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    Glass substrate having circuit pattern and process for producing the same
    3.
    发明授权
    Glass substrate having circuit pattern and process for producing the same 有权
    具有电路图案的玻璃基板及其制造方法

    公开(公告)号：US07846641B2

    公开(公告)日：2010-12-07

    申请号：US12143446

    申请日：2008-06-20

    申请人： Ryohei Satoh ,  Koji Nakagawa ,  Reo Usui ,  Kenji Tanaka ,  Satoru Takaki ,  Kenichi Ebata ,  Yumiko Aoki

    发明人： Ryohei Satoh ,  Koji Nakagawa ,  Reo Usui ,  Kenji Tanaka ,  Satoru Takaki ,  Kenichi Ebata ,  Yumiko Aoki

    IPC分类号： G03F7/26

    CPC分类号： H05K3/28 ,  H01J9/02 ,  H01J11/12 ,  H01J11/34 ,  H05K1/0306 ,  H05K3/027 ,  H05K3/38 ,  H05K2201/0269 ,  Y10T428/24868

    摘要： A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of from 450 to 630° C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.

    摘要翻译： 公开了一种具有电路图案的玻璃基板的制造方法。 该方法包括在玻璃基板上形成薄膜层，然后用激光照射薄膜层，以在玻璃基板上形成电路图案; 在其上形成有电路图案的玻璃基板上沉积软化点为450〜630℃的低熔点玻璃; 并烧结低熔点玻璃以形成低熔点玻璃层，该低熔点玻璃层包括在其上形成有电路图案的玻璃基板上烧结的低熔点玻璃，并且在玻璃基板和低熔点玻璃之间形成相容层， 熔点玻璃层。

    Substrate with through-holes for grid-like auxiliary wiring pattern
    4.
    发明授权
    Substrate with through-holes for grid-like auxiliary wiring pattern 有权
    基板具有栅格状辅助布线图案的通孔

    公开(公告)号：US08530748B2

    公开(公告)日：2013-09-10

    申请号：US13080269

    申请日：2011-04-05

    申请人： Nobuhiro Nakamura ,  Yumiko Aoki ,  Naoya Wada

    发明人： Nobuhiro Nakamura ,  Yumiko Aoki ,  Naoya Wada

    IPC分类号： H05K1/03

    CPC分类号： H01L51/5212 ,  H01L51/5268

    摘要： A substrate includes an auxiliary wiring pattern formed on a first main surface of a glass substrate in a grid-like pattern arranged horizontally and vertically, and a translucent glass layer formed on a surface of the glass substrate to cover the first main surface and the auxiliary wiring pattern. Through-holes exposing the auxiliary wiring pattern are formed in a portion of the translucent glass layer formed on the auxiliary wiring pattern, in each side of each grid of the grid-like pattern at uniform intervals. The substrate may be used in an electronic device having a long-life and a high reliability in which exfoliation or deterioration of a wiring is inhibited by embedding the wiring therein while maintaining smoothness of the surface.

    摘要翻译： 基板包括形成在玻璃基板的第一主表面上的水平和垂直布置的格子状图案的辅助布线图案，以及形成在玻璃基板的表面上以覆盖第一主表面和辅助件的半透明玻璃层 接线图案。 露出辅助布线图案的通孔形成在形成在辅助布线图案上的半透明玻璃层的一部分中，网格状图案的每个网格的每一侧以均匀的间隔。 基板可以用在具有长寿命和高可靠性的电子器件中，其中通过在其中嵌入布线来抑制布线的剥离或劣化，同时保持表面的平滑度。

    Glass for covering electrode
    5.
    发明申请
    Glass for covering electrode 审中-公开
    玻璃覆盖电极

    公开(公告)号：US20070032364A1

    公开(公告)日：2007-02-08

    申请号：US11581400

    申请日：2006-10-17

    申请人： Hitoshi Onoda ,  Yu Goshima ,  Yumiko Aoki

    发明人： Hitoshi Onoda ,  Yu Goshima ,  Yumiko Aoki

    IPC分类号： C03C8/24 ,  C03C3/064 ,  C03C3/066

    CPC分类号： C03C3/064 ,  C03C3/066 ,  H01J2211/38

    摘要： Provided is a nonlead glass for covering an electrode, which comprises, in mol%, B2O3 15-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O 1-15%, Li2O+Na2O+K2O 2-25% and others, and which comprises ZnO 0-15%. Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 25-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O+Na2O+K2O 2-25%, Al2O3 0-30, TiO 0-10% and ZnO 0-15%.

    摘要翻译： 提供了一种用于覆盖电极的非铅玻璃，其包含以摩尔％计的B 2 O 3 15-65％，SiO 2/2 -38％，MgO 2-30％，MgO + CaO + SrO + BaO 5-45％，Li 2 O 1-15％，Li 2 O + Na 其中O 2〜5％为0〜25％，其中ZnO为0〜15％。 提供一种用于覆盖电极的非铅玻璃，其包含以摩尔％计的B 2 O 3 25-65％的SiO 2/2 -38％，MgO 2-30％，MgO + CaO + SrO + BaO 5-45％，Li 2 O + Na 2 O + K 2 < O 2-25％，Al 2 O 3 0-30，TiO 0-10％和ZnO 0-15％。

    GLASS FOR COVERING ELECTRODE
    8.
    发明申请
    GLASS FOR COVERING ELECTRODE 失效
    覆盖电极玻璃

    公开(公告)号：US20080081198A1

    公开(公告)日：2008-04-03

    申请号：US11943667

    申请日：2007-11-21

    申请人： Hitoshi Onoda ,  Yu Goshima ,  Yumiko Aoki

    发明人： Hitoshi Onoda ,  Yu Goshima ,  Yumiko Aoki

    IPC分类号： B32B17/00

    CPC分类号： C03C3/064 ,  C03C3/066 ,  H01J2211/38

    摘要： Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 15-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O 1-15%, Li2O+Na2O+K2O 2-25% and others, and which comprises ZnO 0-15%. Provided is a nonlead glass for covering an electrode, which comprises, in mol %, B2O3 25-65%, SiO2 2-38%, MgO 2-30%, MgO+CaO+SrO+BaO 5-45%, Li2O+Na2O+K2O 2-25%, Al2O3 0-30, TiO 0-10% and ZnO 0-15%.

    摘要翻译： 提供了一种用于覆盖电极的非铅玻璃，其包含以摩尔％计的B 2 O 3 15-65％，SiO 2/2 -38％，MgO 2-30％，MgO + CaO + SrO + BaO 5-45％，Li 2 O 1-15％，Li 2 O + Na 其中O 2〜5％为0〜25％，其中ZnO为0〜15％。 提供一种用于覆盖电极的非铅玻璃，其包含以摩尔％计的B 2 O 3 25-65％的SiO 2/2 -38％，MgO 2-30％，MgO + CaO + SrO + BaO 5-45％，Li 2 O + Na 2 O + K 2 < O 2-25％，Al 2 O 3 0-30，TiO 0-10％和ZnO 0-15％。