Method of manufacturing a semiconductor integrated circuit device having
a capacitor
    1.
    发明授权
    Method of manufacturing a semiconductor integrated circuit device having a capacitor 失效
    具有电容器的半导体集成电路器件的制造方法

    公开(公告)号:US5976929A

    公开(公告)日:1999-11-02

    申请号:US962878

    申请日:1997-11-03

    CPC分类号: H01L27/105 H01L27/10805

    摘要: A semiconductor integrated circuit device having a DRAM consisting of memory cells, comprises; a first conductive film deposited over the main surface of a semiconductor substrate and used to form a gate electrode of a memory cell selection MISFET; a second conductive film deposited over the first conductive film and used to form bit lines to transfer data of a memory cell to a sense amplifier; a third conductive film deposited over the second conductive film and used to form a storage node of a capacitor; a fourth conductive film deposited over the third conductive film and used to form a plate electrode of the capacitor; and a fifth conductive film deposited over the fourth conductive film and used to form an interconnect, wherein a transistor in a direct peripheral circuit arranged close to a memory array is electrically connected, through a pad layer formed of the third conductive film, to the interconnection of the fifth conductive film deposited over the fourth conductive film, thereby allowing the aspect ratio of the contact hole formed over the pad layer to be reduced.

    摘要翻译: 一种具有由存储单元组成的DRAM的半导体集成电路器件,包括: 沉积在半导体衬底的主表面上并用于形成存储器单元选择MISFET的栅电极的第一导电膜; 沉积在第一导电膜上并用于形成位线以将存储器单元的数据传送到读出放大器的第二导电膜; 沉积在所述第二导电膜上并用于形成电容器的存储节点的第三导电膜; 沉积在所述第三导电膜上并用于形成所述电容器的平板电极的第四导电膜; 以及沉积在第四导电膜上并用于形成互连的第五导电膜,其中布置在存储器阵列附近的直接外围电路中的晶体管通过由第三导电膜形成的焊盘层电连接到互连 所述第五导电膜沉积在所述第四导电膜上,从而允许形成在所述焊盘层上的所述接触孔的纵横比减小。

    Semiconductor integrated circuit device and a manufacturing method
thereof
    2.
    发明授权
    Semiconductor integrated circuit device and a manufacturing method thereof 失效
    半导体集成电路器件及其制造方法

    公开(公告)号:US5604365A

    公开(公告)日:1997-02-18

    申请号:US297039

    申请日:1994-08-29

    CPC分类号: H01L27/105 H01L27/10805

    摘要: A semiconductor integrated circuit device having a DRAM consisting of memory cells, comprises; a first conductive film deposited over the main surface of a semiconductor substrate and used to form a gate electrode of a memory cell selection MISFET; a second conductive film deposited over the first conductive film and used to form bit lines to transfer data of a memory cell to a sense amplifier; a third conductive film deposited over the second conductive film and used to form a storage node of a capacitor; a fourth conductive film deposited over the third conductive film and used to form a plate electrode of the capacitor; and a fifth conductive film deposited over the fourth conductive film and used to form an interconnect, wherein a transistor in a direct peripheral circuit arranged close to a memory array is electrically connected, through a pad layer formed of the third conductive film, to the interconnection of the fifth conductive film deposited over the fourth conductive film, thereby allowing the aspect ratio of the contact hole formed over the pad layer to be reduced.

    摘要翻译: 一种具有由存储单元组成的DRAM的半导体集成电路器件,包括: 沉积在半导体衬底的主表面上并用于形成存储器单元选择MISFET的栅电极的第一导电膜; 沉积在第一导电膜上并用于形成位线以将存储器单元的数据传送到读出放大器的第二导电膜; 沉积在所述第二导电膜上并用于形成电容器的存储节点的第三导电膜; 沉积在所述第三导电膜上并用于形成所述电容器的平板电极的第四导电膜; 以及沉积在第四导电膜上并用于形成互连的第五导电膜,其中布置在存储器阵列附近的直接外围电路中的晶体管通过由第三导电膜形成的焊盘层电连接到互连 所述第五导电膜沉积在所述第四导电膜上,从而允许形成在所述焊盘层上的所述接触孔的纵横比减小。

    Semiconductor integrated circuit device

    公开(公告)号:US06195305B1

    公开(公告)日:2001-02-27

    申请号:US09288512

    申请日:1999-04-08

    IPC分类号: G11C700

    CPC分类号: G11C5/147

    摘要: In a semiconductor integrated circuit in which an internal voltage generation circuit operating on a power supply voltage supplied through an external terminal forms either or both of a low voltage and a boosted voltage to operate internal circuits, a first internal circuit operating on the power supply voltage supplied through the external terminal or the boosted voltage formed by the internal voltage generation circuit is constituted by a first MOSFET with a gate insulation film having a large thickness adapted to the power supply voltage or boosted voltage, and a second internal circuit operating on the low voltage is constituted by a second MOSFET with a gate insulation film having a small thickness adapted to the low voltage.

