公开(公告)号：US5255116A

公开(公告)日：1993-10-19

申请号：US835341

申请日：1992-02-14

申请人： Keisuke Araki ,  Kazuo Fujibayashi ,  Miho Tanaka

发明人： Keisuke Araki ,  Kazuo Fujibayashi ,  Miho Tanaka

IPC分类号： G02B26/10 ,  G02B26/08

CPC分类号： G02B26/10

摘要： The present invention provides an original scanning apparatus comprising, an original support plate on which an original is rested, a fixed point light source having a width smaller than that of the original support plate, a shiftable reflection member for reflecting light beams emitted from the light source toward the original support plate, and a first deflector member for deflecting the light beams emitted from the light source in a slit widthwise direction and a second deflector member for deflecting the light beams in a slit longitudinal direction, the first and second deflector members being formed discretely.

摘要翻译： 本发明提供了一种原始扫描装置，包括原始支撑板，原件搁置在原始支撑板上，具有比原始支撑板的宽度小的固定点光源;可移动反射构件，用于反射从光发射的光束 源极朝向原始支撑板，以及第一偏转构件，用于使狭缝宽度方向上的光源发射的光束偏转，以及用于使光束沿狭缝纵向方向偏转的第二偏转器构件，第一和第二偏转构件为 离散地形成。

公开(公告)号：US5287147A

公开(公告)日：1994-02-15

申请号：US824782

申请日：1992-01-22

申请人： Motomu Fukasawa ,  Kazuo Fujibayashi ,  Keisuke Araki

发明人： Motomu Fukasawa ,  Kazuo Fujibayashi ,  Keisuke Araki

IPC分类号： G03B27/52 ,  G03B27/54 ,  G03G15/04

CPC分类号： G03B27/542 ,  G03B27/526 ,  G03G15/04 ,  G03G15/0435

摘要： An original scanning apparatus comprising original support means on which an original is rested, elongated light source means for illuminating the original rested on the original support means, reflection means for reflecting light from the elongated light source means toward the original support means. The elongated light source means is fixed and the reflection means being shiftable, so that the original rested on the original support means is scanned by shifting the reflection means. Apparatus further includes side reflector means disposed at a longitudinal end of the elongated light source means and extending along a shifting direction of the reflection means.

摘要翻译： 一种原始扫描装置，包括原件支撑装置，原件搁置在原件上，用于照亮搁置在原始支撑装置上的原件的细长光源装置，用于将来自细长光源装置的光反射到原始支撑装置的反射装置。 细长光源装置是固定的，并且反射装置是可移动的，使得搁置在原始支撑装置上的原件通过移动反射装置被扫描。 装置还包括设置在细长光源装置的纵向端并沿着反射装置的移动方向延伸的侧反射器装置。

公开(公告)号：US08945416B2

公开(公告)日：2015-02-03

申请号：US13389048

申请日：2011-07-19

申请人： Hideki Shimoi ,  Keisuke Araki

发明人： Hideki Shimoi ,  Keisuke Araki

IPC分类号： H01L21/02 ,  B23K26/38 ,  B23K26/40 ,  H01L21/306 ,  H01L21/48 ,  B23K26/00

CPC分类号： H05K3/002 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/55 ,  B23K2101/35 ,  B23K2103/50 ,  H01L21/30604 ,  H01L21/30625 ,  H01L21/486 ,  H05K2203/107

摘要： A laser processing method of converging laser light into an object to be processed made of silicon so as to form a modified region and etching the object along the modified region so as to form the object with a through hole comprises an etch resist film producing step of producing an etch resist film resistant to etching on an outer surface of the object; a laser light converging step of converging the laser light at the object after the etch resist film producing step so as to form the modified region along a part corresponding to the through hole in the object and converging the laser light at the etch resist film so as to form a defect region along a part corresponding to the through hole in the etch resist film; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

