公开(公告)号：US20070042533A1

公开(公告)日：2007-02-22

申请号：US11505435

申请日：2006-08-17

申请人： Akihiro Endo ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Kei Miyoshi

发明人： Akihiro Endo ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Kei Miyoshi

IPC分类号： H01L21/00 ,  C08L83/04 ,  B32B9/04

CPC分类号： H01L23/3737 ,  C10M169/04 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/053 ,  C10M2201/061 ,  C10M2229/041 ,  C10M2229/0415 ,  C10M2229/044 ,  C10M2229/046 ,  C10N2210/01 ,  C10N2210/03 ,  C10N2210/07 ,  C10N2210/08 ,  C10N2220/082 ,  C10N2230/02 ,  H01L2224/32245 ,  Y10T428/31663

摘要： Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 μm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

摘要翻译： 本发明提供一种导热性硅氧烷润滑脂组合物，其包含（A）100质量份在每个分子内含有2个以上与硅原子键合的烯基的有机聚硅氧烷，（B）含有2个以上与各原子中的硅原子键合的氢原子的有机氢聚硅氧烷 分子，提供组分（A），（C）中每个链烯基组分（B）内与硅原子键合的0.1至5.0个氢原子，100至2200质量份的导热填料（ D）有效量的铂系催化剂和（E）有效量的加成反应缓凝剂，其中组分（C）包含大于90质量％且不大于100质量％的铟 平均粒径为0.1〜100μm的粉末。 还提供了通过在等于或大于铟粉末的熔点的温度下加热固化上述组合物而获得的导热硅酮固化产物。 还提供了一种电子设备，包括电子部件，散热构件和导热构件，其包括设置在电子部件和散热构件之间的上述固化物。 还提供了固化上述组合物的方法。 进一步提供一种在电子部件和散热部件之间形成导热部件的方法。 上述导热硅脂组合物产生具有优异导热性的合适薄的固化产物，其防止诸如涂层组分之外的组分的污染等问题，以及如果长时间使用则油品从产品中泄漏。

公开(公告)号：US08017684B2

公开(公告)日：2011-09-13

申请号：US11616185

申请日：2006-12-26

申请人： Akihiro Endo ,  Kei Miyoshi ,  Kunihiro Yamada ,  Hiroaki Kizaki

发明人： Akihiro Endo ,  Kei Miyoshi ,  Kunihiro Yamada ,  Hiroaki Kizaki

IPC分类号： A23J7/00 ,  C10L1/16

CPC分类号： C10M169/02 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/013 ,  C08K5/5419 ,  C08L83/04 ,  C10M111/04 ,  C10M2201/0416 ,  C10M2201/0606 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2201/1013 ,  C10M2203/0213 ,  C10M2203/102 ,  C10M2227/04 ,  C10M2227/045 ,  C10M2229/0415 ,  C10M2229/0425 ,  C10M2229/0435 ,  C10M2229/0445 ,  C10M2229/0455 ,  C10M2229/0465 ,  C10M2229/0485 ,  C10N2210/01 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2210/04 ,  C10N2210/08 ,  C10N2220/022 ,  C10N2220/082 ,  C10N2230/08 ,  C10N2240/20 ,  C10N2240/201 ,  C10N2240/202 ,  C10N2250/10 ,  H01L23/3737 ,  H01L2924/0002 ,  C08L2666/44 ,  C08L2666/54 ,  H01L2924/00

摘要： Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

摘要翻译： 本发明提供一种导热硅脂组合物，其包括：（A）100体积％的具有特定结构且25℃下的运动粘度为10〜10,000mm 2 / s的有机聚硅氧烷，（B）为0.1〜50份 体积的具有特定结构的烷氧基硅烷，（C）100-2,500体积份的导热填料。 该组合物显示出高导热性，保持了优异的流动性，这意味着组合物表现出良好的加工性，并且能够填充细小的凹痕，从而降低接触电阻并提供优异的散热性能。 此外，在高温高湿条件下的组合物的耐久性得到改善，从而提高了实际使用中组合物的可靠性。 由发热体产生的热量可以通过将组合物夹在发热体和散热体之间而散发到散热体中。

