公开(公告)号：US06927393B2

公开(公告)日：2005-08-09

申请号：US10320835

申请日：2002-12-16

申请人： John M. Cotte ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Keith R. Pope ,  Robert J. Purtell ,  John P. Simons ,  Charles J. Taft

发明人： John M. Cotte ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Keith R. Pope ,  Robert J. Purtell ,  John P. Simons ,  Charles J. Taft

IPC分类号： G01N21/35 ,  G01J5/02

CPC分类号： G01N21/359 ,  G01N21/3504

摘要： A method and apparatus are provided for in situ monitoring and analyzing of process parameters for semiconductor fabrication processes including cleaning semiconductor wafers utilizing a supercritical fluid or a high pressure liquid such as CO2. The method and apparatus utilize a spectrometer having a reflective mirror proximate the vessel holding the high pressure fluid. NIR radiation transmitted into the vessel through a window and out of the vessel through an opposed window is reflected and detected and measured and the composition of the fluid in the pressure vessel is determined allowing the user to control process parameters based on the measured composition.

摘要翻译： 提供了一种用于半导体制造工艺的工艺参数的原位监测和分析的方法和装置，包括利用超临界流体或诸如CO 2的高压液体清洗半导体晶片。 该方法和装置利用具有靠近保持高压流体的容器的反射镜的光谱仪。 通过窗口传输到容器中并通过相对的窗口传出容器的NIR辐射被反射和检测和测量，并且确定压力容器中的流体的组成，允许用户基于测量的组成来控制工艺参数。

公开(公告)号：US06736906B2

公开(公告)日：2004-05-18

申请号：US10120309

申请日：2002-04-10

申请人： John M. Cotte ,  Matteo Flotta ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Keith R. Pope ,  John P. Simons ,  Charles J. Taft

发明人： John M. Cotte ,  Matteo Flotta ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Keith R. Pope ,  John P. Simons ,  Charles J. Taft

IPC分类号： B08B300

CPC分类号： B08B7/0021 ,  B08B3/10 ,  B08B13/00

摘要： A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.

摘要翻译： 一种用于处理液化液体室中的工件的工件保持器。 在一个实施例中，工件保持器包括具有外壁和在外壁上的至少一个流体引导件的圆柱形旋转器。 旋转器适于旋转并提供流过旋转器的第一端的流体流，并且适于提供垂直于旋转体的第一端的表面的流体流动和混合。 固定装置联接到转子的第一端，用于将工件固定到转子的第一端。

公开(公告)号：US08828143B2

公开(公告)日：2014-09-09

申请号：US11866232

申请日：2007-10-02

申请人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

发明人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

IPC分类号： B08B3/10 ,  B08B7/04 ,  H01L21/67 ,  B08B7/00 ,  H01L21/02

CPC分类号： H01L21/02101 ,  B08B7/0021 ,  H01L21/67109 ,  H01L21/67248 ,  Y10S134/902

摘要： A surface cleaning apparatus comprising a chamber, and a thermal transfer device. The chamber is capable of holding a semiconductor structure therein. The thermal transfer device is connected to the chamber. The thermal transfer device has a surface disposed inside the chamber for contacting the semiconducting structure and controlling a temperature of the semiconductor structure in contact with the surface. The thermal transfer device has a thermal control module connected to the surface for heating and cooling the surface to thermally cycle the surface. The thermal control module effects a substantially immediate thermal response of the surface when thermally recycling the surface.

