利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.019 秒)

    Heat pipe and circuit board with a heat pipe function
    1.
    发明授权
    Heat pipe and circuit board with a heat pipe function 失效
    热管和电路板具有热管功能

    公开(公告)号：US08611089B2

    公开(公告)日：2013-12-17

    申请号：US12934996

    申请日：2009-03-09

    申请人： Kei Mizuta ,  Katsuya Tsuruta ,  Toshiaki Kotani ,  Kenji Ohsawa

    发明人： Kei Mizuta ,  Katsuya Tsuruta ,  Toshiaki Kotani ,  Kenji Ohsawa

    IPC分类号： H05K7/20

    CPC分类号： H05K1/0272 ,  F28D15/0233 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/064 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.

    摘要翻译： 公开了一种通过封闭的冷却介质的蒸发和冷凝来冷却放热体的热管。 热管包括平板状的上板，与上板相对的平板状下板，以及在上板和下板之间彼此重叠的多个平板状中间板，并具有内部 通孔。 形成在多个中间板的每一个中的内部通孔适于使得每个通孔的仅一部分彼此重叠以形成毛细管路径，每个通孔的横截面积小于横截面积 通孔在平面方向的面积。

    Heat Pipe And Electronic Device
    5.
    发明申请
    Heat Pipe And Electronic Device 审中-公开
    热管和电子设备

    公开(公告)号：US20110308772A1

    公开(公告)日：2011-12-22

    申请号：US13062561

    申请日：2009-09-08

    申请人： Katsuya Tsuruta ,  Rinkou Fukunaga ,  Toshiaki Kotani ,  Kei Mizuta

    发明人： Katsuya Tsuruta ,  Rinkou Fukunaga ,  Toshiaki Kotani ,  Kei Mizuta

    IPC分类号： F28D15/04

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (3), a lower plate (4) opposing the upper plate (3), one intermediate plate or a plurality of intermediate plates (5) laminated between the upper plate (3) and the lower plate (4), a main body portion (2) formed by lamination of the upper plate (3), the lower plate (4) and the intermediate plate (5) and capable of sealing a cooling medium, a vapor diffusion path (6) capable of diffusing a vaporized cooling medium, and a capillary flow path (7) capable of reflowing a condensed cooling medium, and the vapor diffusion path (6) is formed from a first end portion (15) of the main body portion toward a second end portion (16) opposing the first end portion (15).

    摘要翻译： 本发明提供一种热管和电子装置，其能够有效地冷却配置在端部的发光元件，从而能够将热管有效地安装在狭窄的空间内。 热管设有上板（3），与上板（3）相对的下板（4），一个中间板或多个中间板（5），层压在上板（3）和下板 板（4），通过层叠上板（3），下板（4）和中间板（5）而形成并能够密封冷却介质，蒸气扩散路径（6）的主体部分（2） ）和能够回流冷凝介质的毛细管流路（7），蒸气扩散路径（6）由主体部的第一端部（15）朝向 与第一端部（15）相对的第二端部（16）。

    Heat sink package and method of manufacturing
    6.
    发明授权
    Heat sink package and method of manufacturing 有权
    散热片包装及制造方法

    公开(公告)号：US08988882B2

    公开(公告)日：2015-03-24

    申请号：US13259563

    申请日：2010-03-24

    申请人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    发明人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    IPC分类号： H05K7/20 ,  H01L23/498 ,  H01L23/367 ,  H01L23/433 ,  H05K1/00 ,  H01L21/48

    CPC分类号： H01L23/49816 ,  H01L21/4867 ,  H01L23/367 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2924/15321 ,  Y10T29/4913

    摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

    摘要翻译： 电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。 通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。 通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。 在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部 后表面上的连接电极连接到布线图案。

    HEAT SINK PACKAGE AND METHOD OF MANUFACTURING
    7.
    发明申请
    HEAT SINK PACKAGE AND METHOD OF MANUFACTURING 审中-公开
    散热封装及其制造方法

    公开(公告)号：US20120127667A1

    公开(公告)日：2012-05-24

    申请号：US13259563

    申请日：2010-03-24

    申请人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    发明人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    IPC分类号： H05K7/20 ,  H05K3/32

    CPC分类号： H01L23/49816 ,  H01L21/4867 ,  H01L23/367 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2924/15321 ,  Y10T29/4913

    摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

    摘要翻译： 电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。 通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。 通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。 在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部 后表面上的连接电极连接到布线图案。