公告)日：2012-03-20

    申请号：US11886721

    申请日：2005-12-13

    申请人： Takahiro Oomura ,  Naoyuki Nagatani ,  Miki Inaoka ,  Hiroshi Yamauchi

    发明人： Takahiro Oomura ,  Naoyuki Nagatani ,  Miki Inaoka ,  Hiroshi Yamauchi

    IPC分类号： C08K3/00 ,  C08K3/26 ,  B32B18/00 ,  B32B5/16

    CPC分类号： C08F290/062 ,  C04B35/195 ,  C04B35/565 ,  C04B35/584 ,  C04B35/63488 ,  C04B35/638 ,  C04B38/0615 ,  C04B2111/00793 ,  C04B2235/3217 ,  C04B2235/3409 ,  C04B2235/349 ,  C04B2235/3852 ,  C04B2235/6562 ,  C08F220/14 ,  C08F222/1006 ,  C08J3/12 ,  C08J2371/02 ,  Y10T428/2982 ,  Y10T428/2989 ,  C04B35/00

    摘要： It is an object of the present invention to provide a thermally disappearing resin particle and a thermally disappearing hollow resin particle which can be decomposed at a low temperature in a short time and do not cause deformation or cracking of a sintered body to be obtained in the case of using as a binder for a ceramic or a lightening material; a method of producing the thermally disappearing hollow resin particle; a ceramic composition which can be degreased and fired at a low temperature in a short time and gives a molded body with a high porosity without deformation or cracking even in the case a large quantity of a pore-forming material is used; and a method of producing a porous ceramic filter.The present invention is directed to a thermally disappearing resin particle, which contains a polyoxyalkylene resin, and 10% by weight or more of the whole particle disappearing within an hour by heating at a prescribed temperature in a range from 100 to 300° C.

    摘要翻译： 本发明的目的是提供一种热消失树脂颗粒和热消失的中空树脂颗粒，其可以在短时间内在低温下分解，并且不会引起烧结体的变形或开裂 用作陶瓷或减轻材料的粘合剂的情况; 制造热消失中空树脂颗粒的方法; 可以在短时间内在低温下脱脂和烧制的陶瓷组合物，并且即使在使用大量造孔材料的情况下也能赋予具有高孔隙率而没有变形或破裂的成型体; 以及多孔陶瓷过滤器的制造方法。 本发明涉及含有聚氧化烯树脂的热消失性树脂颗粒，并且在100〜300℃的规定温度下加热，在1小时内全部颗粒的10重量％以上消失。

    POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
    8.
    发明申请
    POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE 审中-公开
    聚合物颗粒，导电颗粒，各向异性导电材料和连接结构

    公开(公告)号：US20110127068A1

    公开(公告)日：2011-06-02

    申请号：US13055912

    申请日：2009-07-27

    申请人： Takuya Wada ,  Naoyuki Nagatani

    发明人： Takuya Wada ,  Naoyuki Nagatani

    IPC分类号： H01B5/00 ,  C08F222/14 ,  H01B1/00

    CPC分类号： H05K3/323 ,  C01P2004/84 ,  C08F220/18 ,  C08F222/1006 ,  C09C3/10 ,  H05K2201/0218 ,  H05K2201/0221

    摘要： An object of the present invention is to provide a polymer particulate material with a low compression modulus and a high recovery rate from compression deformation.The present invention provides a polymer particulate material obtainable by co-polymerizing comonomer components including a polyfunctional (meth)acrylate having a structure represented by the below formulas (1), (2) or (3), and a monofunctional (meth)acrylate monomer having a structure represented by the below formula (4), the polymer particulate material shows a recovery rate from compressive deformation of 70% or higher: In the formula (1), n represents an integer within the range of 4 to 10. In the formula (2), R11 represents a hydrogen atom or a C1-4 alkyl group, R12, R13 and R14 each represent a C1-4 alkylene group, and R15, R16 and R17 each represent a hydrogen atom or a methyl group. In the formula (3), R3, R4, R5 and R6 each represent a C1-4 alkylene group, and R7, R8, R9 and R10 each represent a hydrogen atom or a methyl group. In the formula (4), R1 represents a hydrogen atom or a methyl group, and R2 represents a C5-18 alkyl group.