公开(公告)号：US20070149834A1

公开(公告)日：2007-06-28

申请号：US11616185

申请日：2006-12-26

申请人： Akihiro Endo ,  Kei Miyoshi ,  Kunihiro Yamada ,  Hiroaki Kizaki

发明人： Akihiro Endo ,  Kei Miyoshi ,  Kunihiro Yamada ,  Hiroaki Kizaki

IPC分类号： A23J7/00 ,  C10L1/16

CPC分类号： C10M169/02 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/013 ,  C08K5/5419 ,  C08L83/04 ,  C10M111/04 ,  C10M2201/0416 ,  C10M2201/0606 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2201/1013 ,  C10M2203/0213 ,  C10M2203/102 ,  C10M2227/04 ,  C10M2227/045 ,  C10M2229/0415 ,  C10M2229/0425 ,  C10M2229/0435 ,  C10M2229/0445 ,  C10M2229/0455 ,  C10M2229/0465 ,  C10M2229/0485 ,  C10N2210/01 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2210/04 ,  C10N2210/08 ,  C10N2220/022 ,  C10N2220/082 ,  C10N2230/08 ,  C10N2240/20 ,  C10N2240/201 ,  C10N2240/202 ,  C10N2250/10 ,  H01L23/3737 ,  H01L2924/0002 ,  C08L2666/44 ,  C08L2666/54 ,  H01L2924/00

摘要： Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

摘要翻译： 提供一种导热硅脂组合物，其包括：（A）100体积％的具有特定结构并且在25℃下的运动粘度为10至10,000mm 2的有机聚硅氧烷 ，（B）0.1〜50体积份的具有特定结构的烷氧基硅烷，（C）100〜2,500体积份的导热性填料。 该组合物显示出高导热性，保持了优异的流动性，这意味着组合物表现出良好的加工性，并且能够填充细小的凹痕，从而降低接触电阻并提供优异的散热性能。 此外，在高温高湿条件下的组合物的耐久性得到改善，从而提高了实际使用中组合物的可靠性。 由发热体产生的热量可以通过将组合物夹在发热体和散热体之间而散发到散热体中。

公开(公告)号：US20080260957A1

公开(公告)日：2008-10-23

申请号：US11977577

申请日：2007-10-25

申请人： Kunihiro Yamada ,  Akihiro Endo ,  Kei Miyoshi

发明人： Kunihiro Yamada ,  Akihiro Endo ,  Kei Miyoshi

IPC分类号： B05D3/00 ,  C09D4/00

CPC分类号： C09D4/00 ,  B05D7/16 ,  B05D7/52 ,  C08F230/08

摘要： A method for adhering a thermally-conductive silicone composition to a coated surface in which a primer containing a platinum type compound and a solvent but not containing an alkoxy silane is applied and dried on the surface of a metal or an alloy containing at least one metal selected from a group of gold, silver and platinum group, and the thermally-conductive silicone composition is subsequently adhered to the coated surface.

摘要翻译： 将导热性有机硅组合物粘合到涂布表面上的方法，其中在含有铂类化合物和溶剂但不含烷氧基硅烷的底漆的底漆上涂布并干燥含有至少一种金属的金属或合金 选自一组金，银和铂基，并且导热硅氧烷组合物随后粘附到涂布表面。

公开(公告)号：US20080213578A1

公开(公告)日：2008-09-04

申请号：US11776124

申请日：2007-07-11

申请人： Akihiro Endo ,  Kei Miyoshi ,  Kunihiro Yamada

发明人： Akihiro Endo ,  Kei Miyoshi ,  Kunihiro Yamada

IPC分类号： B32B27/04 ,  C08K3/08 ,  C08K3/28 ,  C08K3/22 ,  B05D3/02

CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K5/5419 ,  C08K5/56 ,  C08K2201/001 ,  C08L83/00 ,  C08L83/04 ,  C10M169/044 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/061 ,  C10M2201/062 ,  C10M2227/04 ,  C10M2229/04 ,  C10M2229/0405 ,  C10M2229/043 ,  C10M2229/044 ,  C10N2210/07 ,  C10N2220/022 ,  C10N2230/02 ,  C10N2230/08 ,  C10N2240/20 ,  C10N2240/202 ,  C10N2250/10 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  Y10T428/263 ,  Y10T428/31663

摘要： Provided is a heat conductive silicone grease composition, including: an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, an alkoxysilane containing specific substituent groups, an organohydrogenpolysiloxane containing 2 or more SiH groups within each molecule, a heat conductive filler, a platinum-based catalyst, and an addition reaction retarder. The heat conductive silicone grease composition exhibits high thermal conductivity, has excellent fluidity prior to curing and therefore exhibits favorable workability, is capable of filling fine indentations and therefore reduces contact resistance, and is also able to prevent oil separation and bleeding of the heat conductive material following curing, meaning the composition exhibits excellent heat radiation performance and reliability. Also, the heat conductive silicone grease composition exhibits improved durability under conditions of high temperature and high humidity, and thereby exhibits further improved reliability during actual use.

