公开(公告)号：US20070072405A1

公开(公告)日：2007-03-29

申请号：US11605397

申请日：2006-11-29

申请人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

发明人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/02122 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/06051 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/0614 ,  H01L2224/06141 ,  H01L2224/06177 ,  H01L2224/06179 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/1414 ,  H01L2224/14141 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805

摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.

公开(公告)号：US06784557B2

公开(公告)日：2004-08-31

申请号：US10307450

申请日：2002-12-02

申请人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

发明人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

IPC分类号： H01L2348

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

摘要： The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.

摘要翻译： 半导体器件包括在其表面上形成有电极的半导体元件和形成在半导体元件的表面上并与电极电连接的金属布线。 金属布线具有用作外部电极的外部电极部分。 外部电极部分的厚度大于金属布线的非电极部分的厚度，即除了外部电极部分之外的金属布线的一部分。

公开(公告)号：US07164208B2

公开(公告)日：2007-01-16

申请号：US11037262

申请日：2005-01-19

申请人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

发明人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/02122 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/06051 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/0614 ,  H01L2224/06141 ,  H01L2224/06177 ,  H01L2224/06179 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/1414 ,  H01L2224/14141 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805

摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.

摘要翻译： 提供了一种半导体装置，其中陆部和外部端子的结合强度增加，可靠地防止外部端子的断开，并且在延长的时间段内确保连接可靠性。 在半导体元件上形成绝缘树脂层，金属线彼此连接，金属线的端部与半导体元件上的电极连接，金属线的另一端部与外部端子连接 形成一个焊盘，除了焊盘的连接部分之外的半导体元件的整个表面被表面层树脂层覆盖，并且在至少一个焊盘的焊盘部分的顶表面上设置突起。 因此，在焊接之后，外部端子将突起的周边保持在陆部上，使得外部端子可以可靠地连接到陆部。 结果，可以获得确保其在较长时间段内的连接可靠性的半导体器件。

公开(公告)号：US06954001B2

公开(公告)日：2005-10-11

申请号：US10919402

申请日：2004-08-17

申请人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

发明人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/12 ,  H01L23/482 ,  H01L23/48

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

摘要： The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.

摘要翻译： 半导体器件包括在其表面上形成有电极的半导体元件和形成在半导体元件的表面上并与电极电连接的金属布线。 金属布线具有用作外部电极的外部电极部分。 外部电极部分的厚度大于金属布线的非电极部分的厚度，即除了外部电极部分之外的金属布线的一部分。

公开(公告)号：US20050167832A1

公开(公告)日：2005-08-04

申请号：US11037262

申请日：2005-01-19

申请人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

发明人： Kazuyuki Kainou ,  Masatoshi Yagoh ,  Kimihito Kuwabara ,  Katsumi Ohtani

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/02122 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/06051 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/0614 ,  H01L2224/06141 ,  H01L2224/06177 ,  H01L2224/06179 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/1414 ,  H01L2224/14141 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805

摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.

摘要翻译： 提供了一种半导体装置，其中陆部和外部端子的结合强度增加，可靠地防止外部端子的断开，并且在延长的时间段内确保连接可靠性。 在半导体元件上形成绝缘树脂层，金属线彼此连接，金属线的端部与半导体元件上的电极连接，金属线的另一端部与外部端子连接 形成一个焊盘，除了焊盘的连接部分之外的半导体元件的整个表面被表面层树脂层覆盖，并且在至少一个焊盘的焊盘部分的顶表面上设置突起。 因此，在焊接之后，外部端子将突起的周边保持在陆部上，使得外部端子可以可靠地连接到陆部。 结果，可以获得确保其在较长时间段内的连接可靠性的半导体器件。

公开(公告)号：US20050012214A1

公开(公告)日：2005-01-20

申请号：US10919402

申请日：2004-08-17

申请人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

发明人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/12 ,  H01L23/482 ,  H01L21/4763 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

摘要： The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.

摘要翻译： 半导体器件包括在其表面上形成有电极的半导体元件和形成在半导体元件的表面上并与电极电连接的金属布线。 金属布线具有用作外部电极的外部电极部分。 外部电极部分的厚度大于金属布线的非电极部分的厚度，即除了外部电极部分之外的金属布线的一部分。