    摘要翻译： 本发明的目的是提供一种聚合物颗粒材料，其具有低压缩模量和高压缩变形的回收率。 本发明提供一种聚合物颗粒材料，其可通过共聚单体组分包括具有由下式（1），（2）或（3）表示的结构的多官能（甲基）丙烯酸酯和单官能（甲基）丙烯酸酯单体 具有由下式（4）表示的结构，聚合物颗粒材料显示出从压缩变形的回收率为70％以上：在式（1）中，n表示4〜10的整数。在 式（2）中，R11表示氢原子或C1-4烷基，R12，R13和R14各自表示C1-4亚烷基，R15，R16和R17各自表示氢原子或甲基。 在式（3）中，R 3，R 4，R 5和R 6各自表示C 1-4亚烷基，R 7，R 8，R 9和R 10各自表示氢原子或甲基。 在式（4）中，R 1表示氢原子或甲基，R 2表示C 5-18烷基。

    Thermally Disappearing Resin Particle
    9.
    发明申请
    Thermally Disappearing Resin Particle 有权
    热消失树脂颗粒

    公开(公告)号：US20080269394A1

    公开(公告)日：2008-10-30

    申请号：US11886721

    申请日：2005-12-13

    申请人： Takahiro Oomura ,  Naoyuki Nagatani ,  Miki Inaoka ,  Hiroshi Yamauchi

    发明人： Takahiro Oomura ,  Naoyuki Nagatani ,  Miki Inaoka ,  Hiroshi Yamauchi

    IPC分类号： C08K3/22 ,  C08K3/28 ,  C08G59/00

    CPC分类号： C08F290/062 ,  C04B35/195 ,  C04B35/565 ,  C04B35/584 ,  C04B35/63488 ,  C04B35/638 ,  C04B38/0615 ,  C04B2111/00793 ,  C04B2235/3217 ,  C04B2235/3409 ,  C04B2235/349 ,  C04B2235/3852 ,  C04B2235/6562 ,  C08F220/14 ,  C08F222/1006 ,  C08J3/12 ,  C08J2371/02 ,  Y10T428/2982 ,  Y10T428/2989 ,  C04B35/00

    摘要： It is an object of the present invention to provide a thermally disappearing resin particle and a thermally disappearing hollow resin particle which can be decomposed at a low temperature in a short time and do not cause deformation or cracking of a sintered body to be obtained in the case of using as a binder for a ceramic or a lightening material; a method of producing the thermally disappearing hollow resin particle; a ceramic composition which can be degreased and fired at a low temperature in a short time and gives a molded body with a high porosity without deformation or cracking even in the case a large quantity of a pore-forming material is used; and a method of producing a porous ceramic filter.The present invention is directed to a thermally disappearing resin particle, which contains a polyoxyalkylene resin, and 10% by weight or more of the whole particle disappearing within an hour by heating at a prescribed temperature in a range from 100 to 300° C.

    摘要翻译： 本发明的目的是提供一种热消失树脂颗粒和热消失的中空树脂颗粒，其可以在短时间内在低温下分解，并且不会引起烧结体的变形或开裂 用作陶瓷或减轻材料的粘合剂的情况; 制造热消失中空树脂颗粒的方法; 可以在短时间内在低温下脱脂和烧制的陶瓷组合物，并且即使在使用大量造孔材料的情况下也能赋予具有高孔隙率而没有变形或破裂的成型体; 以及多孔陶瓷过滤器的制造方法。 本发明涉及含有聚氧化烯树脂的热消失性树脂颗粒，并且在100〜300℃的规定温度下加热，在1小时内全部颗粒的10重量％以上消失。