摘要翻译： 一种激光加工方法，其将激光会聚到由硅制成的待加工物体中以形成改质区域，并沿着改质区域蚀刻物体以形成具有通孔的物体，其包括：抗蚀剂膜制造步骤 产生耐蚀刻物体的外表面上的蚀刻抗蚀剂膜; 在该抗蚀剂膜制造工序之后，将激光会聚在被处理物体上的激光聚光步骤，沿着与物体的贯通孔对应的部分形成改质区域，并将激光会聚在抗蚀剂膜上，以便 沿着与蚀刻抗蚀剂膜中的通孔对应的部分形成缺陷区域; 以及在激光聚光步骤之后蚀刻所述物体以便沿着所述改质区域选择性地进行蚀刻并形成所述通孔的蚀刻步骤。

公开(公告)号：US08828873B2

公开(公告)日：2014-09-09

申请号：US13388626

申请日：2011-07-19

申请人： Hideki Shimoi ,  Keisuke Araki

发明人： Hideki Shimoi ,  Keisuke Araki

IPC分类号： H01L21/302 ,  H01L23/473 ,  B23K26/06 ,  B23K26/00 ,  B23K26/08

CPC分类号： B23K26/55 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/0853 ,  B23K2101/40 ,  B23K2103/56 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device having a cooling mechanism comprises a modified region forming step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region within the object along a line to form a modified region, an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the first modified region and form a flow path for circulating a coolant as a cooling mechanism within the object, and a functional device forming step of forming a functional device on one main face side of the object.

摘要翻译： 一种制造具有冷却机构的半导体器件的方法包括：将由激光制成的待加工的片状物体的激光聚光的改质区域形成工序，以在该物体内沿着线形成修饰区域，形成 修改区域，在改质区域形成工序后各向异性蚀刻物体的蚀刻步骤，以沿着第一改质区域选择性地进行蚀刻，并形成用于使作为冷却机构的冷却剂循环在物体内的流路，以及功能元件 在物体的一个主面侧形成功能元件的形成工序。

公开(公告)号：US20120135606A1

公开(公告)日：2012-05-31

申请号：US13389048

申请日：2011-07-19

申请人： Hideki Shimoi ,  Keisuke Araki

发明人： Hideki Shimoi ,  Keisuke Araki

IPC分类号： H01L21/02

CPC分类号： H05K3/002 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/55 ,  B23K2101/35 ,  B23K2103/50 ,  H01L21/30604 ,  H01L21/30625 ,  H01L21/486 ,  H05K2203/107

摘要： A laser processing method of converging laser light into an object to be processed made of silicon so as to form a modified region and etching the object along the modified region so as to form the object with a through hole comprises an etch resist film producing step of producing an etch resist film resistant to etching on an outer surface of the object; a laser light converging step of converging the laser light at the object after the etch resist film producing step so as to form the modified region along a part corresponding to the through hole in the object and converging the laser light at the etch resist film so as to form a defect region along a part corresponding to the through hole in the etch resist film; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

摘要翻译： 一种激光加工方法，其将激光会聚到由硅制成的待加工物体中以形成改质区域，并沿着改质区域蚀刻物体以形成具有通孔的物体，其包括：抗蚀剂膜制造步骤 产生耐蚀刻物体的外表面上的蚀刻抗蚀剂膜; 在该抗蚀剂膜制造工序之后，将激光会聚在被处理物体上的激光聚光步骤，沿着与物体的贯通孔对应的部分形成改质区域，并将激光会聚在抗蚀剂膜上，以便 沿着与蚀刻抗蚀剂膜中的通孔对应的部分形成缺陷区域; 以及在激光聚光步骤之后蚀刻所述物体以便沿着所述改质区域选择性地进行蚀刻并形成所述通孔的蚀刻步骤。