    Semiconductor integrated circuit device

    公开(公告)号:US06584031B2

    公开(公告)日:2003-06-24

    申请号:US10107139

    申请日:2002-03-28

    IPC分类号: G11C700

    CPC分类号: G11C5/147

    摘要: In a semiconductor integrated circuit in which an internal voltage generation circuit operating on a power supply voltage supplied through an external terminal forms either or both of a low voltage and a boosted voltage to operate internal circuits, a first internal circuit operating on the power supply voltage supplied through the external terminal or the boosted voltage formed by the internal voltage generation circuit is constituted by a first MOSFET with a gate insulation film having a large thickness adapted to the power supply voltage or boosted voltage, and a second internal circuit operating on the low voltage is constituted by a second MOSFET with a gate insulation film having a small thickness adapted to the low voltage.

    Semiconductor integrated circuit device

    公开(公告)号:US06385118B2

    公开(公告)日:2002-05-07

    申请号:US09907929

    申请日:2001-07-19

    IPC分类号: G11C700

    CPC分类号: G11C5/147

    摘要: In a semiconductor integrated circuit in which an internal voltage generation circuit operating on a power supply voltage supplied through an external terminal forms either or both of a low voltage and a boosted voltage to operate internal circuits, a first internal circuit operating on the power supply voltage supplied through the external terminal or the boosted voltage formed by the internal voltage generation circuit is constituted by a first MOSFET with a gate insulation film having a large thickness adapted to the power supply voltage or boosted voltage, and a second internal circuit operating on the low voltage is constituted by a second MOSFET with a gate insulation film having a small thickness adapted to the low voltage.

    Semiconductor integrated circuit device

    公开(公告)号:US06288967B1

    公开(公告)日:2001-09-11

    申请号:US09742078

    申请日:2000-12-22

    IPC分类号: G11C700

    摘要: In a semiconductor integrated circuit in which an internal voltage generation circuit operating on a power supply voltage supplied through an external terminal forms either or both of a low voltage and a boosted voltage to operate internal circuits, a first internal circuit operating on the power supply voltage supplied through the external terminal or the boosted voltage formed by the internal voltage generation circuit is constituted by a first MOSFET with a gate insulation film having a large thickness adapted to the power supply voltage or boosted voltage, and a second internal circuit operating on the low voltage is constituted by a second MOSFET with a gate insulation film having a small thickness adapted to the low voltage.

    Dynamic memory
    8.
    发明授权
    Dynamic memory 失效
    动态内存

    公开(公告)号:US5905685A

    公开(公告)日:1999-05-18

    申请号:US951734

    申请日:1997-10-15

    摘要: In a dynamic RAM having a memory cell array in which a dynamic memory cell is arranged at an intersection between a word line and one of a pair of bit lines, a select level signal corresponding to a supply voltage and an unselect level signal corresponding to a negative potential lower than circuit ground potential are supplied to the word line. A signal of a memory cell read to the pair of bit lines by a sense amplifier that operates on the circuit ground potential and an internal voltage formed by dropping the supply voltage by an amount equivalent to the threshold voltage of the address select MOSFET is amplified. The dynamic RAM has an oscillator that receives the supply voltage and circuit ground potential and a circuit that receives an oscillation pulse generated by the oscillator to generate the negative potential.

    摘要翻译: 在具有存储单元阵列的动态RAM中,其中动态存储单元布置在字线和一对位线中的一个位线之间的交叉点处,对应于电源电压的选择电平信号和对应于 低于电路接地电位的负电位被提供给字线。 通过由电路接地电位进行工作的读出放大器对一对位线读取的存储单元的信号和通过将电源电压降低等于地址选择MOSFET的阈值电压的量而形成的内部电压被放大。 动态RAM具有接收电源电压和电路接地电位的振荡器,以及接收由振荡器产生的振荡脉冲以产生负电位的电路。