Thick film conductor compositions and the use thereof in LTCC circuits and devices
    4.
    发明授权
    Thick film conductor compositions and the use thereof in LTCC circuits and devices 有权
    厚膜导体组合物及其在LTCC电路和器件中的应用

    公开(公告)号:US07611645B2

    公开(公告)日:2009-11-03

    申请号:US11398337

    申请日:2006-04-05

    IPC分类号: H01B1/00

    摘要: The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions.The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).

    摘要翻译: 本发明涉及一种用于低温共烧陶瓷回路的厚膜组合物,其基于重量百分比的总厚膜组合物:(a)30-98重量%的细碎颗粒,其选自贵金属,贵金属合金 金属及其混合物; (b)一种或多种选择的无机粘合剂和/或其混合物,并分散在(c)有机介质中,并且其中所述玻璃组合物与低温共烧陶瓷基底玻璃中存在的残留玻璃不混溶或部分混溶 射击条件。 本发明还涉及使用上述组合物形成多层电路的方法以及该组合物在高频应用(包括微波应用)中的用途。

    Mixed-metal system conductors for LTCC (low-temperature co-fired ceramic)
    5.
    发明授权
    Mixed-metal system conductors for LTCC (low-temperature co-fired ceramic) 有权
    用于LTCC(低温共烧陶瓷)的混合金属系统导体

    公开(公告)号:US08704105B2

    公开(公告)日:2014-04-22

    申请号:US12981196

    申请日:2010-12-29

    IPC分类号: H05K1/09 H05K1/11

    摘要: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

    摘要翻译: 公开了一种用于形成过渡通孔和过渡管线导体的组合物,用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有(a)选自(i)20-45wt%金和80-55wt%银和(ii)100wt%银 - 金固溶体合金的无机成分,和(b)有机 中。 该组合物还可以含有(c)基于组合物重量的1-5重量%的选自Cu,Co,Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。

    MIXED-METAL SYSTEM CONDUCTORS FOR LTCC (LOW-TEMPERATURE CO-FIRED CERAMIC)
    6.
    发明申请
    MIXED-METAL SYSTEM CONDUCTORS FOR LTCC (LOW-TEMPERATURE CO-FIRED CERAMIC) 有权
    用于LTCC(低温共烧陶瓷)的混合金属系统导体

    公开(公告)号:US20110155431A1

    公开(公告)日:2011-06-30

    申请号:US12981196

    申请日:2010-12-29

    IPC分类号: H05K1/09 H01B1/22

    摘要: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

    摘要翻译: 公开了一种用于形成过渡通孔和过渡管线导体的组合物,用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有(a)选自(i)20-45wt%金和80-55wt%银和(ii)100wt%银 - 金固溶体合金的无机成分,和(b)有机 中。 该组合物还可以含有(c)基于组合物重量的1-5重量%的选自Cu,Co,Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。

    Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices
    7.
    发明授权
    Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices 有权
    用于多层电子电路和器件的厚膜导体组合物及其加工技术

    公开(公告)号:US07666328B2

    公开(公告)日:2010-02-23

    申请号:US11601136

    申请日:2006-11-16

    IPC分类号: H01B1/22 B05D5/12

    摘要: The invention relates to thick film conductor compositions which are useful in application to both via-fill and/or line conductors to manufacture of Low Temperature Co-fireable Ceramic (LTCC) devices and other Multilayer Interconnect (MLI) ceramic composite circuits such as Photosensitive Tape On Substrates (PTOS); gold, silver and mixed metal multilayer circuits and devices. The invention is useful for forming microwave and other high frequency circuit components selected from the group comprising: antenna, filters, baluns, beam former, I/O's, couplers, via feedthroughs, EM coupled feedthroughs, wirebond connection, and transmission lines.

    摘要翻译: 本发明涉及可用于通孔填充和/或线路导体以制造低温可共烧陶瓷(LTCC)器件和其它多层互连(MLI)陶瓷复合电路的厚膜导体组合物,例如光敏胶带 底物(PTOS); 金,银和混合金属多层电路和器件。 本发明可用于形成从以下组中选择的微波和其它高频电路组件:天线,滤波器,平衡 - 不平衡转换器,成波器,I / O,耦合器,经由馈通,EM耦合馈通,引线连接和传输线。