公开(公告)号：US5999311A

公开(公告)日：1999-12-07

申请号：US828835

申请日：1997-03-24

申请人： Norihiro Nanba ,  Keisuke Araki

发明人： Norihiro Nanba ,  Keisuke Araki

IPC分类号： G02B15/16 ,  G02B27/00 ,  G02B23/06

CPC分类号： G02B15/16

摘要： A variable magnification optical system comprises at least three optical units which are a first moving optical unit, a fixed optical unit and a second moving optical unit. The three optical units are arranged in that order in a propagation direction of light, and a variation of magnification is effected by a relative movement between the first moving optical unit and the second moving optical unit. If a ray which exits from an object and enters the variable magnification optical system, and passes through a center of a stop of the variable magnification optical system and reaches a center of a final image plane is represented as a reference axis ray, the second moving optical unit has a cross-sectional shape which is asymmetrical in a plane which contains the reference axis, and a curved reflecting surface which is inclined with respect to the reference axis, and the direction of the entering reference axis and the direction of the exiting reference axis of the second moving optical unit are parallel to each other and differ from each other by 180.degree., the variable magnification optical system being arranged in such a manner that a final image is formed after an intermediate image is formed at least twice.

摘要翻译： 可变放大率光学系统包括至少三个光学单元，它们是第一移动光学单元，固定光学单元和第二移动光学单元。 三个光学单元按照光的传播方向依次布置，并且通过第一移动光学单元和第二移动光学单元之间的相对移动来实现放大变化。 如果从物体出来并进入可变放大光学系统并且通过可变放大光学系统的停止的中心并到达最终图像平面的中心的光线被表示为参考轴线，则第二移动 光学单元具有在包含参考轴的平面中不对称的横截面形状，以及相对于参考轴倾斜的弯曲反射表面，以及输入参考轴的方向和出射基准的方向 第二移动光学单元的轴线彼此平行并且彼此相差180°，可变倍率光学系统被布置成使得在中间图像形成至少两次之后形成最终图像。

公开(公告)号：US09108269B2

公开(公告)日：2015-08-18

申请号：US13388595

申请日：2011-07-19

申请人： Hideki Shimoi ,  Keisuke Araki

发明人： Hideki Shimoi ,  Keisuke Araki

IPC分类号： B44C1/22 ,  B23K26/00 ,  B23K26/36 ,  H01L31/0236

CPC分类号： B23K26/355 ,  B23K26/361 ,  H01L31/02363 ,  Y02E10/50

摘要： A method for manufacturing a light-absorbing substrate having a surface with depressions and projections comprises a first step of irradiating a substrate with a laser light so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause at least one of each modified region and a fracture generated from the modified region to reach the surface of the substrate and a second step of etching the surface of the substrate after the first step so as to form depressions and projections on the surface of the substrate.

摘要翻译： 一种具有凹凸表面的光吸收基板的制造方法，其特征在于，包括：第一工序，用激光照射基板，形成沿着基板的基板表面二维配置的多个改质区域 并且使得每个改性区域中的至少一个和从所述改性区域产生的断裂到达所述基板的表面;以及第二步骤，在所述第一步骤之后蚀刻所述基板的表面，以在所述第一步骤的表面上形成凹陷和突起 底物。

公开(公告)号：US08961806B2

公开(公告)日：2015-02-24

申请号：US13388597

申请日：2011-07-19

申请人： Hideki Shimoi ,  Hiroyuki Kyushima ,  Keisuke Araki

发明人： Hideki Shimoi ,  Hiroyuki Kyushima ,  Keisuke Araki

IPC分类号： B44C1/22 ,  H01L21/306 ,  B23K26/00 ,  B23K26/06 ,  B23K26/08

CPC分类号： H01L23/147 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/30608 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827

摘要： In a method comprising a modified region forming step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a plurality of modified spots within the object along a modified region forming line tilted in a first lateral direction with respect to a thickness direction of the object and the plurality of modified spots construct a modified region, and an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the modified region and form the object with a space extending obliquely with respect to the thickness direction, the modified region forming step forms the plurality of modified spots such that the modified spots adjacent to each other at least partly overlap each other when seen in the first lateral direction.