摘要翻译： 本发明提供一种导热硅脂组合物，其包含：含有2个以上与各原子中的硅原子键合的烯基的有机聚硅氧烷，具有特定结构的有机聚硅氧烷，25℃下的运动粘度为10〜10,000mm

公开(公告)号：US20080057325A1

公开(公告)日：2008-03-06

申请号：US11846862

申请日：2007-08-29

申请人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

发明人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

IPC分类号： C08G77/12

CPC分类号： C09J183/04 ,  C08G77/045 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K5/56 ,  C08L83/00 ,  Y10T428/31663

摘要： Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.

摘要翻译： 提供一种导热性有机硅组合物，其包含：（A）100体积份的具有特定结构的有机聚硅氧烷，（B）0.1〜50体积份作为润湿剂的有机硅化合物，并且含有三有机氧基甲硅烷基键合 通过可以被支链的亚烷基连接到一个末端，（C）100-2,500体积份的导热填料，和（D）有效量的固化剂。 还提供了通过固化该组合物获得的导热硅氧烷固化产物。 即使填充有大量导热填料以提供优异的导热性，导热硅氧烷组合物的粘度或塑性的增加也最小，并保持良好的操作性和成型性。 即使填充有大量的导热性填料，导热性硅酮固化物也具有优异的柔软性。 由发热电子部件产生的热可以通过将固化物夹在发热电子部件和散热部件之间而散发到散热部件中。

公开(公告)号：US20070293624A1

公开(公告)日：2007-12-20

申请号：US11763732

申请日：2007-06-15

申请人： Nobuaki MATSUMOTO ,  Kei Miyoshi ,  Kunihiro Yamada

发明人： Nobuaki MATSUMOTO ,  Kei Miyoshi ,  Kunihiro Yamada

IPC分类号： C08L83/04

CPC分类号： H01L23/3737 ,  C08K5/5419 ,  C08L83/04 ,  H01L2924/0002 ,  C08L83/00 ,  H01L2924/00

摘要： Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane of a specific structure with a kinematic viscosity at 25° C. within a range from 10 to 100,000 mm2/s, (B) 0.1 to 50 parts by volume of an organopolysiloxane that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, displays excellent initial fluidity and is capable of retaining that fluidity over an extended period, and exhibits excellent heat radiation performance. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

摘要翻译： 提供一种导热硅脂组合物，其包括：（A）100体积％的特定结构的有机聚硅氧烷，其在25℃下的运动粘度在10至100,000mm 2范围内 /（s），（B）0.1〜50份体积的作为润湿剂的有机聚硅氧烷，并且通过可以被支链的亚烷基含有与一个末端键合的三有机氧代甲硅烷基，（C）100〜2500质量份 导热填料。 该组合物显示出高导热性，显示出优异的初始流动性，并且能够在长时间内保持该流动性，并表现出优异的散热性能。 由发热体产生的热量可以通过将组合物夹在发热体和散热体之间而散发到散热体中。

公开(公告)号：US20070290202A1

公开(公告)日：2007-12-20

申请号：US11763782

申请日：2007-06-15

申请人： Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada ,  Toshiyuki Ozai

发明人： Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada ,  Toshiyuki Ozai

IPC分类号： H01L29/08

CPC分类号： C07F7/1804

摘要： Provided is a novel organosilicon compound which functions as a silane coupling agent (wetter) that enables a silicone to be filled with a large quantity of a filler.The organosilicon compound is represented by a general formula (1) wherein, R1 represents a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, R2 to R4 represent identical or different unsubstituted or substituted monovalent hydrocarbon groups, each R5 represents, independently, a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, each R6 represents, independently, an identical or different unsubstituted or substituted monovalent organic group, m represents an integer from 0 to 4, and n represents an integer from 2 to 20; as well as a method of producing the above organosilicon compound, wherein a one end organohydrogensilyl-terminated organopolysiloxane is produced by reacting an organohydrogensiloxane with a vinylsilane or an alkenyltriorganooxysilane in the presence of a hydrosilylation catalyst, and optionally this one end organohydrogensilyl-terminated organopolysiloxane is then reacted with an alkene in the presence of a hydrosilylation catalyst.

