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1.发明申请OPTO-ACOUSTOELECTRIC DEVICE AND METHODS FOR ANALYZING MECHANICAL VIBRATION AND SOUND 审中-公开用于分析机械振动和声音的光电装置和方法公开(公告)号：US20070028695A1
公开(公告)日：2007-02-08
申请号：US11534541
申请日：2006-09-22
申请人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
发明人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
IPC分类号： G01H9/00
CPC分类号： G01H9/00
摘要： An opto-acoustoelectric device encompasses a diaphragm having a diffraction grating, the diaphragm is susceptible to a vibration driven by an external force; a light source oriented to irradiate the diffraction grating; and a photo detector configured to detect the light diffracted by the diffraction grating and to convert the detected light into an electric signal. The electric signal corresponds to a displacement of the vibration in the diaphragm.
摘要翻译： 光声装置包括具有衍射光栅的光阑，所述光阑易受外力驱动的振动; 定向成照射衍射光栅的光源; 以及光检测器，被配置为检测由衍射光栅衍射的光并将检测到的光转换成电信号。 电信号对应于隔膜中振动的位移。
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2.发明授权Opto-acoustoelectric device and methods for analyzing mechanical vibration and sound 失效光电装置及分析机械振动和声音的方法公开(公告)号：US07134343B2
公开(公告)日：2006-11-14
申请号：US10895049
申请日：2004-07-21
申请人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
发明人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
CPC分类号： G01H9/00
摘要： An opto-acoustoelectric device encompasses a diaphragm having a diffraction grating, the diaphragm is susceptible to a vibration driven by an external force; a light source oriented to irradiate the diffraction grating; and a photo detector configured to detect the light diffracted by the diffraction grating and to convert the detected light into an electric signal. The electric signal corresponds to a displacement of the vibration in the diaphragm.
摘要翻译： 光声装置包括具有衍射光栅的光阑，所述光阑易受外力驱动的振动; 定向成照射衍射光栅的光源; 以及光检测器，被配置为检测由衍射光栅衍射的光并将检测到的光转换成电信号。 电信号对应于隔膜中振动的位移。
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3.发明申请Opto-acoustoelectric device and methods for analyzing mechanical vibration and sound 失效光电装置及分析机械振动和声音的方法公开(公告)号：US20050052724A1
公开(公告)日：2005-03-10
申请号：US10895049
申请日：2004-07-21
申请人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
发明人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
CPC分类号： G01H9/00
摘要： An opto-acoustoelectric device encompasses a diaphragm having a diffraction grating, the diaphragm is susceptible to a vibration driven by an external force; a light source oriented to irradiate the diffraction grating; and a photo detector configured to detect the light diffracted by the diffraction grating and to convert the detected light into an electric signal. The electric signal corresponds to a displacement of the vibration in the diaphragm.
摘要翻译： 光声装置包括具有衍射光栅的光阑，所述光阑易受外力驱动的振动; 定向成照射衍射光栅的光源; 以及光检测器，被配置为检测由衍射光栅衍射的光并将检测到的光转换成电信号。 电信号对应于隔膜中振动的位移。
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公开(公告)号：US07293463B2
公开(公告)日：2007-11-13
申请号：US11116273
申请日：2005-04-28
CPC分类号： G01N29/2418 , G01H9/00
摘要： In an acoustoelectric converter element, a light wave from a light source is introduced into a first optical waveguide of a vibration substrate, and diffracted by a diffraction grating disposed on the first optical waveguide. The diffracted light is directed to and detected by a photo detector. Here, the vibration substrate is so supported as to vibrate with respect to an acoustic wave. Therefore, the diffracted light detected by the photo detector is modulated by the acoustic wave, and a signal is output from the detector in accordance with the acoustic wave.
摘要翻译： 在声电转换元件中，来自光源的光波被引入到振动基板的第一光波导中，并且被设置在第一光波导上的衍射光栅衍射。 衍射光被光检测器导向并检测。 这里，振动基板被支撑为相对于声波振动。 因此，由光检测器检测的衍射光被声波调制，并且根据声波从检测器输出信号。
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公开(公告)号：US20050241398A1
公开(公告)日：2005-11-03
申请号：US11116273
申请日：2005-04-28
CPC分类号： G01N29/2418 , G01H9/00
摘要： In an acoustoelectric converter element, a light wave from a light source is introduced into a first optical waveguide of a vibration substrate, and diffracted by a diffraction grating disposed on the first optical waveguide. The diffracted light is directed to and detected by a photo detector. Here, the vibration substrate is so supported as to vibrate with respect to an acoustic wave. Therefore, the diffracted light detected by the photo detector is modulated by the acoustic wave, and a signal is output from the detector in accordance with the acoustic wave.
