Semiconductor device and method of manufacturing the same
    2.
    发明申请
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20080119021A1

    公开(公告)日:2008-05-22

    申请号:US12007751

    申请日:2008-01-15

    IPC分类号: H01L21/336

    摘要: A semiconductor device comprises a semiconductor substrate, and a non-volatile memory cell provided on the semiconductor substrate, the non-volatile memory cell comprising a tunnel insulating film having a film thickness periodically and continuously changing in a channel width direction of the non-volatile memory cell, a floating gate electrode provided on the tunnel insulating film, a control gate electrode provided above the floating gate electrode, and an interelectrode insulating film provided between the control gate electrode and the floating gate electrode.

    摘要翻译: 半导体器件包括半导体衬底和设置在半导体衬底上的非易失性存储单元,所述非易失性存储单元包括隧道绝缘膜,所述隧道绝缘膜具有在非易失性的沟道宽度方向周期性且连续变化的膜厚度 存储单元,设置在隧道绝缘膜上的浮置栅电极,设置在浮置栅电极上方的控制栅电极,以及设置在控制栅电极和浮栅之间的电极间绝缘膜。

    MOSFET WITH A THIN GATE INSULATING FILM
    3.
    发明申请
    MOSFET WITH A THIN GATE INSULATING FILM 审中-公开
    具有薄栅绝缘膜的MOSFET

    公开(公告)号:US20080048250A1

    公开(公告)日:2008-02-28

    申请号:US11846369

    申请日:2007-08-28

    IPC分类号: H01L27/06

    摘要: A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (TOX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the gate electrode (2) is determined to be equal to or less than 0.3 μm; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.

    摘要翻译: 半导体器件包括:p型半导体衬底(1); 绝缘膜(3); 经由所述绝缘膜形成在所述基板上的栅电极(2) 以及形成在形成在基板(1)上的栅电极(2)下方的沟道形成区域(4)的两侧的n型源极/漏极区域(5)。 特别地,在氧化硅膜的转换率(氧化硅当量厚度)下,确定绝缘膜(3)的厚度(T×OX )小于2.5nm。 栅极(2)的栅极长度(L SUB)确定为等于或小于0.3μm; 并且进一步施加到栅极(2)和漏极区(6)的电压被确定为1.5V或更小。 因此,在具有隧穿栅极氧化膜(3)的MOSFET中,可以提高热载流子应力下的晶体管的可靠性,并且可以显着降低栅极漏电流,从而可以显着提高晶体管特性。

    MOSFET with a thin gate insulating film
    4.
    发明授权
    MOSFET with a thin gate insulating film 失效
    具有薄栅绝缘膜的MOSFET

    公开(公告)号:US06929990B2

    公开(公告)日:2005-08-16

    申请号:US10681318

    申请日:2003-10-09

    摘要: A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (TOX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the gate electrode (2) is determined to be equal to or less than 0.3 μm; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.

    摘要翻译: 半导体器件包括:p型半导体衬底(1); 绝缘膜(3); 经由所述绝缘膜形成在所述基板上的栅电极(2) 以及形成在形成在基板(1)上的栅电极(2)下方的沟道形成区域(4)的两侧的n型源极/漏极区域(5)。 特别地,在氧化硅膜的转换率(氧化硅当量厚度)下,确定绝缘膜(3)的厚度(T×OX )小于2.5nm。 栅极(2)的栅极长度(L SUB)确定为等于或小于0.3μm; 并且进一步施加到栅极(2)和漏极区(6)的电压被确定为1.5V或更小。 因此,在具有隧穿栅极氧化膜(3)的MOSFET中,可以提高热载流子应力下的晶体管的可靠性,并且可以显着降低栅极漏电流,从而可以显着提高晶体管特性。

    MOSFET with a thin gate insulating film

    公开(公告)号:US06410952B1

    公开(公告)日:2002-06-25

    申请号:US09828205

    申请日:2001-04-09

    IPC分类号: H01L2976

    摘要: A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (TOX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the gate electrode (2) is determined to be equal to or less than 0.3 &mgr;m; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.

    Image process unit having charging member impedance correction feature
    7.
    发明授权
    Image process unit having charging member impedance correction feature 失效
    具有充电元件阻抗校正功能的图像处理单元

    公开(公告)号:US5475472A

    公开(公告)日:1995-12-12

    申请号:US213836

    申请日:1994-03-16

    CPC分类号: G03G15/0216

    摘要: An image forming apparatus includes an image bearing member; a charging member for charging the image bearing member; an image forming device for forming an image on the image bearing member; and an impedance circuit between the charging member and a voltage source for supplying electric power to the charging member, the impedance circuit having an impedance which is peculiar to individual image forming apparatus in accordance with an impedance of the charging member.

    摘要翻译: 图像形成装置包括:图像承载部件; 用于对图像承载部件充电的充电部件; 图像形成装置,用于在图像承载部件上形成图像; 以及充电构件和用于向充电构件供电的电压源之间的阻抗电路,所述阻抗电路具有根据充电构件的阻抗的各个图像形成装置特有的阻抗。

    Image forming apparatus
    10.
    发明授权
    Image forming apparatus 失效
    图像形成装置

    公开(公告)号:US08099011B2

    公开(公告)日:2012-01-17

    申请号:US11954059

    申请日:2007-12-11

    IPC分类号: G03G15/00

    CPC分类号: G03G15/0266 G03G2215/021

    摘要: Embodiments of the present invention include an image bearing member arranged to bear an electrostatic latent image, a charging member contacting the image bearing member to charge a surface of the image bearing member with application of a DC voltage to the charging member, a current detection unit arranged to detect a DC current flowing in the charging member, and a control unit configured to control the voltage applied to the charging member, wherein a plurality of different DC voltages are successively applied to the charging member during a period of no image formation until a change amount of change in the DC current with respect to change in the DC voltage becomes not larger than a predetermined value, and the control unit controls a DC voltage applied to the charging member during a period of image formation based on a result detected by the current detection unit.

    摘要翻译: 本发明的实施例包括布置成承载静电潜像的图像承载部件,与图像承载部件接触以对图像承载部件的表面施加直流电压给充电部件充电的充电部件,电流检测单元 被配置为检测在充电构件中流动的直流电流;以及控制单元,被配置为控制施加到充电构件的电压,其中在无图像形成期间,将多个不同的直流电压连续地施加到充电构件,直到 直流电流相对于直流电压变化的变化量变得不大于预定值,并且控制单元在图像形成期间根据检测到的结果控制施加到充电部件的直流电压 电流检测单元。