Apparatus for heat treating semiconductors at normal pressure and low
pressure
    1.
    发明授权
    Apparatus for heat treating semiconductors at normal pressure and low pressure 失效
    用于在正常压力和低压下热处理半导体的装置

    公开(公告)号:US5578132A

    公开(公告)日:1996-11-26

    申请号:US269608

    申请日:1994-07-05

    摘要: A heat treating unit for semiconductor processing is adapted to conduct normal pressure high temperature processing and low pressure thermal processing using corrosive gases. The unit includes an inner tube for receiving a boat which carries objects to be processed, an outer tube concentrically disposed outside the inner tube, a cylindrical manifold which has a gas feed port and an exhaust port, and a cap which tightly closes an opening of the manifold. The inner tube, outer tube and manifold are formed of quartz which is heat resistant and corrosion resistant, and these three components are integrally joined together by melting. The interior surface of the cap is provided with a protecting layer which is heat resistant and corrosion resistant. A connection between the cap and the manifold includes a high temperature heat resistant seal in which O-rings are cooled by a cooling system.

    摘要翻译: 用于半导体处理的热处理单元适于使用腐蚀性气体进行常压高温处理和低压热处理。 该单元包括用于接收携带被处理物体的船的内管,同心地设置在内管外部的外管,具有气体供给口和排气口的圆柱形歧管,以及紧密地封闭 歧管。 内管,外管和歧管由耐热耐腐蚀的石英形成,这三个部件通过熔化整体连接在一起。 盖的内表面设置有耐热和耐腐蚀的保护层。 盖和歧管之间的连接包括高温耐热密封件,其中O形环由冷却系统冷却。

    Heat processing furnace and vertical-type heat processing apparatus
    2.
    发明授权
    Heat processing furnace and vertical-type heat processing apparatus 有权
    热加工炉和立式热处理设备

    公开(公告)号:US07974525B2

    公开(公告)日:2011-07-05

    申请号:US12071909

    申请日:2008-02-27

    IPC分类号: A21B2/00 F26B19/00

    摘要: The present invention is a heat processing furnace comprising: a processing vessel for accommodating an object to be processed and performing thereto a heat process; and a cylindrical heater disposed to surround a circumference of the processing vessel, for heating the object to be processed; wherein: the heater includes a cylindrical heat insulating member, ribbed shelf sections that are axially formed in a tier-like manner on an inner circumference of the heat insulating member, and heating resistance wires of a helical pattern that are placed along the respective shelf sections; and pin members are arranged in the heat insulating member at suitable intervals therebetween, the pin members holding the heating resistance wires such that the heating resistance wires are movable in a radial direction of the heater, while preventing dropout of the heating resistance wires from the shelf sections.

    摘要翻译: 本发明是一种热处理炉,包括:处理容器,用于容纳待加工物体并进行加热处理; 以及设置成围绕处理容器的圆周的圆柱形加热器,用于加热被处理物体; 其特征在于,所述加热器包括圆筒形绝热构件,在所述隔热构件的内周上以层状的方式轴向形成的肋状搁板部,以及沿着各个搁板部放置的螺旋图案的耐热电线 ; 并且销构件以适当的间隔布置在绝热构件中,销构件保持加热电阻线,使得加热电阻线可在加热器的径向方向上移动,同时防止加热电阻丝从搁板 部分。

    THERMAL PROCESSING APPARATUS AND COOLING METHOD
    3.
    发明申请
    THERMAL PROCESSING APPARATUS AND COOLING METHOD 有权
    热处理装置和冷却方法

    公开(公告)号:US20110076632A1

    公开(公告)日:2011-03-31

    申请号:US12881556

    申请日:2010-09-14

    IPC分类号: F27D15/02 F28D15/00

    摘要: A thermal processing apparatus including: a cylindrical processing vessel; a support unit to be loaded into and unloaded from the vessel; and a heating furnace surrounding an outer periphery of the vessel, with a cooling space therebetween. The furnace is connected to a cooling-gas introduction unit, including a gas introduction passage to which a blowing fan is connected, for introducing a cooling gas into the cooling space during a temperature lowering operation after a thermal process. The furnace is connected to a cooling-gas discharge unit, including a heat exchanger, a suction fan, and a gas discharge passage, for discharging the cooling gas of a raised temperature from the cooling space. Connected to the gas discharge passage at a position upstream of the heat exchanger is a temperature-lowering gas introduction unit for introducing a temperature-lowering gas to the cooling gas of a raised temperature so as to lower its temperature.

