PARTIAL SOLUTION REPLACEMENT IN RECYCLABLE PERSULFURIC ACID CLEANING SYSTEMS
    2.
    发明申请
    PARTIAL SOLUTION REPLACEMENT IN RECYCLABLE PERSULFURIC ACID CLEANING SYSTEMS 有权
    可循环使用的清洁系统中的部分溶液替代物

    公开(公告)号:US20120255577A1

    公开(公告)日:2012-10-11

    申请号:US13080097

    申请日:2011-04-05

    IPC分类号: C23G1/36 B08B3/10

    摘要: A method of implementing cleaning solution replacement in a recyclable fluid cleaning system for semiconductor wafers includes activating electrode current for an electrolysis reactor included in the cleaning system. At least one of electrode voltage and operating time for the electrolysis reactor is monitored, until a trigger point has been reached. The trigger point includes one of the electrode voltage reaching a predetermined threshold voltage value, a process time counter reaching a predetermined counter value, and a time value that the electrode voltage has been at the threshold voltage value reaching predetermined value. The process time counter is incremented based on one or more of actual wafer processing time, wafer type, number of wafers processed, and thickness of material to be stripped. Upon reaching the trigger point, the electrode current is deactivated, and at least a portion of cleaning system fluid is drained and replaced with fresh cleaning fluid.

    摘要翻译: 在用于半导体晶片的可再循环流体清洁系统中实施清洁溶液置换的方法包括激活包括在清洁系统中的电解反应器的电极电流。 监控电解反应器的电极电压和操作时间中的至少一个,直到达到触发点。 触发点包括达到预定阈值电压值的电极电压中的一个,达到预定计数器值的处理时间计数器和电极电压已经达到阈值电压值的时间值达到预定值。 基于实际晶片处理时间,晶片类型,处理的晶片数量和要剥离的材料的厚度中的一个或多个,处理时间计数器增加。 在达到触发点时,电极电流被去激活,清洁系统流体的至少一部分被排出并用新鲜的清洁流体代替。

    Method of in situ monitoring of supercritical fluid process conditions
    9.
    发明授权
    Method of in situ monitoring of supercritical fluid process conditions 失效
    超临界流体工艺条件的现场监测方法

    公开(公告)号:US06927393B2

    公开(公告)日:2005-08-09

    申请号:US10320835

    申请日:2002-12-16

    IPC分类号: G01N21/35 G01J5/02

    CPC分类号: G01N21/359 G01N21/3504

    摘要: A method and apparatus are provided for in situ monitoring and analyzing of process parameters for semiconductor fabrication processes including cleaning semiconductor wafers utilizing a supercritical fluid or a high pressure liquid such as CO2. The method and apparatus utilize a spectrometer having a reflective mirror proximate the vessel holding the high pressure fluid. NIR radiation transmitted into the vessel through a window and out of the vessel through an opposed window is reflected and detected and measured and the composition of the fluid in the pressure vessel is determined allowing the user to control process parameters based on the measured composition.

    摘要翻译: 提供了一种用于半导体制造工艺的工艺参数的原位监测和分析的方法和装置,包括利用超临界流体或诸如CO 2的高压液体清洗半导体晶片。 该方法和装置利用具有靠近保持高压流体的容器的反射镜的光谱仪。 通过窗口传输到容器中并通过相对的窗口传出容器的NIR辐射被反射和检测和测量,并且确定压力容器中的流体的组成,允许用户基于测量的组成来控制工艺参数。