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公开(公告)号：US06859029B2
公开(公告)日：2005-02-22
申请号：US10625740
申请日：2003-07-24
申请人： Kazunori Yamanaka , Isao Nakazawa , Masafumi Shigaki , Manabu Kai
发明人： Kazunori Yamanaka , Isao Nakazawa , Masafumi Shigaki , Manabu Kai
CPC分类号： H01P5/183
摘要： A monitoring system for high-frequency circuits which minimizes the insertion loss of additional monitoring circuits while requiring only a small space. An input coupler is placed at the input of a high-frequency circuit whose frequency response is to be monitored. The input coupler has a space where a given high-frequency probing signal can propagate, and it combines this propagating signal with a given electrical input signal. The combined signal is processed by the high-frequency circuit, and the resulting signal is supplied to an output coupler. The output coupler has a space for propagation of a high-frequency probing signal component contained in the received combined signal. The output coupler extracts this propagating signal component for the purpose of monitoring.
摘要翻译： 一种用于高频电路的监控系统，其最小化附加监控电路的插入损耗，同时只需要较小的空间。 输入耦合器放置在要监视其频率响应的高频电路的输入端。 输入耦合器具有给定的高频探测信号可以传播的空间，并且将该传播信号与给定的电输入信号组合。 组合信号由高频电路处理，结果信号被提供给输出耦合器。 输出耦合器具有用于传播包含在接收的组合信号中的高频探测信号分量的空间。 输出耦合器提取该传播信号分量用于监视。
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公开(公告)号：US20070001910A1
公开(公告)日：2007-01-04
申请号：US11454197
申请日：2006-06-16
IPC分类号： H01Q1/38
CPC分类号： H01Q21/064 , H01Q1/364 , H01Q9/0407 , H01Q13/02 , H01Q13/06 , H01Q21/062 , H01Q21/065
摘要： An antenna device includes a plane-type antenna element, a heat insulation container for blocking heat entering from the outside, the heat insulation container having a radio-wave window allowing a radio wave to pass therethrough, and housing the plane-type antenna element, a waveguide housed in the heat insulation container and arranged between the radio-wave window and an antenna pattern formation surface of the plane-type antenna element, and cooling means for cooling the plane-type antenna element. The waveguide is shaped and dimensioned so that the directivity of the plane-type antenna element is enhanced, and a superconducting film is used for the antenna pattern of the plane-type antenna element.
摘要翻译： 天线装置包括平面型天线元件，用于阻挡从外部进入的热的绝热容器，具有允许无线电波通过的无线电波窗口的隔热容器，以及容纳该平面型天线元件， 容纳在隔热容器中并布置在平面型天线元件的无线电波窗口和天线图案形成表面之间的波导，以及用于冷却平面型天线元件的冷却装置。 波导的形状和尺寸使得平面型天线元件的方向性增强，并且超导膜用于平面型天线元件的天线图案。
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公开(公告)号：US07495615B2
公开(公告)日：2009-02-24
申请号：US10790769
申请日：2004-03-03
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0457 , H01Q1/364
摘要： An antenna coupling module for electromagnetically coupling a planar antenna and a planar type oxide superconductive high frequency circuit not reducing the antenna effective area and sharply reducing the signal loss due to coupling, comprised of a planar antenna and a substrate forming a planar superconductive high frequency circuit arranged in a perpendicular direction with respect to the element surface of the planar antenna and having the planar antenna and the superconductive high frequency circuit electromagnetically coupled.
摘要翻译： 一种用于电磁耦合平面天线和平面型氧化物超导高频电路的天线耦合模块，其不减少天线有效面积并且显着降低由耦合引起的信号损耗，包括平面天线和形成平面超导高频电路的衬底 相对于平面天线的元件表面垂直布置，并且具有平面天线和电磁耦合的超导高频电路。
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公开(公告)号：US20080144287A1
公开(公告)日：2008-06-19
申请号：US11873445
申请日：2007-10-17
IPC分类号： H05K7/20
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.
