Abstract:
An additional p-n junction diode, having a forward bias voltage smaller than a forward bias voltage between the base and emitter of a first-stage specific transistor of 3-stage Darlington connected npn transistors, is electrically connected in parallel between a p-type base layer and an n-type collector layer of the specific transistor. The polarities of the p-type and n-type layers of the diode are respectively the same as those of the parallel-connected p-type base and n-type collector layers of the specific transistor.
Abstract:
A junction type field effect transistor comprises a semiconductor layer of one conductivity type acting as a drain region, a source region of said one conductivity type formed to a prescribed depth from the surface of the semiconductor layer, an insulation layer formed to a prescribed depth from the surface of the semiconductor layer to surround the source region, and a gate region of the opposite conductivity type formed in the proximity of the sorce region. The insulation layer and source region are formed to substantially the same depth.
Abstract:
A semiconductor device with a planar p-n junction and a guard ring region, wherein an oxide film is covered on the surface between the p-n junction and the guard ring, and a glass film is formed on the surface surrounding the guard ring region.
Abstract:
A joint structure for a control cable includes an annular cable-end member provided on an end of the control cable, a columnar sleeve arranged in the annular cable-end member and a pair of bushes of the same configuration. Each bush includes an annular part, a cylindrical part, a pair of claw parts and a pair of cradle parts. In this arrangement, the cylindrical part, which is made of elastic material, is inserted between the sleeve and the cable-end member, while a pair of claw parts are engaged with the cradle parts of the opposing bush. The sleeve is provided on the side face with a circumferential bead, interposed between leading ends of the opposing bushes. Even if any force is exerted between the cable-end member and the sleeve, no deformation is caused in the cylindrical parts because of its inelasticity, while the bead prevents relative displacement.
Abstract:
There is provided a method of producing a semiconductor device comprising a protecting silicone gel layer which covers a semiconductor chip and bonding wires for taking electrodes out of this chip, and a resin layer which has a smaller thermal expansion coefficient than that of this silicone gel layer at least part of which contacts the silicone gel layer. This method comprises the steps of: thermally expanding the silicone gel layer until it reaches the product environmental guarantee temperature which comes before the cure acceleration reaction in the resin layer; and completely curing the resin layer while maintaining the volume of the silicone gel layer at the same time, thereby fixedly adhering it with the other parts.
Abstract:
A junction type semiconductor device, wherein a protective diode is formed in a part of the region consisting of a base region and a collector region. The device permits reducing the manufacturing cost of semiconductor elements, makes it possible to provide a smaller electric apparatus, and is high in reliability.