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1.发明授权公开(公告)号：US08512504B2
公开(公告)日：2013-08-20
申请号：US12436260
申请日：2009-05-06
申请人： Steven A. Castaldi , Kesheng Feng
发明人： Steven A. Castaldi , Kesheng Feng
IPC分类号： B29C65/00
CPC分类号： C23C22/52 , B05D3/102 , B05D2202/45 , C23C22/83 , C23F1/18 , H05K3/383 , H05K2203/0796 , H05K2203/124 , Y10T156/10
摘要： A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an aqueous acid post-dip composition to provide a micro-roughened surface. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
摘要翻译： 一种用于处理金属表面的方法，其包括首先使金属表面与特定的酸性过氧化物粘附促进组合物接触，然后使该金属表面与酸性浸渍后组合物接触以提供微粗糙表面。 这种处理特别适用于处理印刷电路多层结构中使用的金属表面。
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公开(公告)号：US20110021023A1
公开(公告)日：2011-01-27
申请号：US12509619
申请日：2009-07-27
申请人： Adam Letize , Andrew M. Krol , Ernest Long , Steven A. Castaldi
发明人： Adam Letize , Andrew M. Krol , Ernest Long , Steven A. Castaldi
IPC分类号： H01L21/3205
CPC分类号： H01L31/02168 , H01L21/3105 , H01L21/31144 , H01L31/022425 , Y02E10/50
摘要： A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
摘要翻译： 描述了在其上具有抗反射层的硅半导体衬底上形成抗蚀剂图案的方法。 该方法包括以下步骤：a）用化学处理组合物改性抗反射表面的表面能，b）对经处理的抗反射表面施加UV蚀刻抗蚀剂，和c）将抗反射表面暴露于湿 化学蚀刻剂组成以去除抗反射表面的暴露区域。 此后，可以将衬底金属化以提供导体图案。 该方法可用于生产硅太阳能电池。
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3.发明申请Composition and method for controlling galvanic corrosion in printed circuit boards 审中-公开用于控制印刷电路板中电偶腐蚀的组成和方法公开(公告)号：US20090123656A1
公开(公告)日：2009-05-14
申请号：US11983982
申请日：2007-11-13
CPC分类号： H05K3/282 , B23K35/3613 , C23C22/40 , C23F11/10 , C23F11/161 , C23F11/173 , H05K2203/121 , H05K2203/122
摘要： A composition for inhibiting the galvanic corrosion of printed circuit boards. The corrosion resistant coating composition may be applied to the printed circuit board to reduce corrosion and to shut down the chemical mechanism for galvanic corrosion so that corrosion protection of the product is achieved. The corrosion resistant coating composition comprises a) a mercaptan; b) an ethoxylated alcohol; and c) at least one metal species selected from the group consisting of molybdates, tungstates, vanadataes, zirconium, cobalt.
摘要翻译： 一种用于抑制印刷电路板电偶腐蚀的组合物。 可以将耐腐蚀涂料组合物施加到印刷电路板上以减少腐蚀并关闭用于电镀腐蚀的化学机构，从而实现产品的防腐蚀。 耐腐蚀涂料组合物包含：a）硫醇; b）乙氧基化醇; 和c）选自钼酸盐，钨酸盐，钒化物，锆，钴中的至少一种金属物质。
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公开(公告)号：US4804615A
公开(公告)日：1989-02-14
申请号：US903837
申请日：1986-09-03
CPC分类号： H05K3/427 , H05K3/243 , H05K3/3473 , H05K2201/09736 , H05K2203/043 , H05K3/064 , H05K3/244 , H05K3/28 , H05K3/3452
摘要： Printed circuit boards having solder coated pads and through-holes and bare copper traces protected by a directly applied solder mask or by a coating of non-reflowable metal and a solder mask thereover, are manufactured by a process which avoids the need for tin-lead stripping and the need for separate application and leveling of molten solder. In the preferred process, liquid resists are applied to circuit boards having tin-lead over copper plated holes and pads so as to define and etch-protect bare copper traces of desired pattern circuitry (as well as other desired configurations). Copper areas other than those protected by the etch-resist and tin-lead plating are etched away, the etch-resist removed and solder mask applied over the bare copper traces or other desired bare copper areas or, alternatively, to bare copper first coated with a non-reflowable metal. The tin-lead plating is then preferably reflowed and solidified to provide the pads and through-holes with solder coating.