摘要翻译： 在声电转换元件中，来自光源的光波被引入到振动基板的第一光波导中，并且被设置在第一光波导上的衍射光栅衍射。 衍射光被光检测器导向并检测。 这里，振动基板被支撑为相对于声波振动。 因此，由光检测器检测的衍射光被声波调制，并且根据声波从检测器输出信号。
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6.发明申请Method and device of metamorphosing cells, and treatment apparatus using the same 审中-公开变形细胞的方法和装置，以及使用其的处理装置公开(公告)号：US20070196920A1
公开(公告)日：2007-08-23
申请号：US11507674
申请日：2006-08-22
CPC分类号： A61N5/00 , A61N1/406 , A61N5/0601
摘要： A cell metamorphosing device includes micro dishes which serves as diaphragms and hold a mixed medium containing harmful cells and nano-scale particles, an AC voltage supply, a heater and an inductor. The AC voltage supply faces with the micro dishes 2 with a space, and applies a bias to the micro dishes 2, so that the nano-scale particles are bombarded onto the harmful cells and destroy them.
摘要翻译： 细胞变形装置包括用作隔膜并保持含有有害细胞和纳米级粒子的混合介质，AC电压源，加热器和电感器的微型盘。 交流电压供给面与微型菜肴2具有空间，并向微型菜肴2施加偏压，使得纳米级颗粒被轰击到有害细胞上并将其破坏。
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7.发明申请Hybrid type semiconductor integrated circuit and method of manufacturing the same 审中-公开混合型半导体集成电路及其制造方法公开(公告)号：US20060180898A1
公开(公告)日：2006-08-17
申请号：US11356413
申请日：2006-02-16
CPC分类号： B81C1/00246 , B81C2203/0778 , H01L21/84 , H01L27/1203
摘要： A hybrid type semiconductor integrated circuit includes a semiconductor active region provided in a first area of a substrate; an insulating region surrounding side surfaces of the semiconductor active region; a mechanical electrode provided in a second area adjacent to the first area and surrounded by a part of the insulating region and a trench; and a interconnection layer one end of which is connected to the mechanical electrode and of which the other end extends to the semiconductor active region via a part of the insulating region.
摘要翻译： 混合型半导体集成电路包括：设置在基板的第一区域中的半导体有源区; 围绕所述半导体有源区域的侧表面的绝缘区域; 设置在与所述第一区域相邻并被所述绝缘区域的一部分包围的第二区域中的机械电极和沟槽; 并且其一端连接到机械电极并且另一端经由绝缘区域的一部分延伸到半导体有源区的互连层。
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公开(公告)号：US08304848B2
公开(公告)日：2012-11-06
申请号：US12883732
申请日：2010-09-16
申请人： Kazuhiro Suzuki , Ikuo Fujiwara , Keita Sasaki , Honam Kwon , Hitoshi Yagi , Hiroto Honda , Koichi Ishii , Masako Ogata , Risako Ueno , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Ikuo Fujiwara , Keita Sasaki , Honam Kwon , Hitoshi Yagi , Hiroto Honda , Koichi Ishii , Masako Ogata , Risako Ueno , Hideyuki Funaki
摘要： Certain embodiments provide an infrared imaging device including: an SOI structure that is placed at a distance from a substrate, and includes: heat-sensitive diodes that detect infrared rays and convert the infrared rays into heat; and STI regions that separate the heat-sensitive diodes from one another; an interlayer insulating film that is stacked on the SOI structure; and supporting legs that are connected to the heat-sensitive diodes and vertical signal lines provided in outer peripheral regions of the heat-sensitive diodes. Each of the supporting legs includes: an interconnect unit that transmit signals to the vertical signal lines; and interlayer insulating layers that sandwich the interconnect unit, each bottom side of the interlayer insulating layers being located in a higher position than the SOI structure.
