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    Regeneration method and apparatus of wafer and substrate
    1.
    发明授权
    Regeneration method and apparatus of wafer and substrate 失效
    晶圆和基片再生方法及装置

    公开(公告)号：US5981301A

    公开(公告)日：1999-11-09

    申请号：US804732

    申请日：1997-02-21

    申请人： Kazuo Muramatsu ,  Akihiro Kawai ,  Tsutomu Watanabe ,  Satoshi Shimamoto

    发明人： Kazuo Muramatsu ,  Akihiro Kawai ,  Tsutomu Watanabe ,  Satoshi Shimamoto

    IPC分类号： B24B51/00 ,  B24B53/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/66 ,  H01L23/544 ,  H01L21/00

    CPC分类号： H01L22/34 ,  B24B37/042 ,  H01L21/02032 ,  H01L2924/0002 ,  Y10S438/906 ,  Y10S438/959

    摘要： A method for regenerating a used wafer or substrate by removing a functional coating film formed on the used wafer or substrate, comprising the steps of:(a) a step for sorting the used wafer or substrate according to the quality, structure or thickness of the functional coating film;(b) a step for removing the functional coating film, while in a state of holding the used wafer or substrate, (i) by lapping the objective face of the used wafer or substrate with a hard metal-bonded whetstone while applying an electrochemical in-process dressing, (ii) by polishing the objective face while dropping a fine-particle polishing slurry between a polishing plate provided with a pad and the functional coating film, or (iii) by electrolyzing the functional coating film on the objective face placed opposite to an electrode face in an electrolyte solution at a predetermined voltage;(c) a step for mechanically removing the functional coating film adhered to the end face at an adequate stage; and(d) a step for washing and drying the used wafer or substrate after removal of the functional coating film.

    摘要翻译： 一种用于通过去除在所使用的晶片或衬底上形成的功能性涂层来再生所使用的晶片或衬底的方法，包括以下步骤：（a）根据质量，结构或厚度对所使用的晶片或衬底进行分选的步骤 功能性涂膜; （b）在保持所使用的晶片或基板的状态下，（i）通过用硬质金属结合的砂轮研磨所使用的晶片或基板的物镜，同时施加电化学 （ii）通过抛光目标面，同时在设置有衬垫的抛光板和功能性涂膜之间滴下细粒抛光浆料，或（iii）通过电解相对放置的物镜面上的功能性涂膜 以预定电压在电解质溶液中的电极面; （c）在足够的阶段机械去除附着在端面上的功能性涂膜的步骤; 以及（d）除去功能性涂膜后，对使用过的晶片或基板进行清洗干燥的工序。

    ELECTRONIC COMPONENT MOUNTING APPARATUS
    2.
    发明申请
    ELECTRONIC COMPONENT MOUNTING APPARATUS 有权
    电子元件安装设备

    公开(公告)号：US20100186223A1

    公开(公告)日：2010-07-29

    申请号：US12727349

    申请日：2010-03-19

    申请人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama ,  Kazuyoshi Ieizumi

    发明人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama ,  Kazuyoshi Ieizumi

    IPC分类号： H05K13/04

    CPC分类号： H05K13/0812 ,  H05K13/0215 ,  H05K13/0417 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译： 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作，并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后，当CPU判断连接带到达拾取位置时，CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置，摄像机拍摄图像 存储带的存储部分，以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中，并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Electronic component mounting apparatus
    3.
    发明申请
    Electronic component mounting apparatus 有权
    电子元件安装装置

    公开(公告)号：US20070130756A1

    公开(公告)日：2007-06-14

    申请号：US11605471

    申请日：2006-11-29

    申请人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama ,  Kazuyoshi Ieizumi

    发明人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama ,  Kazuyoshi Ieizumi

    IPC分类号： B23P21/00

    CPC分类号： H05K13/0812 ,  H05K13/0215 ,  H05K13/0417 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译： 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作，并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后，当CPU判断连接带到达拾取位置时，CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置，摄像机拍摄图像 存储带的存储部分，以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中，并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Lower-face electrode type solid electrolytic multilayer capacitor and mounting member having the same
    4.
    发明授权
    Lower-face electrode type solid electrolytic multilayer capacitor and mounting member having the same 有权
    下表面电极型固体电解多层电容器及其安装构件

    公开(公告)号：US08320106B2

    公开(公告)日：2012-11-27

    申请号：US12950312

    申请日：2010-11-19

    申请人： Akihiro Kawai ,  Kenji Araki

    发明人： Akihiro Kawai ,  Kenji Araki

    IPC分类号： H01G4/228 ,  H01G9/00

    CPC分类号： H01G9/15 ,  H01G9/012 ,  H01G9/08 ,  H01G9/14

    摘要： In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an electrode substrate, and a covering resin cutting portion on an edge face of a covering resin in a staircase pattern so that the electrode substrate cutting portion is surrounded by the covering resin cutting portion. According to the present invention, it is possible to provide the lower-face electrode type solid electrolytic multilayer capacitor and the mounting member having the same, in which the productivity is excellent, the volume efficiency can be improved to achieve the high capacitance, and the stable fillet can be formed on mounting.

