公开(公告)号：US06329460B1

公开(公告)日：2001-12-11

申请号：US09547230

申请日：2000-04-11

申请人： Kazunori Ishikawa ,  Fumito Yatsuyanagi ,  Hiroyuki Kaido ,  Naoya Adachi

发明人： Kazunori Ishikawa ,  Fumito Yatsuyanagi ,  Hiroyuki Kaido ,  Naoya Adachi

IPC分类号： C08K55419

CPC分类号： C09D183/12 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/70 ,  C08K9/06 ,  C08K9/08 ,  C08L83/04 ,  C08L83/06 ,  C08L83/12 ,  C09D183/04 ,  C09D183/06 ,  C08L21/00

摘要： A polysiloxane composition comprising (i) an alkoxysilyl group-containing polysiloxane containing at least six siloxane structures having the following formula (I) in a molecule wherein R1 represents a methyl group, ethyl group or phenyl group, and R2 represents a group selected from the group consisting of hydrocarbon group and ether bond-containing hydrocarbon groups having 1 to 6 carbon atoms; and (ii) an alcohol having the formula R4(OR5)p—OH wherein R4 represents a C1-C18 alkyl group, a phenyl group or a benzyl group, R5 represents C1-C6 alkylene group and p is an integer of 0-20.

摘要翻译： 一种聚硅氧烷组合物，其包含（i）在分子中含有至少六个具有下式（I）的硅氧烷结构的含烷氧基甲硅烷基的聚硅氧烷，其中R1表示甲基，乙基或苯基，R2表示选自 由具有1至6个碳原子的烃基和含醚键的烃基组成; 和（ii）具有式R a的醇代表C 1 -C 18烷基，苯基或苄基，R 5表示C 1 -C 6亚烷基，p是0〜20的整数。

公开(公告)号：US06525159B1

公开(公告)日：2003-02-25

申请号：US09155097

申请日：1999-03-30

申请人： Hiroyuki Okuhira ,  Naoya Adachi ,  Kazunori Ishikawa ,  Toshimitsu Takeda ,  Yo Kotani

发明人： Hiroyuki Okuhira ,  Naoya Adachi ,  Kazunori Ishikawa ,  Toshimitsu Takeda ,  Yo Kotani

IPC分类号： C08G7704

CPC分类号： C09D183/08 ,  C08G59/4042 ,  C08G77/18 ,  C08K5/29 ,  C08L63/00 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/44

摘要： This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room temperature moisture curable resin composition containing said silicon containing compound adapted as a latent curing agent which exhibits good shelf stability and short curing period once taken out of the container; and a novel method of ketimine synthesis.

摘要翻译： 本发明提供了一部分室温湿度可固化树脂组合物，其包含通过使α位具有取代基的酮与其分子中具有至少两个氨基的多胺与α位置为亚甲基反应而制备的酮亚胺， 聚合物，其分子中具有至少两个可水解的烷氧基甲硅烷基的环氧树脂和/或改性的硅氧烷，并且其具有良好的储存稳定性和一旦从容器中取出的固化速度高，并且还可以具有柔软性; 表现出良好的储存稳定性和固化性以及湿表面粘合性或初始触变性的一部分室温湿固化树脂组合物; 通过在酮亚胺基附近存在大体积烷基并且具有良好的储存稳定性和固化性，可以防止在储存期间与环氧树脂反应的具有酮亚胺基的含硅化合物及其制备方法; 含有所述含硅化合物的一部分室温湿度固化树脂组合物，其适于作为潜在性固化剂，其一旦从容器中取出，显示良好的储存稳定性和固化时间短; 和一种新的酮亚胺合成方法。

公开(公告)号：US06756466B2

公开(公告)日：2004-06-29

申请号：US10291601

申请日：2002-11-12

申请人： Hiroyuki Okuhira ,  Naoya Adachi ,  Kazunori Ishikawa ,  Toshimitsu Takeda ,  Yo Kotani

发明人： Hiroyuki Okuhira ,  Naoya Adachi ,  Kazunori Ishikawa ,  Toshimitsu Takeda ,  Yo Kotani

IPC分类号： C08G7726

CPC分类号： C09D183/08 ,  C08G59/4042 ,  C08G77/18 ,  C08K5/29 ,  C08L63/00 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/44

摘要： This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room temperature moisture curable resin composition containing said silicon containing compound adapted as a latent curing agent which exhibits good shelf stability and short curing period once taken out of the container; and a novel method of ketimine synthesis.