摘要翻译： 在包括修改区域形成步骤的方法中，所述修改区域形成步骤将激光会聚在由硅制成的待加工的片状物体上，以沿着沿第一横向方向倾斜的改质区域形成线在物体内形成多个改质点 相对于物体的厚度方向，并且所述多个改质点构成改质区域，以及在所述改质区域形成工序之后对所述物体进行各向异性蚀刻的蚀刻工序，以沿着所述改质区域选择性地进行蚀刻，并形成所述物体 具有相对于厚度方向倾斜延伸的空间，所述改质区域形成步骤形成所述多个改质点，使得当在所述第一横向方向上观察时，彼此相邻的所述改性斑点彼此至少部分重叠。

公开(公告)号：US08841213B2

公开(公告)日：2014-09-23

申请号：US13389050

申请日：2011-07-19

申请人： Hideki Shimoi ,  Keisuke Araki

发明人： Hideki Shimoi ,  Keisuke Araki

IPC分类号： H01L21/768

CPC分类号： B23K26/0853 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/55 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/30608 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/002 ,  H05K2203/107 ,  H01L2924/00

摘要： A method for manufacturing an interposer equipped with a plurality of through-hole electrodes comprises a laser light converging step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region in the object; an etching step of anisotropically etching the object after the laser light converging step so as to advance etching selectively along the modified region and form a plurality of through holes in the object, each through hole being tilted with respect to a thickness direction of the object and having a rectangular cross section; an insulating film forming step of forming an insulating film on an inner wall of each through hole after the etching step; and a through-hole electrode forming step of inserting a conductor into the through holes so as to form the through-hole electrodes after the insulating film forming step; wherein the plurality of through holes are arranged such that the through holes aligning in the tilted direction are staggered in a direction perpendicular to the tilted direction as seen from a main face of the object.

摘要翻译： 一种配备有多个通孔电极的插入件的制造方法，其特征在于，包括激光收敛步骤，将激光会聚在由硅制成的被处理片状物体上，以在物体中形成改质区域; 在激光聚光步骤之后对物体进行各向异性蚀刻的蚀刻步骤，以沿着改质区域选择性地进行蚀刻，并在物体中形成多个通孔，每个通孔相对于物体的厚度方向倾斜， 具有矩形截面; 绝缘膜形成步骤，在蚀刻步骤之后在每个通孔的内壁上形成绝缘膜; 以及通孔电极形成步骤，在绝缘膜形成步骤之后，将导体插入通孔中以形成通孔电极; 其中所述多个通孔被布置成使得沿着所述倾斜方向对齐的所述通孔在从所述物体的主面看时与所述倾斜方向垂直的方向交错。

公开(公告)号：US20120131958A1

公开(公告)日：2012-05-31

申请号：US13388739

申请日：2011-07-19

申请人： Hideki Shimoi ,  Keisuke Araki

发明人： Hideki Shimoi ,  Keisuke Araki

IPC分类号： C03C15/00

CPC分类号： C03C15/00 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/55 ,  B23K26/60 ,  B23K2103/50 ,  C03C23/0025 ,  C03C23/003 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49827

摘要： A laser processing method of converging a laser light into an object to be processed made of glass so as to form a modified region and etching the object along the modified region so as to form a through hole in the object comprises a browning step of discoloring at least a part of the object by browning; a laser light converging step of forming the modified region in the discolored part of the object by converging the laser light into the object after the browning step; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

摘要翻译： 一种激光加工方法，其将激光会聚到由玻璃制成的待加工对象物中，以形成改质区域，并沿着改质区域蚀刻物体，以便在物体中形成通孔，该方法包括： 至少部分对象通过褐变; 激光聚光步骤，通过在所述褐变步骤之后将所述激光会聚到所述物体中，在所述物体的变色部分中形成所述改质区域; 以及在激光聚光步骤之后蚀刻所述物体以便沿着所述改质区域选择性地进行蚀刻并形成所述通孔的蚀刻步骤。