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公开(公告)号：US07164208B2
公开(公告)日：2007-01-16
申请号：US11037262
申请日：2005-01-19
CPC分类号： H01L24/13 , H01L23/3114 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/14 , H01L2224/02122 , H01L2224/0401 , H01L2224/05017 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/06051 , H01L2224/06131 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06141 , H01L2224/06177 , H01L2224/06179 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13018 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14135 , H01L2224/14136 , H01L2224/1414 , H01L2224/14141 , H01L2224/14177 , H01L2224/14179 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/81805
摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.
摘要翻译： 提供了一种半导体装置，其中陆部和外部端子的结合强度增加，可靠地防止外部端子的断开，并且在延长的时间段内确保连接可靠性。 在半导体元件上形成绝缘树脂层，金属线彼此连接，金属线的端部与半导体元件上的电极连接，金属线的另一端部与外部端子连接 形成一个焊盘，除了焊盘的连接部分之外的半导体元件的整个表面被表面层树脂层覆盖，并且在至少一个焊盘的焊盘部分的顶表面上设置突起。 因此，在焊接之后，外部端子将突起的周边保持在陆部上，使得外部端子可以可靠地连接到陆部。 结果，可以获得确保其在较长时间段内的连接可靠性的半导体器件。
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公开(公告)号：US20050167832A1
公开(公告)日：2005-08-04
申请号：US11037262
申请日：2005-01-19
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/485 , H01L23/498 , H01L29/40
CPC分类号： H01L24/13 , H01L23/3114 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/14 , H01L2224/02122 , H01L2224/0401 , H01L2224/05017 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/06051 , H01L2224/06131 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06141 , H01L2224/06177 , H01L2224/06179 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13018 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14135 , H01L2224/14136 , H01L2224/1414 , H01L2224/14141 , H01L2224/14177 , H01L2224/14179 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/81805
摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.
摘要翻译： 提供了一种半导体装置，其中陆部和外部端子的结合强度增加，可靠地防止外部端子的断开，并且在延长的时间段内确保连接可靠性。 在半导体元件上形成绝缘树脂层，金属线彼此连接，金属线的端部与半导体元件上的电极连接，金属线的另一端部与外部端子连接 形成一个焊盘，除了焊盘的连接部分之外的半导体元件的整个表面被表面层树脂层覆盖，并且在至少一个焊盘的焊盘部分的顶表面上设置突起。 因此，在焊接之后，外部端子将突起的周边保持在陆部上，使得外部端子可以可靠地连接到陆部。 结果，可以获得确保其在较长时间段内的连接可靠性的半导体器件。
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公开(公告)号：US20070072405A1
公开(公告)日：2007-03-29
申请号：US11605397
申请日：2006-11-29
IPC分类号： H01L21/44
CPC分类号： H01L24/13 , H01L23/3114 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/14 , H01L2224/02122 , H01L2224/0401 , H01L2224/05017 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/06051 , H01L2224/06131 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06141 , H01L2224/06177 , H01L2224/06179 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13018 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14135 , H01L2224/14136 , H01L2224/1414 , H01L2224/14141 , H01L2224/14177 , H01L2224/14179 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , H01L2224/81805
摘要： There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer which insulates metal wires from one another is formed on a semiconductor element, an end portion of the metal wire is connected to an electrode on the semiconductor element, the other end portion of the metal wire is connected to an external terminal to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer, and a projection is provided on the top surface of a land portion of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.
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4.发明授权Method of fabricating a semiconductor device having a heat sink with an exposed surface 有权制造具有具有暴露表面的散热器的半导体器件的方法公开(公告)号：US07820486B2
公开(公告)日：2010-10-26
申请号：US12326462
申请日：2008-12-02
申请人： Katsumi Ohtani
发明人： Katsumi Ohtani
CPC分类号： H01L23/3677 , H01L21/56 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/00012 , H01L2224/81 , H01L2924/00 , H01L2224/05599
摘要： A method includes: mounting a plurality of semiconductor elements on a substrate having wirings; connecting electrically electrodes of the semiconductor elements and the wirings; sealing the semiconductor elements with a resin, which is carried out by bringing a thermal conductor having a concavity and the substrate to be in contact with each other so that the semiconductor elements are positioned within the concavity and by filling the concavity with the resin; and separating respective semiconductor elements 1. In the resin-sealing step, in a state where the thermal conductor is arranged with its concavity facing up and the concavity of the thermal conductor is filled with a liquid resin, the semiconductor elements are dipped in the liquid resin in the concavity and the liquid resin is solidified. Due to these steps, a semiconductor device can be manufactured without experiencing troubles such as short circuit of the metal thin wires or imperfect filling of resin during the manufacturing steps, and thus semiconductor devices with stable quality can be manufactured.
摘要翻译： 一种方法包括：将多个半导体元件安装在具有布线的基板上; 连接半导体元件的电极和布线; 用树脂密封半导体元件，该树脂通过使具有凹部的导热体和基板彼此接触来实现，使得半导体元件位于凹部内并且通过用树脂填充凹部; 并分离各个半导体元件1.在树脂密封工序中，在热导体的凹面朝上并且热导体的凹部被液态树脂填充的状态下，将半导体元件浸入液体 凹凸中的树脂和液体树脂固化。 由于这些步骤，可以制造半导体器件，而不会在制造步骤期间不会遇到金属细线短路或树脂不完全填充的问题，因此可以制造质量稳定的半导体器件。
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