公开(公告)号：US06936676B2

公开(公告)日：2005-08-30

申请号：US10718725

申请日：2003-11-24

申请人： Hiroyuki Okuhira ,  Naoya Adachi ,  Kazunori Ishikawa ,  Toshimitsu Takeda ,  Yo Kotani

发明人： Hiroyuki Okuhira ,  Naoya Adachi ,  Kazunori Ishikawa ,  Toshimitsu Takeda ,  Yo Kotani

IPC分类号： C08G59/40 ,  C08K5/29 ,  C08L63/00 ,  C08L83/04 ,  C09D183/08 ,  C08G77/26

CPC分类号： C09D183/08 ,  C08G59/4042 ,  C08G77/18 ,  C08K5/29 ,  C08L63/00 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/44

摘要： This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at α position and a polyamine having at least two amino groups within its molecule wherein α position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room temperature moisture curable resin composition containing said silicon containing compound adapted as a latent curing agent which exhibits good shelf stability and short curing period once taken out of the container; and a novel method of ketimine synthesis.

摘要翻译： 本发明提供了一部分室温湿度可固化树脂组合物，其包含通过使α位具有取代基的酮与其分子中具有至少两个氨基的多胺与α位置为亚甲基反应而制备的酮亚胺， 聚合物，其分子中具有至少两个可水解的烷氧基甲硅烷基的环氧树脂和/或改性的硅氧烷，并且其具有良好的储存稳定性和一旦从容器中取出的固化速度高，并且还可以具有柔软性; 表现出良好的储存稳定性和固化性以及湿表面粘合性或初始触变性的一部分室温湿固化树脂组合物; 通过在酮亚胺基附近存在大体积烷基并且具有良好的储存稳定性和固化性，可以防止在储存期间与环氧树脂反应的具有酮亚胺基的含硅化合物及其制备方法; 含有所述含硅化合物的一部分室温湿度固化树脂组合物，其适于作为潜在性固化剂，其一旦从容器中取出，显示良好的储存稳定性和固化时间短; 和一种新的酮亚胺合成方法。

公开(公告)号：US5292812A

公开(公告)日：1994-03-08

申请号：US32701

申请日：1993-03-17

申请人： Hajime Yamazaki ,  Hiroyuki Wakamatsu ,  Toshinobu Takahashi ,  Naoya Adachi

发明人： Hajime Yamazaki ,  Hiroyuki Wakamatsu ,  Toshinobu Takahashi ,  Naoya Adachi

IPC分类号： C08G59/40 ,  C08G59/50 ,  C09J163/00 ,  C08L63/02 ,  C08L63/04 ,  C08L63/10

CPC分类号： C08G59/5073 ,  C08G59/4042 ,  C09J163/00

摘要： Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.

摘要翻译： 选定类型的环氧树脂与所选类型的含羧基的丙烯腈 - 丁二烯和甲基丙烯腈 - 丁二烯共聚物，马来酰亚胺衍生物和咪唑化合物的粘合剂组合物。 所得组合物是电绝缘的，耐热的，高度能够在低压和储存时制造稳定的。

公开(公告)号：US20080068581A1

公开(公告)日：2008-03-20

申请号：US11942320

申请日：2007-11-19

申请人： Naoya Adachi ,  Masayuki Sumita ,  Masaki Sekino

发明人： Naoya Adachi ,  Masayuki Sumita ,  Masaki Sekino

IPC分类号： G03B27/58

CPC分类号： H01L21/68728 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/68707 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. A biasing member that biases a wafer towards a positioning member has a contact surface that substantially faces a wafer-holding surface at an angle. The contact surface is in contact with an outer peripheral area of the wafer so as to bias the wafer slantwise towards the wafer-holding surface. With a resiliently deformable member, the positioning member is brought into contact with the wafer and is held at a predetermined position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member, the resiliently deformable member becomes resiliently deformed so as to allow the positioning member to recede from the predetermined position.

摘要翻译： 提供了能够防止向定位晶片施加过大力的定位台，配备有这种定位台的凸块形成装置以及使用这种定位台进行的凸块形成方法。 朝向定位构件偏置晶片的偏置构件具有基本上以一定角度面对晶片保持表面的接触表面。 接触表面与晶片的外围区域接触，以使晶片朝向晶片保持表面倾斜。 利用可弹性变形的构件，定位构件与晶片接触并保持在预定位置。 当向定位构件施加超过预定幅度的偏压力时，弹性变形构件变得弹性变形，从而允许定位构件从预定位置退回。

公开(公告)号：US06476160B1

公开(公告)日：2002-11-05

申请号：US09356057

申请日：1999-07-16

申请人： Hiroyuki Okuhira ,  Naoya Adachi

发明人： Hiroyuki Okuhira ,  Naoya Adachi

IPC分类号： C08L6302

CPC分类号： C08G18/765 ,  C08G18/58 ,  C08G59/14 ,  C08G59/4042

摘要： A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.