摘要翻译： 一种表面清洁装置，包括腔室和热转印装置。 该室能够在其中保持半导体结构。 热传递装置连接到腔室。 热传递装置具有设置在室内的表面，用于接触半导体结构并控制与表面接触的半导体结构的温度。 热转印装置具有连接到表面的热控制模块，用于加热和冷却表面以使表面热循环。 当热再循环表面时，热控制模块会对表面产生实质上即时的热响应。

公开(公告)号：US20090235955A1

公开(公告)日：2009-09-24

申请号：US11866255

申请日：2007-10-02

申请人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

发明人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

IPC分类号： B08B3/10

CPC分类号： H01L21/02101 ,  B08B7/0021 ,  H01L21/67109 ,  H01L21/67248 ,  Y10S134/902

摘要： A surface cleaning apparatus comprising a chamber, and a thermal transfer device. The chamber is capable of holding a semiconductor structure therein. The thermal transfer device is connected to the chamber. The thermal transfer device has a surface disposed inside the chamber for contacting the semiconducting structure and controlling a temperature of the semiconductor structure in contact with the surface. The thermal transfer device has a thermal control module connected to the surface for heating and cooling the surface to thermally cycle the surface. The thermal control module effects a substantially immediate thermal response of the surface when thermally recycling the surface.

摘要翻译： 一种表面清洁装置，包括腔室和热转印装置。 该室能够在其中保持半导体结构。 热传递装置连接到腔室。 热传递装置具有设置在室内的表面，用于接触半导体结构并控制与表面接触的半导体结构的温度。 热转印装置具有连接到表面的热控制模块，用于加热和冷却表面以使表面热循环。 当热再循环表面时，热控制模块会对表面产生实质上即时的热响应。

公开(公告)号：US20130210235A1

公开(公告)日：2013-08-15

申请号：US11866232

申请日：2007-10-02

申请人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

发明人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

IPC分类号： H01L21/02

CPC分类号： H01L21/02101 ,  B08B7/0021 ,  H01L21/67109 ,  H01L21/67248 ,  Y10S134/902

摘要： A surface cleaning apparatus comprising a chamber, and a thermal transfer device. The chamber is capable of holding a semiconductor structure therein. The thermal transfer device is connected to the chamber. The thermal transfer device has a surface disposed inside the chamber for contacting the semiconducting structure and controlling a temperature of the semiconductor structure in contact with the surface. The thermal transfer device has a thermal control module connected to the surface for heating and cooling the surface to thermally cycle the surface. The thermal control module effects a substantially immediate thermal response of the surface when thermally recycling the surface.

公开(公告)号：US07288155B2

公开(公告)日：2007-10-30

申请号：US11128022

申请日：2005-05-12

申请人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario Goldfarb

发明人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario Goldfarb

IPC分类号： B08B3/00 ,  B08B7/04

CPC分类号： H01L21/02101 ,  B08B7/0021 ,  H01L21/67109 ,  H01L21/67248 ,  Y10S134/902

摘要： A method for cleaning a semiconductor structure including providing a chamber for holding the semiconductor structure and a dense phase fluid, providing a thermal transfer device having a thermal transfer surface, connecting the thermal transfer device to the chamber, placing the semiconductor structure in the chamber in contact with the thermal transfer surface and thermally cycling the thermal transfer surface.

摘要翻译： 一种用于清洁半导体结构的方法，包括提供用于保持半导体结构的腔室和致密相流体，提供具有热转印表面的热转印装置，将热转印装置连接到腔室，将半导体结构放置在腔室中 与热转印表面接触并热循环热转印表面。

公开(公告)号：US06997197B2

公开(公告)日：2006-02-14

申请号：US10318632

申请日：2002-12-13

申请人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

发明人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

IPC分类号： B08B7/00

CPC分类号： H01L21/02101 ,  B08B7/0021 ,  H01L21/67109 ,  H01L21/67248 ,  Y10S134/902

摘要： A surface cleaning apparatus comprising a chamber, and a thermal transfer device. The chamber is capable of holding a semiconductor structure therein. The thermal transfer device is connected to the chamber. The thermal transfer device has a surface disposed inside the chamber for contacting the semiconducting structure and controlling a temperature of the semiconductor structure in contact with the surface. The thermal transfer device has a thermal control module connected to the surface for heating and cooling the surface to thermally cycle the surface. The thermal control module effects a substantially immediate thermal response of the surface when thermally recycling the surface.