    摘要翻译： 在根据本发明的下表面电极型固体电解多层电容器和具有该固定电解层叠电容器的安装构件中，通过在长边方向上或更短的边缘面的预定部分处形成电极基板切割部分而形成圆角形状部分 电极基板的方向，覆盖树脂切割部分在覆盖树脂的边缘面上呈阶梯状，使得电极基板切断部被覆盖树脂切断部包围。 根据本发明，可以提供下面的电极型固体电解多层电容器和具有该电容器的安装构件，其中生产率优异，可以提高体积效率以实现高电容，并且 安装时可以形成稳定的圆角。

    Surface-mount capacitor and method of producing the same
    6.
    发明授权
    Surface-mount capacitor and method of producing the same 有权
    表面贴装电容器及其制造方法

    公开(公告)号：US07326261B2

    公开(公告)日：2008-02-05

    申请号：US11681112

    申请日：2007-03-01

    申请人： Toshihisa Nagasawa ,  Kenji Araki ,  Hitoshi Takata ,  Akihiro Kawai ,  Shinji Arai

    发明人： Toshihisa Nagasawa ,  Kenji Araki ,  Hitoshi Takata ,  Akihiro Kawai ,  Shinji Arai

    IPC分类号： H01G9/00

    CPC分类号： H01G9/008 ,  H01G9/08 ,  Y10T29/417

    摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.

    摘要翻译： 表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分 以及连接到阴极部分的阴极端子。 阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。 阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。

    Electronic component mounting apparatus
    7.
    发明授权
    Electronic component mounting apparatus 有权
    电子元件安装装置

    公开(公告)号：US07296343B2

    公开(公告)日：2007-11-20

    申请号：US10259783

    申请日：2002-09-30

    申请人： Yoshinao Usui ,  Akihiro Kawai ,  Manabu Okamoto

    发明人： Yoshinao Usui ,  Akihiro Kawai ,  Manabu Okamoto

    IPC分类号： B23P19/00

    CPC分类号： H05K13/0452 ,  H05K13/0812 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

    摘要： An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not. When both X-dimension and Y-dimension of the component measured by the image processing unit are within the tolerance, the Y-dimension measured by the image processing unit and the thickness detected by the sensor are compared and the component is judged normal when the Y-dimension is larger.

    摘要翻译： 即使当部件的宽度和高度之间的差小时，电子部件安装装置也能够可靠地决定部件的异常吸入。 当由传感器检测到的电子部件的厚度与存储在RAM中的厚度的数据之间的差异在公差内时，CPU判断该部件被吸嘴保持在正常姿态，并执行正常处理 控制。 然后，通过识别照相机捕获电子部件的图像，并且由图像处理单元进行识别处理以测量部件的几何形状。 然后，CPU判断组件的大小是否在公差范围内。 当由图像处理单元测量的分量的X维度和Y维度都在公差内时，比较由图像处理单元测量的Y维度和由传感器检测到的厚度，并且当该分量被判断为正态分布时 Y尺寸较大。

    Surface-mount capacitor and method of producing the same
    8.
    发明授权
    Surface-mount capacitor and method of producing the same 有权
    表面贴装电容器及其制造方法

    公开(公告)号：US07206193B2

    公开(公告)日：2007-04-17

    申请号：US11260831

    申请日：2005-10-27

    申请人： Toshihisa Nagasawa ,  Kenji Araki ,  Hitoshi Takata ,  Akihiro Kawai ,  Shinji Arai

    发明人： Toshihisa Nagasawa ,  Kenji Araki ,  Hitoshi Takata ,  Akihiro Kawai ,  Shinji Arai

    IPC分类号： H01G2/10 ,  H01G9/08

    CPC分类号： H01G9/008 ,  H01G9/08 ,  Y10T29/417

    摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.

    摘要翻译： 表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由 条状板14和连接到阴极部分12的阴极端子19。 阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。 阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。

    SURFACE-MOUNT CAPACITOR AND METHOD OF PRODUCING THE SAME
    9.
    发明申请
    SURFACE-MOUNT CAPACITOR AND METHOD OF PRODUCING THE SAME 有权
    表面安装电容器及其制造方法

    公开(公告)号：US20070148900A1

    公开(公告)日：2007-06-28

    申请号：US11681112

    申请日：2007-03-01

    申请人： Toshihisa NAGASAWA ,  Kenji Araki ,  Hitoshi Takata ,  Akihiro Kawai ,  Shinji Arai

    发明人： Toshihisa NAGASAWA ,  Kenji Araki ,  Hitoshi Takata ,  Akihiro Kawai ,  Shinji Arai

    IPC分类号： H01L21/20

    CPC分类号： H01G9/008 ,  H01G9/08 ,  Y10T29/417

    摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.

    摘要翻译： 表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分 以及连接到阴极部分的阴极端子。 阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。 模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。 阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。