摘要翻译： 提供了一种新型的有机硅化合物，其作为使硅氧烷填充有大量填料的硅烷偶联剂（润湿剂）起作用。 有机硅化合物由通式（1）表示，其中R 1表示氢原子，或未取代或取代的一价烃基，R 2至R 0 表示相同或不同的未取代或取代的单价烃基，每个R 5独立地表示氢原子或未取代或取代的一价烃基，每个R 6 独立地表示相同或不同的未取代或取代的一价有机基团，m表示0至4的整数，n表示2至20的整数; 以及制备上述有机硅化合物的方法，其中通过在氢化硅烷化催化剂存在下使有机氢硅氧烷与乙烯基硅烷或烯基三有机氧基硅烷反应制备一端有机氢甲硅烷基封端的有机基聚硅氧烷，任选地，该一端有机氢甲硅烷基封端的有机聚硅氧烷是 然后在氢化硅烷化催化剂存在下与烯烃反应。

公开(公告)号：US08119758B2

公开(公告)日：2012-02-21

申请号：US11846862

申请日：2007-08-29

申请人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

发明人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

IPC分类号： C08G77/12 ,  C08L83/04 ,  C08K3/00 ,  C08K5/541 ,  C08K5/5419

CPC分类号： C09J183/04 ,  C08G77/045 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K5/56 ,  C08L83/00 ,  Y10T428/31663

摘要： Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.

摘要翻译： 提供一种导热性有机硅组合物，其包含：（A）100体积份的具有特定结构的有机聚硅氧烷，（B）0.1〜50体积份作为润湿剂的有机硅化合物，并且含有三有机氧基甲硅烷基键合 通过可以被支链的亚烷基连接到一个末端，（C）100-2,500体积份的导热填料，和（D）有效量的固化剂。 还提供了通过固化该组合物获得的导热硅氧烷固化产物。 即使填充有大量导热填料以提供优异的导热性，导热硅氧烷组合物的粘度或塑性的增加也最小，并保持良好的操作性和成型性。 即使填充有大量的导热性填料，导热性硅酮固化物也具有优异的柔软性。 由发热电子部件产生的热可以通过将固化物夹在发热电子部件和散热部件之间而散发到散热部件中。

公开(公告)号：US07786056B2

公开(公告)日：2010-08-31

申请号：US12059138

申请日：2008-03-31

申请人： Nobuaki Matsumoto ,  Kunihiro Yamada ,  Kei Miyoshi ,  Ikuo Sakurai ,  Kenichi Isobe

发明人： Nobuaki Matsumoto ,  Kunihiro Yamada ,  Kei Miyoshi ,  Ikuo Sakurai ,  Kenichi Isobe

IPC分类号： A61K9/00 ,  C10M173/02 ,  C10M169/04 ,  C10F7/02

CPC分类号： H01L23/3737 ,  C10M111/04 ,  C10M169/02 ,  C10M2201/0416 ,  C10M2201/0606 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2201/1013 ,  C10M2203/0213 ,  C10M2203/022 ,  C10M2227/04 ,  C10M2229/041 ,  C10M2229/0415 ,  C10M2229/046 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2220/022 ,  C10N2220/082 ,  C10N2230/08 ,  C10N2230/74 ,  C10N2240/20 ,  C10N2240/201 ,  C10N2240/202 ,  C10N2250/10 ,  H01L2924/0002 ,  C10N2220/028 ,  H01L2924/00

摘要： A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

摘要翻译： 包含3-30重量％的有机聚硅氧烷和60-96.9重量％的导热填料的硅润滑脂组合物用沸点为260-360℃的最不易挥发的异链烷烃进行稀释。尽管导热填料的重载 ，润滑脂组合物可以容易地应用于作为薄均匀涂层的散热器。 组合物在室温下的储存稳定性显着提高，易于处理，并提供良好的散热性。