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公开(公告)号：US20070138142A1
公开(公告)日：2007-06-21
申请号：US11316010
申请日：2005-12-21
申请人： Kesheng Feng , Nilesh Kapadia , Steven Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steven Castaldi
CPC分类号： C23F1/18 , C23F1/16 , H01L21/32134 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤离子源的微蚀刻组合物。 其它添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后粘合 聚合物材料到铜或铜合金表面。
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公开(公告)号：US20080041824A1
公开(公告)日：2008-02-21
申请号：US11893068
申请日：2007-08-14
申请人： Kesheng Feng , Nilesh Kapadia , Steven Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steven Castaldi
CPC分类号： C23F1/18 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤离子源的微蚀刻组合物。 其它添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后粘合 聚合物材料到铜或铜合金表面。
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公开(公告)号：US07393461B2
公开(公告)日：2008-07-01
申请号：US11209471
申请日：2005-08-23
申请人： Kesheng Feng , Nilesh Kapadia , Steve Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steve Castaldi
CPC分类号： H05K3/383 , C09K13/06 , C23F1/18 , H05K2203/124
摘要： The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an aqueous solution comprising cupric ion source, a pyridine derivative, multiethyleneamine, and an acid. In a preferred embodiment, the microetching solution of the invention also comprises a source of halide ions such as sodium chloride or hydrochloric acid.
摘要翻译： 本发明涉及一种改进的微蚀刻溶液，以及使用改进的组合物来粗糙化金属表面并提高金属层对随后施加的层的粘附强度的方法。 微蚀刻组合物是包含铜离子源，吡啶衍生物，多亚乙基胺和酸的水溶液。 在优选的实施方案中，本发明的微蚀刻溶液还包含卤离子源如氯化钠或盐酸。
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公开(公告)号：US08263177B2
公开(公告)日：2012-09-11
申请号：US12383650
申请日：2009-03-27
申请人： Kesheng Feng , Nilesh Kapadia , Witold Paw
发明人： Kesheng Feng , Nilesh Kapadia , Witold Paw
CPC分类号： C23C22/52 , C09D5/12 , C23C22/83 , H05K3/282 , H05K2203/0786 , H05K2203/124 , Y10T428/24917
摘要： A process is described for treating metal surfaces printed wiring boards and similar substrates to provide improved creep corrosion resistance on such surfaces. A modified organic solderability preservative composition is used in combination with an emulsion polymer to provide a modified polymer coating on the metal surface finish via a chemical reaction to provide enhanced corrosion protection of the surface.
摘要翻译： 描述了一种用于处理金属表面印刷线路板和类似基底的方法，以在这些表面上提供改善的耐蠕变腐蚀性。 改性有机可焊性防腐剂组合物与乳液聚合物组合使用，以通过化学反应在金属表面光洁度上提供改性聚合物涂层，以提供增强的表面腐蚀保护。
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公开(公告)号：US07875558B2
公开(公告)日：2011-01-25
申请号：US11893068
申请日：2007-08-14
申请人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
CPC分类号： C23F1/18 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤素离子源的微蚀刻组合物。 其它添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后粘合 聚合物材料到铜或铜合金表面。
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公开(公告)号：US08486281B2
公开(公告)日：2013-07-16
申请号：US12573298
申请日：2009-10-05
申请人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi , John Ganjei
发明人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi , John Ganjei
IPC分类号： H01B13/00
摘要： A nickel-chromium alloy etching composition comprising sulfuric acid, a source of chloride ions, including hydrochloric acid or sodium, potassium or ammonium chloride, and a sulfur compound comprising a sulfur atom with an oxidation state between −2 to +5, such as thiosulfate, sulfide, sulfite, bisulfite, metabisulfite and phosphorus pentasulfide that can efficiently remove nickel-chromium alloy in the presence of copper circuits is disclosed.
摘要翻译： 一种镍铬合金蚀刻组合物，其包含硫酸，氯离子源，包括盐酸或钠，氯化钾或氯化铵，以及包含氧化态在-2至+5之间的硫原子的硫化合物，例如硫代硫酸盐 ，在铜电路的存在下可以有效去除镍铬合金的硫化物，亚硫酸盐，亚硫酸氢盐，偏亚硫酸氢盐和五硫化磷。
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公开(公告)号：US20110079578A1
公开(公告)日：2011-04-07
申请号：US12573298
申请日：2009-10-05
申请人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi , John Ganjei
发明人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi , John Ganjei
摘要： A nickel-chromium alloy etching composition comprising sulfuric acid, a source of chloride ions, including hydrochloric acid or sodium, potassium or ammonium chloride, and a sulfur compound comprising a sulfur atom with an oxidation state between −2 to +5, such as thiosulfate, sulfide, sulfite, bisulfite, metabisulfite and phosphorus pentasulfide that can efficiently remove nickel-chromium alloy in the presence of copper circuits is disclosed.
摘要翻译： 一种镍铬合金蚀刻组合物，其包含硫酸，氯离子源，包括盐酸或钠，氯化钾或氯化铵，以及包含氧化态在-2至+5之间的硫原子的硫化合物，例如硫代硫酸盐 ，在铜电路的存在下可以有效去除镍铬合金的硫化物，亚硫酸盐，亚硫酸氢盐，偏亚硫酸氢盐和五硫化磷。
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公开(公告)号：US07456114B2
公开(公告)日：2008-11-25
申请号：US11316010
申请日：2005-12-21
申请人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
CPC分类号： C23F1/18 , C23F1/16 , H01L21/32134 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
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公开(公告)号：US20070051693A1
公开(公告)日：2007-03-08
申请号：US11209471
申请日：2005-08-23
申请人： Kesheng Feng , Nilesh Kapadia , Steve Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steve Castaldi
CPC分类号： H05K3/383 , C09K13/06 , C23F1/18 , H05K2203/124
摘要： The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an aqueous solution comprising cupric ion source, a pyridine derivative, multiethyleneamine, and an acid. In a preferred embodiment, the microetching solution of the invention also comprises a source of halide ions such as sodium chloride or hydrochloric acid.
摘要翻译： 本发明涉及一种改进的微蚀刻溶液，以及使用改进的组合物来粗糙化金属表面并提高金属层对随后施加的层的粘附强度的方法。 微蚀刻组合物是包含铜离子源，吡啶衍生物，多亚乙基胺和酸的水溶液。 在优选的实施方案中，本发明的微蚀刻溶液还包含卤离子源如氯化钠或盐酸。
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公开(公告)号：US08524540B2
公开(公告)日：2013-09-03
申请号：US13018668
申请日：2011-02-01
申请人： Nilesh Kapadia
发明人： Nilesh Kapadia
CPC分类号： C09D5/00 , C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C09K13/06 , C23F1/18 , H01L23/3142 , H01L23/49586 , H01L2924/0002 , H05K3/383 , H05K2203/122 , H05K2203/124 , H01L2924/00
摘要： A process for increasing the adhesion of a polymeric material to a metal surface, the process comprising contacting the metal surface with an adhesion promoting composition comprising: 1) an oxidizer; 2) an inorganic acid; 3) a corrosion inhibitor; and 4) an organic phosphonate; and thereafter b) bonding the polymeric material to the metal surface. The organic phosphonate aids in stabilizing the oxidizer and organic components present in the bath and prevents decomposition of the components, thereby increasing the working life of the bath, especially when used with copper alloys having a high iron content.
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