摘要翻译： 在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和 作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或 更多的螺钉，并且当由于紧固而被按压10N / cm 2以上的压力时，该片被安装在外壳上。
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公开(公告)号：US20050029546A1
公开(公告)日：2005-02-10
申请号：US10930350
申请日：2004-08-27
IPC分类号： H01L23/373 , H01L23/40 , H01L23/66 , H01L31/109 , H05K1/02 , H05K1/14 , H05K1/18
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.
摘要翻译： 在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和 作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或 更多的螺钉，并且当由于紧固而被压制10N / cm 2或更大的压力时，该片被安装在外壳上。
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公开(公告)号：US07729129B2
公开(公告)日：2010-06-01
申请号：US11873445
申请日：2007-10-17
IPC分类号： H05K9/00
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.
摘要翻译： 在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段中使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和 作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或 更多的螺钉，并且当由于紧固而以10N / cm 2或更大的压力按压时，该片被安装在外壳上。
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公开(公告)号：US07379023B2
公开(公告)日：2008-05-27
申请号：US11454197
申请日：2006-06-16
IPC分类号： H01Q1/38
CPC分类号： H01Q21/064 , H01Q1/364 , H01Q9/0407 , H01Q13/02 , H01Q13/06 , H01Q21/062 , H01Q21/065
摘要： An antenna device includes a plane-type antenna element, a heat insulation container for blocking heat entering from the outside, the heat insulation container having a radio-wave window allowing a radio wave to pass therethrough, and housing the plane-type antenna element, a waveguide housed in the heat insulation container and arranged between the radio-wave window and an antenna pattern formation surface of the plane-type antenna element, and cooling means for cooling the plane-type antenna element. The waveguide is shaped and dimensioned so that the directivity of the plane-type antenna element is enhanced, and a superconducting film is used for the antenna pattern of the plane-type antenna element.
摘要翻译： 天线装置包括平面型天线元件，用于阻挡从外部进入的热的绝热容器，具有允许无线电波通过的无线电波窗口的隔热容器，以及容纳该平面型天线元件， 容纳在隔热容器中并布置在平面型天线元件的无线电波窗口和天线图案形成表面之间的波导，以及用于冷却平面型天线元件的冷却装置。 波导的形状和尺寸使得平面型天线元件的方向性增强，并且超导膜用于平面型天线元件的天线图案。
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公开(公告)号：US07285429B2
公开(公告)日：2007-10-23
申请号：US10930350
申请日：2004-08-27
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.
摘要翻译： 在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和 作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或 更多的螺钉，并且当由于紧固而被按压10N / cm 2以上的压力时，该片被安装在外壳上。
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9.发明授权公开(公告)号：US07283855B2
公开(公告)日：2007-10-16
申请号：US10647237
申请日：2003-08-26
摘要： A dielectric waveguide which comprises a first single crystal magnesium oxide block having a surface of face (001), (100) or (010) and a first copper oxide superconducting film formed on the above-described surface in a c-axis crystal orientation perpendicular to the surface, and a method of production thereof are provided.
摘要翻译： 一种电介质波导，包括具有表面（001），（100）或（010）的表面的第一单晶氧化镁块和在上述表面上以c轴晶体取向垂直的方式形成的第一铜氧化物超导膜 并提供其制造方法。
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公开(公告)号：US4855895A
公开(公告)日：1989-08-08
申请号：US196620
申请日：1988-05-19
IPC分类号： H03K21/00 , H03B21/02 , H03K3/0233 , H03K3/356 , H03K23/68
CPC分类号： H03B21/02 , H03K23/68 , H03K3/0233 , H03K3/356034
摘要： A frequency dividing apparatus having an input signal terminal and a divided signal terminal, whereby a high frequency input to the input signal terminal is divided by a mixer having a first input terminal connected to the input signal terminal having a second input terminal, and having an output terminal connected to the divided signal terminal. A frequency divider is provided having a fixed frequency dividing ratio. The frequency divider has an input terminal connected to the divided signal terminal and an output terminal connected to the second input terminal of the mixer.
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