摘要:
A method of fabricating an anode plate 18 for use in a field emission device comprises the steps of providing a transparent substrate 20 and depositing a layer of a transparent, electrically conductive material 24 on a surface of the substrate. Next, portions of the layer of conductive material 24 are removed to form regions of the conductive material. Luminescent material 26 is then applied on the conductive regions and an outer portion 27 of at least some of the particles of the luminescent material are thereafter removed.
摘要:
A method of fabricating an anode plate 80 for use in a field emission device. The method comprises the steps of providing a substantially transparent substrate 88 having spaced-apart, electrically conductive regions 50 on a surface thereof, then coating the anode plate with a substantially opaque material 86. The opaque material 86 is removed from the surface of the conductive regions 50 in the active area 58, and from selected areas 60 of the interconnect portion of the conductive regions 50. A first bus 52 is provided for electrically connecting a first series 50.sub.R of the conductive regions 50, a second bus 54 is provided for electrically connecting a second series 50.sub.G of the conductive regions 50, and a third bus 56 is provided for electrically connecting a third series 50.sub.B of the conductive regions 50. Luminescent material of a first color 84.sub.R is applied to the first series of conductive regions 50.sub.R, luminescent material of a second color 84.sub.G is applied to the second series of conductive regions 50.sub.G, and luminescent material of a third color 84.sub.B is applied to the third series of conductive regions 50.sub.B.
摘要:
An mode plate 80 for use in a field emission flat panel display device comprises a transparent planar substrate 88 having a plurality of electrically conductive, parallel stripes 50 comprising the anode electrode of the device, which are covered by phosphors 84.sub.R, 84.sub.G and 84.sub.B. The conductors 50 which are covered by the same color phosphors are electrically interconnected by buses 52, 54, and 56. A substantially opaque, electrically insulating material 86 is affixed to substrate 88 in the spaces between conductors 50, acting as a barrier to the passage of ambient light into and out of the device. In addition, the same substantially opaque, electrically insulating material 86 is formed between the conductors 50 and the buses 52, 54, and 56, thereby providing electrical isolation between the two layers. Opaque material 86 preferably comprises glass having impurities dispersed therein, wherein the impurities may include one or more organic dyes, selected to provide relatively uniform opacity over the visible range of the electromagnetic spectrum. Alternatively, the impurities may include the black oxide of a transition metal such as cobalt.
摘要:
A method of fabricating an anode plate 40 having a multiplicity of grooves 50 for use in a field emission flat panel display device comprises the steps of providing a transparent planar substrate 42 having a plurality of electrically conductive, parallel stripes 46 comprising the anode electrode of the device; etching a plurality of grooves 50 in the surface of the substrate in the spaces between the stripes 46; and then applying phosphor material 48.sub.R, 48.sub.G and 48.sub.B over the stripes 46. In one embodiment, a plurality of grooves 50', having generally vertical sidewalls, are formed in the upper surface of planar substrate 42' at the interstices of conductors 46. In a second embodiment, a plurality of grooves 50", having generally curved sidewalls, are formed in the upper surface of planar substrate 42' at the interstices of conductors 46'. In a third embodiment, a plurality of grooves 50", having generally vertical sidewalls, are formed in the upper surface of an insulating material 52 located between conductors 46". In a fourth embodiment, a plurality of grooves 50'", having generally curved sidewalls, are formed in the upper surface of an insulating material 52' between conductors 46'". In a fifth embodiment, a plurality of grooves are formed in the upper surface of planar substrate 100, and insulating material 108 is applied over the grooves. In a sixth embodiment, a plurality of grooves are formed in both the surface of the planar substrate 120 and the surface of insulating material 128.
摘要:
The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70, illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.
摘要:
The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70, illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced therefrom by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.
摘要:
The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70; illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced therefrom by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.
摘要:
An electron emitter plate (110) for an FED image display has an extraction (gate) electrode (22) spaced by an insulating spacer (125) from a cathode electrode including a conductive mesh (18). Arrays of microtips (14) are located in mesh spacings (16), within apertures (26) formed in extraction electrode (22) and subcavities (141) formed through apertures (26) in insulating spacer (125). Subcavities (141a) are open to row-adjacent and column-adjacent subcavities (141b, 141c) to form larger main cavities (144). Posts (143) of insulating spacer (125) separate diagonally-adjacent cavities (141d). Subcavities (141) are formed by over-etching a layer of insulating spacer material (25) through apertures (26) before or after forming microtips (14) through the same apertures (26). Over-etching reduces the dielectric constant factor of gate-to-cathode capacitance in the finished structure.
摘要:
An electron emitter plate (110) for an FED image display has an extraction (gate) electrode (122) spaced by an insulating layer (25) from a cathode electrode including a conductive mesh (118). Circular arrays (112) of microtips (14) are located concentrically within circular mesh spacings (116) on a resistive layer (15), within apertures (26) formed in extraction electrode (122). Microtips (14) are laterally spaced from mesh structure (118) by substantially identical paths of a ballast-providing resistive layer (15), placing all microtips (14) at generally the same potential.
摘要:
A size-arrayed emitter structure is disclosed for use in a field emission display device. The emitter structure is designed such that each emitter array (illustratively, an array comprising microtips 40 in a 5.times.5 matrix) has an emitter hole 52 size (critical dimension) distribution that is centered on the optimum hole critical dimension and extends past the point at which the emitter tip 40 will operate. If the manufacturing process varies and produces an actual critical dimension larger than the designed value, emitters with the designed critical dimensions smaller than optimal will shift toward optimal, and emitters with critical dimensions smaller than the minimum operating value will become operational, while emitters with designed critical dimensions larger than optimal will cease to function. Similarly, if the actual critical dimension is smaller than the designed value, emitters with the designed critical dimensions larger than optimal will shift toward optimal, and emitters with critical dimensions larger than the maximum operating value will become operational, while emitters with designed critical dimensions smaller than optimal will cease to function. This will result in a distribution of active emitters in each array that are centered on the optimal value and that extend from the minimum functional emitter critical dimension to the maximum functional emitter critical dimension. Where the number of emitter arrays per display pixel is relatively large, the critical dimension of all of the emitter holes within each array may be designed to be equal, and the totality of arrays within each pixel may be designed such that their emitter hole critical dimensions are centered on the optimum hole critical dimension and extend past the point at which the emitter tips will operate.