Glass substrate having circuit pattern and process for producing the same
    1.
    发明授权
    Glass substrate having circuit pattern and process for producing the same 有权
    具有电路图案的玻璃基板及其制造方法

    公开(公告)号:US07846641B2

    公开(公告)日:2010-12-07

    申请号:US12143446

    申请日:2008-06-20

    IPC分类号: G03F7/26

    摘要: A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of from 450 to 630° C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.

    摘要翻译: 公开了一种具有电路图案的玻璃基板的制造方法。 该方法包括在玻璃基板上形成薄膜层,然后用激光照射薄膜层,以在玻璃基板上形成电路图案; 在其上形成有电路图案的玻璃基板上沉积软化点为450〜630℃的低熔点玻璃; 并烧结低熔点玻璃以形成低熔点玻璃层,该低熔点玻璃层包括在其上形成有电路图案的玻璃基板上烧结的低熔点玻璃,并且在玻璃基板和低熔点玻璃之间形成相容层, 熔点玻璃层。

    Method for manufacturing circuit pattern-provided substrate
    3.
    发明授权
    Method for manufacturing circuit pattern-provided substrate 有权
    制造电路图形衬底的方法

    公开(公告)号:US08418359B2

    公开(公告)日:2013-04-16

    申请号:US12364314

    申请日:2009-02-02

    IPC分类号: H05K3/02 H05K3/10

    摘要: A method for manufacturing a circuit pattern-provided substrate including forming a resist layer on a substrate, forming an opening corresponding to a circuit pattern and having an eaves cross-sectional shape in the resist layer, forming a thin film layer having a portion formed on the substrate in the opening and a portion formed on the resist layer, and removing the resist layer such that the resist layer and the portion of the thin film layer formed on the resist layer are removed from the substrate. The forming of the opening comprises exposing the resist layer with a mask device which changes an exposure amount of the resist layer such that the eaves cross-sectional shape has a space at a boundary between the resist layer and the substrate.

    摘要翻译: 一种制造电路图形衬底的方法,包括在衬底上形成抗蚀剂层,形成与电路图形相对应的开口,并且在抗蚀剂层中具有檐形横截面形状,形成薄膜层,该薄膜层形成在 开口中的基板和形成在抗蚀剂层上的部分,并且去除抗蚀剂层,使得抗蚀剂层和形成在抗蚀剂层上的薄膜层的部分从基板上去除。 开口的形成包括用改变抗蚀剂层的曝光量的掩模装置曝光抗蚀剂层,使得檐横截面形状在抗蚀剂层和基底之间的边界处具有空间。

    ELECTRONIC CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
    5.
    发明申请
    ELECTRONIC CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    电子电路装置及其制造方法

    公开(公告)号:US20090205851A1

    公开(公告)日:2009-08-20

    申请号:US12364314

    申请日:2009-02-02

    IPC分类号: H05K1/00 G03F7/00

    摘要: The present invention is to provide a method for manufacturing a circuit pattern-provided transparent substrate having a circuit pattern which is free from pattern peeling and remaining of resist and has good pattern precision and which does not cause disconnection when used as an electrode of an electron circuit or the like. The invention relates to a method for manufacturing a circuit pattern-provided substrate, in which a desired circuit pattern comprising a thin film layer is formed on a substrate, which method includes: a step of forming a resist layer on the substrate; a step of forming an opening of a shape corresponding to a desired circuit pattern in the resist layer; a step of forming a thin film layer; and a step of peeling off the resist layer and the thin film layer formed on the resist layer, wherein the cross-sectional shape in the opening of the resist layer has a cross-sectional shape of eaves type having a space at a boundary part between the resist layer and the substrate, the height and the width of the space are determined such that when the thin film layer is formed in the thin film layer forming step, an end of the thin film layer formed on the substrate in the opening does not go up onto a foot of the resist layer.

    摘要翻译: 本发明提供一种制造具有电路图案的透明基板的方法,该透明基板具有无图案剥离和残留抗蚀剂的电路图案,并且具有良好的图案精度,并且当用作电子的电极时不会断开 电路等。 本发明涉及一种用于制造电路图形提供的基板的方法,其中在基板上形成包括薄膜层的期望的电路图案,该方法包括:在基板上形成抗蚀剂层的步骤; 在抗蚀剂层中形成与期望的电路图形相对应的形状的开口的步骤; 形成薄膜层的步骤; 以及剥离形成在抗蚀剂层上的抗蚀剂层和薄膜层的步骤,其中抗蚀剂层的开口中的横截面形状具有檐形的横截面形状,在其间的边界部分具有空间 确定抗蚀剂层和基板,空间的高度和宽度,使得当在薄膜层形成步骤中形成薄膜层时,开口中形成在基板上的薄膜层的端部不 爬到抗蚀剂层的脚下。

    Method for forming electrodes and/or black stripes for plasma display substrate
    6.
    发明授权
    Method for forming electrodes and/or black stripes for plasma display substrate 有权
    用于形成用于等离子体显示基板的电极和/或黑色条纹的方法

    公开(公告)号:US07772778B2

    公开(公告)日:2010-08-10

    申请号:US11691689

    申请日:2007-03-27

    IPC分类号: H01J17/49

    摘要: To provide a method for forming electrodes and/or black stripes for a plasma display substrate, wherein display electrodes, bus electrodes and optionally black stripes for a plasma display panel are formed of the same material by the same dry step, whereby a clear image having reflection prevented, can be displayed on a PDP display device with a low load on the environment, at low costs, with low resistance, without erosion by a dielectric.A method for forming electrodes and/or black stripes for a plasma display substrate, which comprises applying a laser beam to a mask layer formed on a transparent substrate to form openings at areas corresponding to the respective patterns of display electrodes, bus electrodes and optionally black stripes, then continuously forming an antireflection layer to provide an antireflection effect over the entire surface and an electrode layer, and applying again a laser beam to peel off the mask layer and at the same time to remove an unnecessary thin film layer.