摘要翻译： 包含环氧树脂和酮亚胺化合物的组合物，其中所述环氧树脂是（1）分子中具有不超过羟基的环氧树脂的含量在大于90摩尔％至100摩尔％的范围内的环氧树脂， 或更少，（2）环氧树脂，其中羟基被含异氰酸酯基的化合物封端，（3）环氧树脂，其中羟基被含烷氧基甲硅烷基的化合物封端，或（4）含有 能够封端环氧树脂的羟基的含烷氧基甲硅烷基的化合物。 当使用这些环氧树脂中的任一种并且也使用具有高空间位阻的酮亚胺化合物时，可以提供具有良好的固化性和特别优异的储存稳定性的单组分环氧树脂组合物。

公开(公告)号：US07508495B2

公开(公告)日：2009-03-24

申请号：US11942320

申请日：2007-11-19

申请人： Naoya Adachi ,  Masayuki Sumita ,  Masaki Sekino

发明人： Naoya Adachi ,  Masayuki Sumita ,  Masaki Sekino

IPC分类号： G03B27/58 ,  G03B27/62

CPC分类号： H01L21/68728 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/68707 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. A biasing member that biases a wafer towards a positioning member has a contact surface that substantially faces a wafer-holding surface at an angle. The contact surface is in contact with an outer peripheral area of the wafer so as to bias the wafer slantwise towards the wafer-holding surface. With a resiliently deformable member, the positioning member is brought into contact with the wafer and is held at a predetermined position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member, the resiliently deformable member becomes resiliently deformed so as to allow the positioning member to recede from the predetermined position.

摘要翻译： 提供了能够防止向定位晶片施加过大力的定位台，配备有这种定位台的凸块形成装置以及使用这种定位台进行的凸块形成方法。 朝向定位构件偏置晶片的偏置构件具有基本上以一定角度面对晶片保持表面的接触表面。 接触表面与晶片的外围区域接触，以使晶片朝向晶片保持表面倾斜。 利用可弹性变形的构件，定位构件与晶片接触并保持在预定位置。 当向定位构件施加超过预定幅度的偏压力时，弹性变形构件变得弹性变形，从而允许定位构件从预定位置退回。

公开(公告)号：US06221998B1

公开(公告)日：2001-04-24

申请号：US09424501

申请日：1999-11-24

申请人： Hiroyuki Okuhira ,  Naoya Adachi

发明人： Hiroyuki Okuhira ,  Naoya Adachi

IPC分类号： C08G1832

CPC分类号： C08G18/765 ,  C08G18/10 ,  C08G18/3256 ,  C08G18/3893 ,  C08G18/503

摘要： An isocyanate-based one-part moisture curable composition having excellent storage stability and high curing rate, and use of this composition enables production of a cured product of high flexibility without using any plasticizer. The composition comprises (A) an isocyanate compound having a structure wherein all of the isocyanate (NCO) groups in the molecule have secondary or tertiary carbon bonded thereto, and (B) a ketimine having ketimine (C═N) bond derived from a ketone or an aldehyde and an amine having a structure wherein &agr;-position of at least one of the carbon or the nitrogen of the ketimine bond has a branched carbon atom or a ring member carbon atom bonded thereto. A urethane prepolymer having such structure is preferable for use as the isocyanate compound (A).

摘要翻译： 具有优异的储存稳定性和高固化速度的异氰酸酯基的一部分湿气固化性组合物，并且使用该组合物能够在不使用任何增塑剂的情况下生产高柔性的固化产物。 该组合物包含（A）具有结构的异氰酸酯化合物，其中分子中的所有异氰酸酯（NCO）基团都具有二级或叔碳键合，和（B）酮衍生自酮的酮亚胺（C = N）键 或具有其中酮亚胺键的碳或氮中的至少一个的α-位具有支链碳原子或与其结合的环成员碳原子的结构的醛和胺。 具有这种结构的氨基甲酸酯预聚物优选用作异氰酸酯化合物（A）。