    摘要翻译: 一种热处理设备,包括:圆柱形处理容器; 支撑单元,其被装载和卸载; 以及围绕容器的外周的加热炉,其间具有冷却空间。 炉子连接到冷却气体引入单元,该冷却气体引入单元包括连接有吹风扇的气体引入通道,用于在热处理之后的降温操作期间将冷却气体引入冷却空间。 炉子连接到冷却气体排出单元,该冷却气体排出单元包括热交换器,抽吸风扇和气体排出通道,用于将升温的冷却气体从冷却空间排出。 在该热交换器上游的位置与气体排出通路连接的是降温气体引入单元,用于将降温气体导入升温温度降低的气体,降低其温度。

    Wafer processing apparatus, method of operating the same and wafer detecting system

    公开(公告)号:US06390754B1

    公开(公告)日:2002-05-21

    申请号:US09080254

    申请日:1998-05-18

    IPC分类号: B65G4907

    摘要: A closed-type cassette is mounted on a cassette stand disposed in a working region at a position corresponding to an opening formed in a wall separating the working region from a loading region. When the cassette is mounted on the cassette stand, a detecting device gives a signal to that effect to a controller. Then, the controller closes a valve to interrupt nitrogen gas supply into the loading region. A lid of the cassette is opened 20 to 30 sec after the interruption of nitrogen gas supply into the loading region and, then, nitrogen gas supply is resumed. The pressure difference between the loading region and the interior of the cassette is decreased by interrupting nitrogen gas supply into the loading region, so that the lid can be easily opened.

    Piping connection device
    6.
    发明授权
    Piping connection device 失效
    管道连接装置

    公开(公告)号:US5362229A

    公开(公告)日:1994-11-08

    申请号:US79386

    申请日:1993-06-21

    申请人: Kenichi Yamaga

    发明人: Kenichi Yamaga

    摘要: In a semiconductor wafer heat-treating apparatus, there is provided a piping connection device on a gas inlet pipe leading to the heat-treating apparatus and a gas outlet pipe derived from the heat-treating apparatus. The piping connection device has a spherical convex connecting element, and a concave connecting element having a concave spherical surface into which the spherical element is snugly fitted. A pair of presser plates are placed on the outer surfaces of the two connecting elements and clamped by bolts so as to press confronting sealing surfaces of the convex and concave connecting elements against each other. Because the outer surfaces of the two connecting elements to be engaged with the pair of presser plates are spherically fashioned, the connection surfaces can present a satisfactory sealing condition without subjecting the pair of the pipes connected by the piping connection device to excessive biasing forces even though the two pipes are angled to each other.

    摘要翻译: 在半导体晶片热处理装置中,在通向热处理装置的气体导入管和从该热处理装置得到的气体出口管上设置配管连接装置。 管道连接装置具有球形凸形连接元件和具有凹形球形表面的凹形连接元件,球形元件紧密配合到该凹形连接元件中。 一对压板放置在两个连接元件的外表面上,并被螺栓夹紧,以将相互凸起的和凹形的连接元件的相对的密封表面压在一起。 由于与一对压板接合的两个连接元件的外表面是球形的,所以连接表面可以呈现令人满意的密封条件,而不会使由配管连接装置连接的一对管子经受过大的偏压力,即使 两个管道彼此成角度。

    Heat-treatment apparatus having exhaust system
    9.
    发明授权
    Heat-treatment apparatus having exhaust system 失效
    具有排气系统的热处理装置

    公开(公告)号:US5088922A

    公开(公告)日:1992-02-18

    申请号:US644565

    申请日:1991-01-23

    摘要: A heat-treatment apparatus of the invention includes a collective exhaust unit for constantly performing gas exhaust from a clean room to keep the room in a clean atmosphere, a heat-treatment furnace for receiving a gas and/or a liquid for forming a desired film on a surface of an object to be treated in a heating atmosphere, an exhaust path, communicating with the collective exhaust unit and the heat-treatment furnace, for introducing a gas filling the heat-treatment furnace into the collective exhaust unit, an outer air intake unit for taking in outer air in the exhaust path to adjust an exhaust pressure of the exhaust path, and a trap unit, arranged below the exhaust path, for trapping a waste liquid collected in the exhaust path.

    摘要翻译: 本发明的热处理装置包括:一个不间断地执行从洁净室排出气体以将房间保持在清洁气氛中的集合排气单元,用于接收气体的热处理炉和/或用于形成所需膜的液体 在加热气氛中待处理物体的表面上,与集体排气单元和热处理炉连通的排气路径,用于将填充热处理炉的气体引入到集合排气单元中,外部空气 进气单元,用于吸入排气路径中的外部空气以调节排气路径的排气压力;以及捕集单元,布置在排气通道下方,用于捕集在排气路径中收集的废液。

    Heat treatment furnace and heat treatment apparatus
    10.
    发明授权
    Heat treatment furnace and heat treatment apparatus 有权
    热处理炉和热处理设备

    公开(公告)号:US09466515B2

    公开(公告)日:2016-10-11

    申请号:US13527150

    申请日:2012-06-19

    CPC分类号: H01L21/67109

    摘要: A heat treatment furnace includes: a processing vessel configured to accommodate therein at least one object to be processed; a cylindrical heat insulating member covering a periphery of the processing vessel; and a heater disposed along an inner circumferential surface of the heat insulating member. The heater includes strip-shaped corrugated heater elements disposed along the inner circumferential surface of the heat insulating member, each of the heater elements having valley portions protruding outward and mountain portions protruding inward.

    摘要翻译: 热处理炉包括:处理容器,其配置成在其中容纳至少一个待处理物体; 覆盖所述处理容器的周边的圆柱形绝热构件; 以及沿着绝热构件的内周面设置的加热器。 加热器包括沿着隔热构件的内周面设置的带状瓦楞加热器元件,每个加热器元件具有向外突出的谷部分和向内突出的山部分。