摘要翻译： 一种表面清洁装置，包括腔室和热转印装置。 该室能够在其中保持半导体结构。 热传递装置连接到腔室。 热传递装置具有设置在室内的表面，用于接触半导体结构并控制与表面接触的半导体结构的温度。 热转印装置具有连接到表面的热控制模块，用于加热和冷却表面以使表面热循环。 当热再循环表面时，热控制模块会对表面产生实质上即时的热响应。

公开(公告)号：US06875286B2

公开(公告)日：2005-04-05

申请号：US10320836

申请日：2002-12-16

申请人： John M. Cotte ,  Catherine Ivers ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Robert J. Purtell ,  John P. Simons ,  William A. Syverson ,  Charles J. Taft

发明人： John M. Cotte ,  Catherine Ivers ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Robert J. Purtell ,  John P. Simons ,  William A. Syverson ,  Charles J. Taft

IPC分类号： H01L21/304 ,  B08B7/00 ,  C25F1/00 ,  H01L21/30 ,  H01L21/302 ,  H01L21/306

CPC分类号： B08B7/0021 ,  H01L21/02063 ,  Y10S134/902

摘要： A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the CO2 from the vessel. The residues are carried away with the vaporized carbon dioxide.

摘要翻译： 提供了一种方法和装置，用于从诸如半导体晶片的电子部件中除去固体和/或液体残留物，其中所述液体或超临界二氧化碳在晶片的表面上固化，然后蒸发并从系统中除去。 在优选的实施方案中，在从容器中除去CO 2之前重复（循环）固化和蒸发步骤。 残余物被蒸发的二氧化碳带走。

公开(公告)号：US06561220B2

公开(公告)日：2003-05-13

申请号：US09840611

申请日：2001-04-23

申请人： Kenneth J. McCullough ,  Wayne M. Moreau ,  John P. Simons ,  Charles J. Taft ,  John M. Cotte

发明人： Kenneth J. McCullough ,  Wayne M. Moreau ,  John P. Simons ,  Charles J. Taft ,  John M. Cotte

IPC分类号： F17D104

CPC分类号： H01L21/67017 ,  Y10T137/85994 ,  Y10T137/86035

摘要： A method and an apparatus, the apparatus including appropriate valves and conduits, for increasing throughput in pressurized fluid processing including storing in a storage chamber of the apparatus a quantity of fluid at a pressure higher than a pressure at which an operation is to take place, while a processing chamber is depressurized to allow reception of a new object; sealing the processing chamber; and allowing fluid stored in the storage chamber to pass to the processing chamber to re-pressurize the processing chamber before performing the operation. The fluid may be preheated in the storage chamber to further reduce processing times.

公开(公告)号：US08388758B2

公开(公告)日：2013-03-05

申请号：US11866255

申请日：2007-10-02

申请人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

发明人： John P. Simons ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  John M. Cotte ,  Keith R. Pope ,  Charles J. Taft ,  Dario L. Goldfarb

IPC分类号： B08B7/00

CPC分类号： H01L21/02101 ,  B08B7/0021 ,  H01L21/67109 ,  H01L21/67248 ,  Y10S134/902

摘要： A surface cleaning apparatus comprising a chamber, and a thermal transfer device. The chamber is capable of holding a semiconductor structure therein. The thermal transfer device is connected to the chamber. The thermal transfer device has a surface disposed inside the chamber for contacting the semiconducting structure and controlling a temperature of the semiconductor structure in contact with the surface. The thermal transfer device has a thermal control module connected to the surface for heating and cooling the surface to thermally cycle the surface. The thermal control module effects a substantially immediate thermal response of the surface when thermally recycling the surface.

摘要翻译： 一种表面清洁装置，包括腔室和热转印装置。 该室能够在其中保持半导体结构。 热传递装置连接到腔室。 热传递装置具有设置在室内的表面，用于接触半导体结构并控制与表面接触的半导体结构的温度。 热转印装置具有连接到表面的热控制模块，用于加热和冷却表面以使表面热循环。 当热再循环表面时，热控制模块会对表面产生实质上即时的热响应。