    摘要翻译: 为了提供用于等离子体显示基板形成电极和/或黑色条纹的方法,其中显示电极,总线电极和用于等离子体显示面板的任选的黑色条纹由相同的干燥步骤由相同的材料形成,由此具有 防止反射,可以低成本地以低电阻显示在环境中的低负载的PDP显示装置上,而不会被电介质侵蚀。 一种用于形成等离子体显示基板的电极和/或黑色条纹的方法,包括将激光束施加到形成在透明基板上的掩模层,以在对应于显示电极,总线电极和任选黑色的各个图案的区域处形成开口 然后连续地形成抗反射层以在整个表面和电极层上提供抗反射效果,并再次施加激光束以剥离掩模层,同时去除不需要的薄膜层。

    METHOD FOR FORMING ELECTRODES AND/OR BLACK STRIPES FOR PLASMA DISPLAY SUBSTRATE
    7.
    发明申请
    METHOD FOR FORMING ELECTRODES AND/OR BLACK STRIPES FOR PLASMA DISPLAY SUBSTRATE 有权
    用于形成等离子显示基板的电极和/或黑条的方法

    公开(公告)号:US20070190886A1

    公开(公告)日:2007-08-16

    申请号:US11691689

    申请日:2007-03-27

    IPC分类号: H01J9/24 H01J9/00

    摘要: To provide a method for forming electrodes and/or black stripes for a plasma display substrate, wherein display electrodes, bus electrodes and optionally black stripes for a plasma display panel are formed of the same material by the same dry step, whereby a clear image having reflection prevented, can be displayed on a PDP display device with a low load on the environment, at low costs, with low resistance, without erosion by a dielectric. A method for forming electrodes and/or black stripes for a plasma display substrate, which comprises applying a laser beam to a mask layer formed on a transparent substrate to form openings at areas corresponding to the respective patterns of display electrodes, bus electrodes and optionally black stripes, then continuously forming an antireflection layer to provide an antireflection effect over the entire surface and an electrode layer, and applying again a laser beam to peel off the mask layer and at the same time to remove an unnecessary thin film layer.

    摘要翻译: 为了提供用于等离子体显示基板形成电极和/或黑色条纹的方法,其中显示电极,总线电极和用于等离子体显示面板的任选的黑色条纹由相同的干燥步骤由相同的材料形成,由此具有 防止反射,可以低成本地以低电阻显示在环境中的低负载的PDP显示装置上,而不会被电介质侵蚀。 一种用于形成等离子体显示基板的电极和/或黑色条纹的方法,包括将激光束施加到形成在透明基板上的掩模层,以在对应于显示电极,总线电极和任选黑色的各个图案的区域处形成开口 然后连续地形成抗反射层以在整个表面和电极层上提供抗反射效果,并再次施加激光束以剥离掩模层,同时去除不需要的薄膜层。

    Transparent conductive film and method of making the film
    10.
    发明授权
    Transparent conductive film and method of making the film 失效
    透明导电膜及其制作方法

    公开(公告)号:US06329044B1

    公开(公告)日:2001-12-11

    申请号:US09344803

    申请日:1999-06-25

    IPC分类号: B32B900

    摘要: Transparent conductive films are provided which provide high sheet resistance, high transparency, high heat resistance and high moisture resistance, wherein the transparent conductive films contain either (a) an oxide film made of a mixed oxide of indium and tin and doped with at least 0.01 and less than 0.6 weight % of nitrogen and a geometrical thickness of from 5 to 25 nm or (b) an oxide film made of a mixed oxide of indium and tin, wherein the oxide film contains tin within a range of from 4.2 to 8.3 atomic % based on indium and a geometrical thickness of from 5 to 20 nm, and where in each case (a) and (b) the oxide film has a light transmittance of more than 90% at a wavelength of 550 nm, transparent conductive film-coated substrates prepared therefrom and touch panels prepared from the transparent conductive film-coated substrates.

    摘要翻译: 提供透明导电膜,其提供高的薄层电阻,高透明度,高耐热性和高耐湿性,其中透明导电膜包含(a)由铟和锡的混合氧化物制成的氧化物膜,并掺杂至少0.01 和小于0.6重量%的氮,几何厚度为5至25nm,或(b)由铟和锡的混合氧化物制成的氧化物膜,其中所述氧化物膜含有锡在4.2至8.3原子的范围内 基于铟的几何厚度为5〜20nm的几何厚度,并且在(a)和(b)的每种情况下,氧化物膜在波长550nm下的透光率大于90%,透明导电膜 - 由其制备的涂覆基材和由透明导电膜涂覆的基材制备的触摸面板。