利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.019 秒)

    HEAT-DISSIPATING SILICONE GREASE COMPOSITION
    1.
    发明申请
    HEAT-DISSIPATING SILICONE GREASE COMPOSITION 审中-公开
    热消散硅油组合物

    公开(公告)号：US20100130673A1

    公开(公告)日：2010-05-27

    申请号：US12624558

    申请日：2009-11-24

    申请人： Kazutoshi ITO ,  Hiroaki Kizaki ,  Kunihiro Yamada ,  Osamu Uchida

    发明人： Kazutoshi ITO ,  Hiroaki Kizaki ,  Kunihiro Yamada ,  Osamu Uchida

    IPC分类号： C08L83/04

    CPC分类号： C10M169/02 ,  C10M2201/056 ,  C10M2201/0626 ,  C10M2229/0415 ,  C10M2229/0445 ,  C10M2229/0465 ,  C10N2220/022 ,  C10N2220/082 ,  C10N2230/08 ,  C10N2230/68 ,  C10N2250/10 ,  C10N2270/00

    摘要： An invention of a heat-dissipating grease composition characterized by comprising of the following components (A)-(C) is disclosed. Component (A): 100 mass parts of organopolysiloxane wherein a thixotropicity degree α is 1.03-1.50, a viscosity is 100-1,000,000 mPa·s at 25° C.; in this regard, the thixotropicity degree α is η1/η2. Herein, η1 is a measured viscosity at 25° C. measured by a B type rotation viscometer at 6 rpm of a rotor, η2 is a measured viscosity at 25° C. measured by a B type rotation viscometer at 12 rpm of the rotor. Component (B): 5-200 mass parts of hydrolysable organopolysiloxane having three functional groups at one end represented by the following general formula (1); R1 in the formula is an alkyl group having 1-6 carbon atoms, R2 is at least one kind of groups having 1-18 carbon atoms selected from a group consisting of substituted or unsubstituted monovalent hydrocarbon groups, a is an integer of 5-120. Component (C): 200-4,000 mass parts of a thermoconductive inorganic filler having an average particle diameter of 0.1-100 μm and 0.01-50 m2/g of a specific surface.

    摘要翻译： 公开了一种散热油脂组合物的发明，其特征在于包括以下组分（A） - （C）。 成分（A）：100质量份的触变性α为1.03〜1.50的有机聚硅氧烷，25℃的粘度为100〜100,000mPa·s。 在这方面，触变性α为＆eegr; 1 /＆eegr; 2。 本文中，1是通过B型旋转粘度计以6rpm的转子测量的25℃下的测量粘度，e是25℃时的测量粘度，通过B型旋转粘度计以12rpm测量 的转子。 组分（B）：5-200质量份由下列通式（1）表示的一端具有三个官能团的可水解有机聚硅氧烷; 式中的R1是具有1-6个碳原子的烷基，R2是至少一种选自取代或未取代的一价烃基的具有1-18个碳原子的基团，a是5-120的整数 。 成分（C）：200-4,000质量份的平均粒径为0.1-100μm，比表面积为0.01〜50m 2 / g的导热无机填料。

    Thermally conductive silicone grease composition
    2.
    发明授权
    Thermally conductive silicone grease composition 有权
    导热硅油组合物

    公开(公告)号：US08383005B2

    公开(公告)日：2013-02-26

    申请号：US13282797

    申请日：2011-10-27

    申请人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    发明人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    IPC分类号： C09K5/10 ,  C08G77/04 ,  C08G77/12 ,  C08G77/20

    CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08L83/04

    摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

    摘要翻译： 一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。 （C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。

    Heat conductive silicone grease composition and cured product thereof
    3.
    发明申请
    Heat conductive silicone grease composition and cured product thereof 审中-公开
    导热硅脂组合物及其固化产物

    公开(公告)号：US20070042533A1

    公开(公告)日：2007-02-22

    申请号：US11505435

    申请日：2006-08-17

    申请人： Akihiro Endo ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Kei Miyoshi

    发明人： Akihiro Endo ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Kei Miyoshi

    IPC分类号： H01L21/00 ,  C08L83/04 ,  B32B9/04

    CPC分类号： H01L23/3737 ,  C10M169/04 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/053 ,  C10M2201/061 ,  C10M2229/041 ,  C10M2229/0415 ,  C10M2229/044 ,  C10M2229/046 ,  C10N2210/01 ,  C10N2210/03 ,  C10N2210/07 ,  C10N2210/08 ,  C10N2220/082 ,  C10N2230/02 ,  H01L2224/32245 ,  Y10T428/31663

    摘要： Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 μm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

    摘要翻译： 本发明提供一种导热性硅氧烷润滑脂组合物，其包含（A）100质量份在每个分子内含有2个以上与硅原子键合的烯基的有机聚硅氧烷，（B）含有2个以上与各原子中的硅原子键合的氢原子的有机氢聚硅氧烷 分子，提供组分（A），（C）中每个链烯基组分（B）内与硅原子键合的0.1至5.0个氢原子，100至2200质量份的导热填料（ D）有效量的铂系催化剂和（E）有效量的加成反应缓凝剂，其中组分（C）包含大于90质量％且不大于100质量％的铟 平均粒径为0.1〜100μm的粉末。 还提供了通过在等于或大于铟粉末的熔点的温度下加热固化上述组合物而获得的导热硅酮固化产物。 还提供了一种电子设备，包括电子部件，散热构件和导热构件，其包括设置在电子部件和散热构件之间的上述固化物。 还提供了固化上述组合物的方法。 进一步提供一种在电子部件和散热部件之间形成导热部件的方法。 上述导热硅脂组合物产生具有优异导热性的合适薄的固化产物，其防止诸如涂层组分之外的组分的污染等问题，以及如果长时间使用则油品从产品中泄漏。

    THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION
    9.
    发明申请
    THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION 有权
    导热硅脂润滑脂组合物

    公开(公告)号：US20120119137A1

    公开(公告)日：2012-05-17

    申请号：US13282797

    申请日：2011-10-27

    申请人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    发明人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    IPC分类号： C09K5/10

    CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08L83/04

    摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

    摘要翻译： 一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。 （C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。