摘要翻译： 某些实施例提供了一种红外成像装置，包括：SOI结构，其被放置在离基板一定距离处，并且包括：热敏二极管，其检测红外线并将红外线转换成热; 以及将热敏二极管彼此分离的STI区域; 堆叠在SOI结构上的层间绝缘膜; 以及连接到热敏二极管的支撑腿和设置在热敏二极管的外周区域中的垂直信号线。 每个支撑腿包括：将信号传输到垂直信号线的互连单元; 以及层叠绝缘层，夹着所述互连单元，所述层间绝缘层的每个底侧位于比所述SOI结构更高的位置。
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公开(公告)号：US08629396B2
公开(公告)日：2014-01-14
申请号：US13235388
申请日：2011-09-18
申请人： Masako Ogata , Ikuo Fujiwara , Hiroto Honda , Kazuhiro Suzuki , Honam Kwon , Risako Ueno , Hitoshi Yagi , Masaki Atsuta , Koichi Ishii , Keita Sasaki , Hideyuki Funaki
发明人： Masako Ogata , Ikuo Fujiwara , Hiroto Honda , Kazuhiro Suzuki , Honam Kwon , Risako Ueno , Hitoshi Yagi , Masaki Atsuta , Koichi Ishii , Keita Sasaki , Hideyuki Funaki
IPC分类号： H01L27/146
CPC分类号： H01L27/14649 , H01L27/14632 , H01L27/14687
摘要： An uncooled infrared imaging element includes a pixel region, a device region, and a support substrate. The pixel region includes heat-sensitive pixels. The heat-sensitive pixels are arranged in a matrix and change current-voltage characteristics thereof in accordance with receiving amounts of infrared. The device region includes at least one of a drive circuit and a readout circuit which includes a MOS transistor. The drive circuit drives the heat-sensitive pixels. The readout circuit detects signals of the heat-sensitive pixels. The support substrate is provided with a cavity region to be under pixel region and the MOS transistor.
摘要翻译： 非制冷红外成像元件包括像素区域，器件区域和支撑衬底。 像素区域包括热敏像素。 热敏像素被布置成矩阵并且根据接收到的红外线量来改变其电流 - 电压特性。 器件区域包括驱动电路和包括MOS晶体管的读出电路中的至少一个。 驱动电路驱动热敏像素。 读出电路检测热敏像素的信号。 支撑基板设置有在像素区域下方的空腔区域和MOS晶体管。
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公开(公告)号：US20120007205A1
公开(公告)日：2012-01-12
申请号：US12883732
申请日：2010-09-16
申请人： Kazuhiro Suzuki , Ikuo Fujiwara , Keita Sasaki , Honam Kwon , Hitoshi Yagi , Hiroto Honda , Koichi Ishii , Masako Ogata , Risako Ueno , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Ikuo Fujiwara , Keita Sasaki , Honam Kwon , Hitoshi Yagi , Hiroto Honda , Koichi Ishii , Masako Ogata , Risako Ueno , Hideyuki Funaki
IPC分类号： H01L31/101 , H01L31/18
摘要： Certain embodiments provide an infrared imaging device including: an SOI structure that is placed at a distance from a substrate, and includes: heat-sensitive diodes that detect infrared rays and convert the infrared rays into heat; and STI regions that separate the heat-sensitive diodes from one another; an interlayer insulating film that is stacked on the SOI structure; and supporting legs that are connected to the heat-sensitive diodes and vertical signal lines provided in outer peripheral regions of the heat-sensitive diodes. Each of the supporting legs includes: an interconnect unit that transmit signals to the vertical signal lines; and interlayer insulating layers that sandwich the interconnect unit, each bottom side of the interlayer insulating layers being located in a higher position than the SOI structure.
摘要翻译： 某些实施例提供了一种红外成像装置，包括：SOI结构，其被放置在离基板一定距离处，并且包括：热敏二极管，其检测红外线并将红外线转换成热; 以及将热敏二极管彼此分离的STI区域; 堆叠在SOI结构上的层间绝缘膜; 以及连接到热敏二极管的支撑腿和设置在热敏二极管的外周区域中的垂直信号线。 每个支撑腿包括：将信号传输到垂直信号线的互连单元; 以及层叠绝缘层，夹着所述互连单元，所述层间绝缘层的每个底侧位于比所述SOI结构更高的位置。
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