摘要:
A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of from 450 to 630° C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.
摘要:
An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×1019/cm3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.
摘要:
A method for manufacturing a circuit pattern-provided substrate including forming a resist layer on a substrate, forming an opening corresponding to a circuit pattern and having an eaves cross-sectional shape in the resist layer, forming a thin film layer having a portion formed on the substrate in the opening and a portion formed on the resist layer, and removing the resist layer such that the resist layer and the portion of the thin film layer formed on the resist layer are removed from the substrate. The forming of the opening comprises exposing the resist layer with a mask device which changes an exposure amount of the resist layer such that the eaves cross-sectional shape has a space at a boundary between the resist layer and the substrate.
摘要:
The present invention is to provide a method for manufacturing a circuit pattern-provided transparent substrate having a circuit pattern which is free from pattern peeling and remaining of resist and has good pattern precision and which does not cause disconnection when used as an electrode of an electron circuit or the like. The invention relates to a method for manufacturing a circuit pattern-provided substrate, in which a desired circuit pattern comprising a thin film layer is formed on a substrate, which method includes: a step of forming a resist layer on the substrate; a step of forming an opening of a shape corresponding to a desired circuit pattern in the resist layer; a step of forming a thin film layer; and a step of peeling off the resist layer and the thin film layer formed on the resist layer, wherein the cross-sectional shape in the opening of the resist layer has a cross-sectional shape of eaves type having a space at a boundary part between the resist layer and the substrate, the height and the width of the space are determined such that when the thin film layer is formed in the thin film layer forming step, an end of the thin film layer formed on the substrate in the opening does not go up onto a foot of the resist layer.
摘要:
An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×1019/cm3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.
摘要翻译:本发明的目的是提供一种制造具有氧化锡薄膜的透明基板的方法,该方法即使通过用能量低的激光照射也能令人满意地进行图案化,因为其中发生烧蚀现象。 本发明涉及一种用于制造承载电路图案的透明基板的方法,该方法包括:照射带有透明基板的薄膜附着透明基板,该透明基板上具有载流子浓度为5×10 19 / > / cm 3以上,具有波长为1064nm的激光,以在透明基板上形成电路图案。
摘要:
A process for producing inorganic spheres, which comprises injecting an aqueous liquid containing an inorganic compound through an inlet hole into an organic liquid which flows at a flow rate of from 0.001 to 2 m/s in a laminar flow state in a flow path to form a W/O type emulsion, and solidifying the aqueous liquid containing an inorganic compound in the W/O type emulsion.
摘要翻译:一种无机球体的制造方法,其特征在于,将含有无机化合物的含水液体通过入口孔注入到以流路为流量的0.001〜2m / s的有机液体中,形成流路 W / O型乳液,并且在W / O型乳液中固化含有无机化合物的含水液体。
摘要:
The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface of the reinforcing sheet facing the substrate side or a surface of the substrate facing the reinforcing sheet side, and in which the one main surface of the laminate is supported by the supporting unit, and at the same time, the position of each of the plurality of rods is controlled by the control device so that the other main surface of the laminate is subjected to bending deformation in sequence from one-end side thereof.
摘要:
An object of the present invention is to provide a modeling composition, which sets at room temperature by just the addition of a prescribed amount of water, is excellent in elasticity, has a high gel strength, is excellent in terms of safety, and with which a modeling material can be molded readily at low cost. The modeling composition of the present invention contains 100 weight parts of glucomannan, 1 to 100 weight parts or more preferably 2 to 75 weight parts of a basic curing agent, 9 to 500 weight parts or more preferably 50 to 250 weight parts of a neutral solute, 0 to 30 weight parts or more preferably 1 to 20 weight parts of a tempering agent, and 0 to 300 weight parts or more preferably 1 to 150 weight parts of a modifier.
摘要:
An electrophotography printer includes a drum formed of a non-magnetic cylindrical body having an outer circumferential surface to which a photosensitive material is applied, end brackets attached to opposite ends of the drum, and a drum shaft for transmitting a driving torque to the drum. A connection structure between the drum and the drum shaft includes end bracket shafts provided on the end brackets, a hole formed in the drum shaft so as to be capable of engaging with one of the end bracket shafts, parallel pins provided on the end bracket shafts so as to be perpendicular to the axes thereof, and at least one taper groove formed in an end portion of the drum shaft. When the drum is housed, one of the parallel pins and the taper groove engage with each other while the whole of the drum is pressed toward the drum shaft by an elastic member, thereby reducing the non-uniformity of the rotation of the drum.
摘要:
Disclosed is a glass laminate comprising a thin glass substrate having a first main surface and a second main surface, a supporting glass substrate having a first main surface and a second main surface, and a resin layer and an outer frame layer arranged between the thin glass substrate and the supporting glass substrate. The resin layer is fixed to the first main surface of the supporting glass substrate and is in close contact with the first main surface of the thin glass substrate, while having easy releasability from the first main surface of the thin glass substrate. The outer frame layer surrounds the resin layer on the first main surface of the supporting glass substrate so that the outside air does not come into contact with the resin layer.