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公开(公告)号：US07164208B2
公开(公告)日：2007-01-16
申请号：US11037262
申请日：2005-01-19
CPC分类号： H01L24/13 , H01L23/3114 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/14 , H01L2224/02122 , H01L2224/0401 , H01L2224/05017 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/06051 , H01L2224/06131 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06141 , H01L2224/06177 , H01L2224/06179 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13018 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14135 , H01L2224/14136 , H01L2224/1414 , H01L2224/14141 , H01L2224/14177 , H01L2224/14179 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/81805
摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.
摘要翻译： 提供了一种半导体装置，其中陆部和外部端子的结合强度增加，可靠地防止外部端子的断开，并且在延长的时间段内确保连接可靠性。 在半导体元件上形成绝缘树脂层，金属线彼此连接，金属线的端部与半导体元件上的电极连接，金属线的另一端部与外部端子连接 形成一个焊盘，除了焊盘的连接部分之外的半导体元件的整个表面被表面层树脂层覆盖，并且在至少一个焊盘的焊盘部分的顶表面上设置突起。 因此，在焊接之后，外部端子将突起的周边保持在陆部上，使得外部端子可以可靠地连接到陆部。 结果，可以获得确保其在较长时间段内的连接可靠性的半导体器件。
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公开(公告)号：US20050167832A1
公开(公告)日：2005-08-04
申请号：US11037262
申请日：2005-01-19
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/485 , H01L23/498 , H01L29/40
CPC分类号： H01L24/13 , H01L23/3114 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/14 , H01L2224/02122 , H01L2224/0401 , H01L2224/05017 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/06051 , H01L2224/06131 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06141 , H01L2224/06177 , H01L2224/06179 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13018 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14135 , H01L2224/14136 , H01L2224/1414 , H01L2224/14141 , H01L2224/14177 , H01L2224/14179 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/81805
摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.
摘要翻译： 提供了一种半导体装置，其中陆部和外部端子的结合强度增加，可靠地防止外部端子的断开，并且在延长的时间段内确保连接可靠性。 在半导体元件上形成绝缘树脂层，金属线彼此连接，金属线的端部与半导体元件上的电极连接，金属线的另一端部与外部端子连接 形成一个焊盘，除了焊盘的连接部分之外的半导体元件的整个表面被表面层树脂层覆盖，并且在至少一个焊盘的焊盘部分的顶表面上设置突起。 因此，在焊接之后，外部端子将突起的周边保持在陆部上，使得外部端子可以可靠地连接到陆部。 结果，可以获得确保其在较长时间段内的连接可靠性的半导体器件。
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公开(公告)号：US20070072405A1
公开(公告)日：2007-03-29
申请号：US11605397
申请日：2006-11-29
IPC分类号： H01L21/44
CPC分类号： H01L24/13 , H01L23/3114 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/14 , H01L2224/02122 , H01L2224/0401 , H01L2224/05017 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/06051 , H01L2224/06131 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06141 , H01L2224/06177 , H01L2224/06179 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13018 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14135 , H01L2224/14136 , H01L2224/1414 , H01L2224/14141 , H01L2224/14177 , H01L2224/14179 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/81805
摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.
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