摘要翻译： 具有焊接涂层焊盘和通孔的裸电路板和由直接施加的焊接掩模或不可回流金属涂层和其上的焊接掩模保护的裸铜迹线通过避免对锡铅的需要的工艺来制造 剥离和熔融焊料的单独应用和调平的需要。 在优选的方法中，将液体抗蚀剂施加到具有镀锡孔和焊盘上的锡铅的电路板，以便限定和蚀刻保护所需图案电路的裸铜迹线（以及其它期望的配置）。 除了由抗蚀剂和锡铅电镀保护的铜区域之外，铜层被去除，将蚀刻抗蚀剂去除，并将焊接掩模施加在裸铜迹线或其他所需的裸铜区域上，或者替代地，裸露的铜首先被涂覆 不可回流的金属。 然后优选将锡铅镀层回流并固化，以提供具有焊料涂层的焊盘和通孔。
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公开(公告)号：US20110186221A1
公开(公告)日：2011-08-04
申请号：US12697425
申请日：2010-02-01
申请人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
发明人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
CPC分类号： B32B7/12 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/205 , B32B2255/24 , B32B2307/50 , B32B2307/732 , B32B2457/08 , C23C22/63 , C23C22/78 , C23C22/83 , H05K3/385 , H05K3/388 , H05K2203/0315
摘要： A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
摘要翻译： 提高铜或铜合金层与聚合物树脂之间粘合力的方法。 该方法包括以下步骤：a）将预浸组合物施加到铜层; b）向经处理的铜层施加纳米氧化物组合物，c）将浸渍后组合物施加到纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。 纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （iv）有机硝基化合物; 和（v）硫代化合物。 浸渍后组合物是碱性溶液，其包含（i）磷酸盐; （ii）钼离子源; 和（iii）噻唑。 本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。
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公开(公告)号：US20090294294A1
公开(公告)日：2009-12-03
申请号：US12156613
申请日：2008-06-03
IPC分类号： C25D5/02
CPC分类号： H05K3/383 , C23F1/18 , C23F11/184 , H05K3/385 , H05K2203/0796 , H05K2203/124
摘要： A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.
摘要翻译： 一种用于在制造多层印刷电路板中提供对铜表面的耐酸性的组合物。 组合物包含酸，氧化剂，五元杂环化合物和硫代磷酸酯或硫化磷化合物。 在优选的实施方案中，磷化合物是五硫化二磷。 将组合物施加到铜或铜合金基底上，然后将铜基底结合到聚合物材料上。
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公开(公告)号：US20080264900A1
公开(公告)日：2008-10-30
申请号：US11796660
申请日：2007-04-27
申请人： Kesheng Feng , Ming De Wang , Steven A. Castaldi
发明人： Kesheng Feng , Ming De Wang , Steven A. Castaldi
CPC分类号： C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C23C22/40 , C23C22/52 , C23F1/18 , H05K3/383 , H05K2203/0796 , H05K2203/124
摘要： A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile)polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for thermal stability. The polymer of the invention may be added to compositions containing for example, cupric chloride and hydrochloric acid and is also usable in compositions containing an oxidizer/acid/azole mixture. Other additives, such as adiponitrile may also be beneficially added to compositions of the invention.
摘要翻译： 描述了一种用于使用聚（乙烯基氨基丙腈）聚合物作为组合物中的添加剂的粗糙化组合物处理金属表面以改善聚合物材料与金属表面的粘合性并提高热稳定性的剥离强度的方法。 本发明的聚合物可以加入含有例如氯化铜和盐酸的组合物中，也可用于含有氧化剂/酸/唑混合物的组合物中。 其它添加剂，例如己二腈也可有利地加入到本发明的组合物中。
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公开(公告)号：US08308893B2
公开(公告)日：2012-11-13
申请号：US12697425
申请日：2010-02-01
申请人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
发明人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
CPC分类号： B32B7/12 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/205 , B32B2255/24 , B32B2307/50 , B32B2307/732 , B32B2457/08 , C23C22/63 , C23C22/78 , C23C22/83 , H05K3/385 , H05K3/388 , H05K2203/0315
摘要： A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
摘要翻译： 提高铜或铜合金层与聚合物树脂之间粘合力的方法。 该方法包括以下步骤：a）将预浸组合物施加到铜层; b）向经处理的铜层施加纳米氧化物组合物，c）将浸渍后组合物施加到纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。 纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （iv）有机硝基化合物; 和（v）硫代化合物。 浸渍后组合物是碱性溶液，其包含（i）磷酸盐; （ii）钼离子源; 和（iii）噻唑。 本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。
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公开(公告)号：US07989346B2
公开(公告)日：2011-08-02
申请号：US12509619
申请日：2009-07-27
申请人： Adam Letize , Andrew M. Krol , Ernest Long , Steven A. Castaldi
发明人： Adam Letize , Andrew M. Krol , Ernest Long , Steven A. Castaldi
IPC分类号： H01L21/44
CPC分类号： H01L31/02168 , H01L21/3105 , H01L21/31144 , H01L31/022425 , Y02E10/50
摘要： A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
摘要翻译： 描述了在其上具有抗反射层的硅半导体衬底上形成抗蚀剂图案的方法。 该方法包括以下步骤：a）用化学处理组合物改性抗反射表面的表面能，b）对经处理的抗反射表面施加UV蚀刻抗蚀剂，和c）将抗反射表面暴露于湿 化学蚀刻剂组成以去除抗反射表面的暴露区域。 此后，可以将衬底金属化以提供导体图案。 该方法可用于生产硅太阳能电池。
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公开(公告)号：US07875558B2
公开(公告)日：2011-01-25
申请号：US11893068
申请日：2007-08-14
申请人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
CPC分类号： C23F1/18 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤素离子源的微蚀刻组合物。 其它添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后粘合 聚合物材料到铜或铜合金表面。
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